公开(公告)号：US12125726B2

公开(公告)日：2024-10-22

申请号：US17657799

申请日：2022-04-04

申请人： CHANGXIN MEMORY TECHNOLOGIES, INC.

发明人： Chuang Shan ,  Xiaoling Wang

IPC分类号： H01L21/673

CPC分类号： H01L21/67359 ,  H01L21/67376 ,  H01L21/67386 ,  H01L21/67393

摘要： The present disclosure relates to the technical field of semiconductors, and provides a mask pod and a semiconductor device. The mask pod includes: a body, wherein the body has an accommodation space configured to accommodate a mask, the accommodation space has a first opening, and the first opening is located on a circumferential side of the body; and a shielding member, wherein the shielding member is provided on the body and is movably provided relative to the body, to shield or release the first opening.

公开(公告)号：US20240347359A1

公开(公告)日：2024-10-17

申请号：US18298503

申请日：2023-04-11

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： CHI JIA WANG ,  CHI-CHUNG JEN ,  KAI-HUNG HSIAO ,  HUI AN LI ,  WEN-CHIH CHIANG

IPC分类号： H01L21/673 ,  G02F1/1334 ,  G06T7/00 ,  H01L21/67

CPC分类号： H01L21/67386 ,  G02F1/1334 ,  G06T7/001 ,  H01L21/67288 ,  G06T2207/30148 ,  H01L21/67733

摘要： A method includes: receiving at least one semiconductor wafer to a wafer carrier, wherein the wafer carrier has an inspection window arranged on a side of the wafer carrier; transporting the wafer carrier between a plurality of semiconductor tools; and in response to an emergent event, switching the inspection window to a transparent mode for a predetermined period.

公开(公告)号：US20240347358A1

公开(公告)日：2024-10-17

申请号：US18608524

申请日：2024-03-18

申请人： Viavi Solutions Suzhou Co., Ltd.

发明人： Liang ZHOU ,  Ling LIU

IPC分类号： H01L21/673

CPC分类号： H01L21/67353

摘要： In some implementations, a cover for a wafer that is on a wafer frame includes a top portion configured to span an entirety of a top surface of the wafer; and a side portion configured to span an entirety of a side surface of the wafer, wherein the side portion extends at a non-zero angle from the top portion to allow the cover to enclose the wafer on the wafer frame. In some implementations, a carrier for a wafer includes the wafer, the wafer frame, and the cover.

公开(公告)号：US20240339553A1

公开(公告)日：2024-10-10

申请号：US18297352

申请日：2023-04-07

申请人： Solaires Entreprises Inc.

发明人： Alfonso Fabian de la Fuente Sanchez ,  Mahsid SAM ,  Furui TAN ,  Chen DONG ,  Wanlong WANG ,  Yuhao SONG

IPC分类号： H01L31/18 ,  H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L31/18 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67326 ,  H01L21/67766

摘要： A system for manufacturing thin-film devices is provided, the system comprising: a computing device; robotic arm or conveyor system; holder which is configured to retain a first substrate; dispenser which configured to dispense a solution onto an upper surface of the first substrate; an X-Y press, which includes a base, a vertically disposed member which is attached to the base, a horizontal arm which is moveably attached to the vertically disposed member, a vertical actuator which is configured to urge the horizontal arm up and down and is attached to the vertically disposed member, a horizontal actuator which is attached to the horizontal arm, a block which is attached to the horizontal actuator, wherein the horizontal actuator is configured to urge the block horizontally; and a dryer, wherein the robotic arm or the conveyor system, the dispenser, the X-Y press and the dryer are under control of the computing device.

公开(公告)号：US12112958B2

公开(公告)日：2024-10-08

申请号：US18520647

申请日：2023-11-28

申请人： HIGHLIGHT TECH CORP.

发明人： Chwung-Shan Kou ,  Chien-Cheng Chang ,  Chia-Ou Chang

IPC分类号： H01L21/304 ,  H01L21/67 ,  H01L21/673

CPC分类号： H01L21/67028 ,  H01L21/67 ,  H01L21/673 ,  H01L21/304

摘要： Disclosed is a wafer processing system comprising a processing tank, a cleaning device and a drying device. The processing tank has a cantilever rotating device and a dynamic balance correction device. The cantilever rotating device has a holding part for holding a wafer of a variety of specification parameters and causing the wafer to rotate along a rotating shaft of the cantilever rotating device. The dynamic balance correction device performs a corresponding dynamic balance correction on the cantilever rotating device, so that the cantilever rotating device is in a dynamic balance state during rotation. A dynamic nozzle unit of the cleaning device ejects a cleaning fluid to clean the rotating wafer. The drying device is used to dry the rotating wafer.

公开(公告)号：US20240332049A1

公开(公告)日：2024-10-03

申请号：US18743774

申请日：2024-06-14

申请人： AU Optronics Corporation

发明人： Wei-Chieh CHEN ,  Kuan-Yi LEE ,  Wen-Hsien TSENG

IPC分类号： H01L21/673 ,  H01L21/67 ,  H01L21/68 ,  H01L25/075 ,  H01L33/00

CPC分类号： H01L21/67326 ,  H01L21/67115 ,  H01L21/68 ,  H01L25/0753 ,  H01L33/005 ,  H01L2221/68313 ,  H01L2221/68372

摘要： A device of mass transferring chips includes a first substrate, which includes a chip-connecting area configured to connect a chip. The device further includes a second substrate, which includes a support layer and a first adhesive layer. The chip is between the first substrate and the second substrate. The first adhesive layer includes a first surface, a second surface, and a patterned recess. The first surface has a chip-receiving area configured to attach the chip from the first substrate. The second surface is opposite to the first surface and is in contact with a first side of the support layer. The patterned recess is disposed on the first surface and spaced apart from the chip-receiving area.

公开(公告)号：US12106988B2

公开(公告)日：2024-10-01

申请号：US17651718

申请日：2022-02-18

申请人： Daewon Semiconductor Packaging Industrial Company

发明人： Sunna Chung ,  Ryan Park ,  Jin Chae ,  Matthew Stanton Whitlock ,  Jonathan Kevin Lie ,  Athens Okoren

IPC分类号： B65D85/48 ,  H01L21/673

CPC分类号： H01L21/67383 ,  H01L21/67346 ,  H01L21/67366 ,  H01L21/67373 ,  H01L21/67326

摘要： Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

公开(公告)号：US20240304479A1

公开(公告)日：2024-09-12

申请号：US18369784

申请日：2023-09-18

申请人： Diodes Incorporated

发明人： WanHui Li ,  JiaWei Tai

IPC分类号： H01L21/67 ,  H01L21/673

CPC分类号： H01L21/67276 ,  H01L21/67333

摘要： A method for calibrating a tray shield used for holding a wafer for processing is provided. The tray shield is in a ring shape. The method includes determining whether a first calibration ring is placeable into an inner chamber of the tray shield. When the first calibration ring is placeable into the inner chamber, the tray shield is determined to be usable for wafer processing. The first calibration ring is moved around inside the inner chamber to remove metal particles or burrs on the inner chamber, and thereafter, a wafer is loaded in the inner chamber. When the first calibration ring is not placeable into the inner chamber, the tray shield may be discarded. The method may also include assembling the tray shield utilizing a second calibration ring having an outer diameter equal to an inner diameter of the ring shape.

公开(公告)号：US20240304477A1

公开(公告)日：2024-09-12

申请号：US18595668

申请日：2024-03-05

申请人： ASM IP Holding B.V.

发明人： Gido van der Star ,  Bert Jongbloed

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67265 ,  H01L21/67389 ,  H01L21/6773

摘要： Aspects of the disclosure relate to a substrate processing system having a controlled environment comprising one or more FOUPs configured to hold one or more substrates, a substrate processing chamber configured to process the substrate(s), a substrate handling and transporting system configured to receive the FOUP(s) and transfer the substrate(s) to and from the substrate processing chamber, an environmental sensor configured to measure one or more environmental parameters of the substrate handling and transporting system, and a controller communicatively coupled to the environmental sensor configured to track one or more positions of the substrate(s) within the substrate handling and transporting system, determine one or more environmental parameters of the substrate handling and transporting system, determine whether the environmental parameter(s) are within threshold limits at the one or more position of the substrate(s), and indicate an alert if the environmental parameter(s) are determined to not be within the threshold limits.

公开(公告)号：US12085124B2

公开(公告)日：2024-09-10

申请号：US17918223

申请日：2022-08-09

申请人： ZHICHENG SEMICONDUCTOR EQUIPMENT TECHNOLOGY (KUNSHAN) CO., LTD.

发明人： Bin Hua ,  Xianmiao Sun ,  Xinyu Shi ,  Wenxuan Li

IPC分类号： H01L21/67 ,  F16C19/36 ,  H01L21/673

CPC分类号： F16C19/36 ,  H01L21/67057 ,  H01L21/67326

摘要： A bearing assembly includes a bearing cantilever, a supporting assembly connected to the bearing cantilever and a first driving device, where the bearing cantilever includes a bearing portion for bearing the semiconductor apparatus accommodating device, a connecting plate and a substrate, the bearing portion being composed of a bearing plate and a bearing support that are horizontally inserted, an opening for exposing a semiconductor apparatus is formed at a bottom of the semiconductor apparatus accommodating device, the bearing plate is provided with a rotatable rotating roller located below the opening, the rotating roller makes contact with an edge of the semiconductor apparatus, and the first driving device drives the rotating roller to rotate by means of a power transmission member, so as to apply a rotating force by means of the rotating roller, to an edge of the semiconductor apparatus inserted into the semiconductor apparatus accommodating device.