公开(公告)号：US12112958B2

公开(公告)日：2024-10-08

申请号：US18520647

申请日：2023-11-28

申请人： HIGHLIGHT TECH CORP.

发明人： Chwung-Shan Kou ,  Chien-Cheng Chang ,  Chia-Ou Chang

IPC分类号： H01L21/304 ,  H01L21/67 ,  H01L21/673

CPC分类号： H01L21/67028 ,  H01L21/67 ,  H01L21/673 ,  H01L21/304

摘要： Disclosed is a wafer processing system comprising a processing tank, a cleaning device and a drying device. The processing tank has a cantilever rotating device and a dynamic balance correction device. The cantilever rotating device has a holding part for holding a wafer of a variety of specification parameters and causing the wafer to rotate along a rotating shaft of the cantilever rotating device. The dynamic balance correction device performs a corresponding dynamic balance correction on the cantilever rotating device, so that the cantilever rotating device is in a dynamic balance state during rotation. A dynamic nozzle unit of the cleaning device ejects a cleaning fluid to clean the rotating wafer. The drying device is used to dry the rotating wafer.