公开(公告)号：US20240087932A1

公开(公告)日：2024-03-14

申请号：US18514268

申请日：2023-11-20

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Tzu-Chung TSAI ,  Ping-Cheng KO ,  Fang-yu LIU ,  Jhih-Yuan YANG

IPC分类号： H01L21/673 ,  B29C45/72 ,  B29C45/73 ,  B29C45/74 ,  B29C45/78

CPC分类号： H01L21/67386 ,  B29C45/7207 ,  B29C45/73 ,  B29C45/74 ,  B29C45/78 ,  H01L21/67366 ,  H01L21/67369 ,  H01L21/67373 ,  H01L21/67396 ,  B29L2031/712

摘要： An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.

公开(公告)号：US20170137589A1

公开(公告)日：2017-05-18

申请号：US15054122

申请日：2016-02-25

申请人： Samsung Electronics Co., Ltd.

发明人： Cesar M. GARZA ,  Sungil AHN

IPC分类号： C08J7/12 ,  B01D67/00 ,  H01L21/673

CPC分类号： C08J7/126 ,  B01D67/0093 ,  B01D71/26 ,  B01D71/32 ,  B01D2323/36 ,  B01D2323/46 ,  C08J2323/06 ,  C08J2323/12 ,  C08J2369/00 ,  C08J2377/00 ,  C08J2377/06 ,  H01L21/67366

摘要： Methods are disclosed for modifying surfaces of a structure used in manufacturing semiconductor devices wherein the structures are formed from organic polymers. In addition to the surface of the structure, which is over a core, a portion of the structure slightly below the surface is also modified via fluorination of the organic polymer. The fluorination is achieved by exposing the structure to a mixture of gases including fluorine in a range from about 0.01% to about 10% and inert gas comprising a remainder of the mixture of gases. Fluorination occurs from the surface into the core to a depth of no more than about 1 micron and such that a portion of the core below more than 1 micron from the surface is not fluorinated.

公开(公告)号：US08286797B2

公开(公告)日：2012-10-16

申请号：US13436812

申请日：2012-03-30

申请人： James D. Pylant ,  Alan L. Waber

发明人： James D. Pylant ,  Alan L. Waber

IPC分类号： B65D85/30

CPC分类号： H01L21/67386 ,  H01L21/67353 ,  H01L21/67366 ,  H01L21/67369 ,  H01L21/67373 ,  H01L21/67379

摘要： Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.

摘要翻译： 半导体晶片容器的改进，包括对晶片的侧面保护的改进，改进的盖设计以使旋转最小化，简化的顶盖定向机构和用于自动化的改进的底部保持机构。 对晶片的侧面保护是具有多个交错的内壁和外壁。 改进的盖设计改善了顶部和底部壳体的对准，并最大限度地减少了运输或运动中壳体的旋转。 这些外壳具有带双向锁定的凹陷突出部斜面特征，当两个壳体组装时，这也增加了容纳装置的刚度。 用于自动化的改进的底部保持机构是模制到底部壳体中并且未组装在二次操作中的集成特征。 模制集成减少了组装多个零件并连接多个零件时出现的公差错误。

公开(公告)号：US20120187024A1

公开(公告)日：2012-07-26

申请号：US13436812

申请日：2012-03-30

申请人： James D. PYLANT ,  Alan L. WABER

发明人： James D. PYLANT ,  Alan L. WABER

IPC分类号： H01L21/67 ,  B65D85/00

CPC分类号： H01L21/67386 ,  H01L21/67353 ,  H01L21/67366 ,  H01L21/67369 ,  H01L21/67373 ,  H01L21/67379

摘要： Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.

摘要翻译： 半导体晶片容器的改进，包括对晶片的侧面保护的改进，改进的盖设计以使旋转最小化，简化的顶盖定向机构和用于自动化的改进的底部保持机构。 对晶片的侧面保护是具有多个交错的内壁和外壁。 改进的盖设计改善了顶部和底部壳体的对准，并最大限度地减少了运输或运动中壳体的旋转。 这些外壳具有带双向锁定的凹陷突出部斜面特征，当两个壳体组装时，这也增加了容纳装置的刚度。 用于自动化的改进的底部保持机构是模制到底部壳体中并且未组装在二次操作中的集成特征。 模制集成减少了组装多个零件并连接多个零件时出现的公差错误。

公开(公告)号：US08109390B2

公开(公告)日：2012-02-07

申请号：US12548368

申请日：2009-08-26

申请人： James D Pylant ,  Alan L Waber

发明人： James D Pylant ,  Alan L Waber

IPC分类号： B65D85/30

CPC分类号： H01L21/67386 ,  H01L21/67353 ,  H01L21/67366 ,  H01L21/67369 ,  H01L21/67373 ,  H01L21/67379

摘要： Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation. The molded integration reduces tolerance errors that are present in assembling multiple pieces and joining multiple pieces.

摘要翻译： 半导体晶片容器的改进，包括对晶片的侧面保护的改进，改进的盖设计以使旋转最小化，简化的顶盖定向机构和用于自动化的改进的底部保持机构。 对晶片的侧面保护是具有多个交错的内壁和外壁。 改进的盖设计改善了顶部和底部壳体的对准，并最大限度地减少了运输或运动中壳体的旋转。 这些外壳具有带双向锁定的凹陷突出部斜面特征，当两个壳体组装时，这也增加了容纳装置的刚度。 用于自动化的改进的底部保持机构是模制到底部壳体中并且未组装在二次操作中的集成特征。 模制集成减少了组装多个零件并连接多个零件时出现的公差错误。

公开(公告)号：US20110079539A1

公开(公告)日：2011-04-07

申请号：US12899965

申请日：2010-10-07

申请人： Toshiyuki Kamada ,  Hidehiro Masuko

发明人： Toshiyuki Kamada ,  Hidehiro Masuko

IPC分类号： B65D85/00

CPC分类号： H01L21/67386 ,  H01L21/67366 ,  H01L21/67373

摘要： A wafer storage container including a container body having an opening adapted to store wafers is disclosed. The container body includes a window and wafer support parts. Delivery components are attached to the exterior face part of the container body. The delivery components includes a bottom plate disposed at a bottom of the container body, a pair of side handles disposed at both sides of the container body, and a robotic flange disposed at a top of the container body. The container further is provided with a lid adapted to seal the opening of the container body. The lid includes a lid main body, a pair of latch mechanism disposed within the lid main body, a retainer member disposed at an inner surface of the lid main body, a seal gasket member disposed at a periphery of the lid main body such that it contacts a periphery of an opening part of the container body and a lid cover. The container body, the delivery components and the lid main body are formed of a self-extinguishing material, and the latch mechanism and the retainer member are formed of PEEK, and the gasket member is formed of elastomeric resin.

摘要翻译： 公开了一种具有适于存储晶片的开口的容器本体的晶片储存容器。 容器主体包括窗口和晶片支撑部件。 输送部件附接到容器主体的外表面部分。 输送部件包括设置在容器主体的底部的底板，设置在容器主体两侧的一对侧手柄和设置在容器主体顶部的机器人凸缘。 容器还设置有适于密封容器主体的开口的盖子。 该盖包括盖主体，设置在盖主体内的一对闩锁机构，设置在盖主体内表面的保持构件，设置在盖主体周边的密封垫片构件， 接触容器主体的开口部分的周边和盖罩。 容器主体，输送部件和盖主体由自熄灭材料形成，并且闩锁机构和保持器部件由PEEK形成，垫圈部件由弹性体树脂形成。

公开(公告)号：US20100236970A1

公开(公告)日：2010-09-23

申请号：US12777936

申请日：2010-05-11

申请人： Sanjiv M. BHATT ,  Shawn D. Eggum

发明人： Sanjiv M. BHATT ,  Shawn D. Eggum

IPC分类号： B65D85/84 ,  B29C45/16

CPC分类号： B29C45/0003 ,  B29C45/16 ,  B29K2995/0087 ,  B29L2031/16 ,  G03F7/70691 ,  G03F7/708 ,  H01L21/67313 ,  H01L21/6732 ,  H01L21/67326 ,  H01L21/67366 ,  H01L21/67373 ,  H01L21/67383

摘要： A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

摘要翻译： 根据本发明实施例的复合晶片载体包括由第一热塑性材料形成的操作部分和由第二不同热塑性材料形成的支撑部分。 其中一个操作部分和支撑部分被包覆模制在另一个上，以形成将这些部分牢固地结合在一起的无间隙的密封界面。 操作部分可以是透明窗口，闩锁机构的一部分或晶片接触部分。 本发明的优选实施例包括具有所述特征的晶片载体，具有所述特征的工艺载体和用于制造具有所述特征的晶片载体的工艺。

公开(公告)号：US07368020B2

公开(公告)日：2008-05-06

申请号：US10818311

申请日：2004-04-05

申请人： Giang T. Dao ,  Ronald J. Kuse

发明人： Giang T. Dao ,  Ronald J. Kuse

IPC分类号： B08B7/04

CPC分类号： H01L21/67359 ,  G03F1/62 ,  G03F1/66 ,  G03F7/70741 ,  G03F7/70916 ,  G03F7/70925 ,  G03F7/70983 ,  H01L21/67366 ,  H01L21/67393

摘要： A method of transporting a reticle is disclosed. The reticle is placed in a reticle carrier that has an ionizer. Moreover, the reticle may be attached with a pellicle. The pellicle consists of a pellicle frame and a pellicle film stretched over the pellicle frame. The pellicle frame has included within an absorbent material.

摘要翻译： 公开了传送掩模版的方法。 将掩模版放置在具有电离器的掩模版载体中。 此外，掩模版可以附着防护薄膜组件。 防护薄膜组件由防护薄膜组件框架和在防护薄膜框架上延伸的防护薄膜组成。 防护薄膜框架包括在吸收材料内。

公开(公告)号：US20080041758A1

公开(公告)日：2008-02-21

申请号：US11504594

申请日：2006-08-16

申请人： Yen-Fei Lin ,  Hui-Wen Chou ,  Wen-Yu Ku ,  Pu-Fang Chen ,  Tung-Li Lee ,  Jih-Hwa Wang

发明人： Yen-Fei Lin ,  Hui-Wen Chou ,  Wen-Yu Ku ,  Pu-Fang Chen ,  Tung-Li Lee ,  Jih-Hwa Wang

IPC分类号： B65D85/00

CPC分类号： H01L21/67366 ,  H01L21/67393

摘要： A wafer carrier. The wafer carrier includes a container and a plate, wherein the container has an inner wall and the plate is disposed in the vicinity of the inner wall of an upper portion of the container.

摘要翻译： 晶圆载体。 晶片载体包括容器和板，其中所述容器具有内壁，并且所述板设置在所述容器的上部的内壁附近。

公开(公告)号：US20060292749A1

公开(公告)日：2006-12-28

申请号：US11484887

申请日：2006-07-11

申请人： John Burns ,  Matthew Fuller ,  Jeffery King ,  Martin Forbes ,  Mark Smith

发明人： John Burns ,  Matthew Fuller ,  Jeffery King ,  Martin Forbes ,  Mark Smith

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L21/67288 ,  B65D79/02 ,  G03F1/66 ,  H01L21/67366

摘要： A semiconductor wafer, substrate, or reticle storage or shipping device that includes a photochromic indicator of exposure to undesired electromagnetic radiation. The present invention includes the incorporation of a photochromic material into the plastic used to fabricate at least a portion of a semiconductor wafer, disk, or reticle shipping or storage containers. The container may include photochromic material in the form of a transparent window or a larger portion of the container. the photochromic material may change color or darkness in response to exposure to a selected range of wavelengths of light.

摘要翻译： 包括暴露于不期望的电磁辐射的光致变色指示剂的半导体晶片，衬底或掩模版存储或运输装置。 本发明包括将光致变色材料结合到用于制造半导体晶片，盘或掩模版运输或存储容器的至少一部分的塑料中。 容器可以包括透明窗口形式的光致变色材料或容器的较大部分。 响应于暴露于所选择的光波长范围，光致变色材料可以改变颜色或黑暗。