公开(公告)号：US20240242992A1

公开(公告)日：2024-07-18

申请号：US18623772

申请日：2024-04-01

申请人： Bum Je Woo ,  PICO & TERA CO., LTD.

发明人： Bum Je WOO

IPC分类号： H01L21/673

CPC分类号： H01L21/67393 ,  H01L21/6732 ,  H01L21/67386

摘要： A wafer storage container is connected to an external chamber and has a storage chamber in which wafers received through a front opening are accommodated. The wafer storage container includes a fume removal unit that injects a first gas into the storage chamber and exhausts the first gas, and an outside air blocking unit that injects a second gas from a left side of the front opening and exhausts the second gas from a right side of the front opening.

公开(公告)号：US11972962B2

公开(公告)日：2024-04-30

申请号：US17398685

申请日：2021-08-10

申请人： DLY TECHNOLOGIES INC.

发明人： Shih Feng Pan

IPC分类号： H01L21/673 ,  H01L21/677

CPC分类号： H01L21/6732 ,  H01L21/67379 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67781

摘要： The disclosure provides an adjustable device including plates and at least two adjustable modules connect with two adjacent of the plates. The adjustable module can stretch or shrink to change a distance between plates. The disclosure also provides an adjustable storage box including an upper cover and a lower cover. A storage space is formed by the upper cover and the lower cover and for the accommodating of the adjustable device. When the upper cover moves upward relative to the lower cover, the adjustable modules changes from a compression state to a stretch state and increase a distance between plates. Whereby, it is easy to pick and place object when a distance of two adjacent plates increases. The overall volume of the adjustable device is reduced when a distance of two adjacent plates decrease, thereby saving the working space.

公开(公告)号：US11752582B1

公开(公告)日：2023-09-12

申请号：US17671795

申请日：2022-02-15

申请人： Taiwan Semiconductor Manufacturing Company

发明人： Yu-Chen Chen ,  Chih-Hung Huang ,  Cheng-Lung Wu ,  Yang-Ann Chu ,  Jiun-Rong Pai

IPC分类号： B23P19/06 ,  H01L21/673 ,  B25J15/00 ,  B25B23/10

CPC分类号： B23P19/06 ,  B25B23/10 ,  B25J15/0019 ,  H01L21/6732 ,  Y10T29/49819

摘要： The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener from the pod, and the fastener head is received within the lower sleeve.

公开(公告)号：US20180068879A1

公开(公告)日：2018-03-08

申请号：US15676613

申请日：2017-08-14

申请人： Lam Research Corporation

发明人： Scott Wong ,  Damon Tyrone Genetti ,  Derek John Witkowicki ,  Alex Paterson ,  Richard H. Gould ,  Austin Ngo ,  Marc Estoque

IPC分类号： H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  H01L21/673

CPC分类号： H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67303 ,  H01L21/6732 ,  H01L21/67369 ,  H01L21/67379 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67389 ,  H01L21/67742 ,  H01L21/68707

摘要： A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first support column is disposed on the first lateral side proximal to the front side. A second support column is disposed on the second lateral side proximal to the front side. A third support column is disposed on the first lateral side proximal to back side and a fourth support column is disposed on the second lateral side proximal to the back side. Each of the support columns includes a plurality of support fingers distributed lengthwise and directed inward. A first hard stop column is disposed parallel to the third support column and a second hard stop column is disposed parallel to the fourth support column. A shell structure connected to the base plate is configured to enclose the first, second third and fourth support columns, top plate and first and second hard stop columns and includes a front opening disposed on the front side of the base plate. A door is mated to the front opening and includes retention assembly for securing consumable parts in the pod, when received in the pod.

公开(公告)号：US09773691B2

公开(公告)日：2017-09-26

申请号：US14410532

申请日：2013-06-10

申请人： KAWASAKI JUKOGYO KABUSHIKI KAISHA

发明人： Kenji Bando ,  Takuya Fukuda ,  Soichi Tamada

IPC分类号： H01L21/67 ,  H01L21/677 ,  B65G19/02 ,  B65G49/06 ,  H01L21/673

CPC分类号： H01L21/67778 ,  B65G19/02 ,  B65G49/065 ,  H01L21/6732 ,  H01L21/67706 ,  H01L21/67769 ,  H01L21/67784

摘要： A substrate conveying system includes a substrate supply unit including a movable rack and an up-down unit which moves the movable rack down, a lift unit which has one or more ejection holes which eject a gas upward and is configured to lift-up the substrate supported on the movable rack by the pressure of the gas ejected through ejection holes when the up-down unit moves the movable rack down, and a conveying unit which includes a conveyor, and hook elements extending upward from the conveyor, and is configured to push in a conveying direction the substrate W being lifted-up by the pressure of the gas ejected through the ejection holes.

公开(公告)号：US09666454B2

公开(公告)日：2017-05-30

申请号：US14579609

申请日：2014-12-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： In-Ho Choi ,  Young-Suk Sim

IPC分类号： H01L21/67 ,  H01L21/673

CPC分类号： H01L21/67017 ,  H01L21/67309 ,  H01L21/6732 ,  Y10T29/49826

摘要： A wafer storage apparatus includes a wafer stacking portion that encloses an internal space with an open front side for receiving a plurality of wafers; a rear cover portion disposed on the back side of the wafer stacking portion; and a gas charging portion that includes a plurality of gas supply blocks disposed on the inner side of the rear cover portion, a plurality of gas supply pipes connected to the gas supply blocks via through holes in the rear cover portion, and a gas supply unit connected to the gas supply pipes.

公开(公告)号：US20170110351A1

公开(公告)日：2017-04-20

申请号：US14887959

申请日：2015-10-20

申请人： Lam Research Corporation

发明人： David Trussell ,  Richard Gould ,  John Daugherty

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67201 ,  H01L21/67063 ,  H01L21/67161 ,  H01L21/67207 ,  H01L21/6732 ,  H01L21/67727 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67757 ,  H01L21/67766

摘要： A load lock assembly includes a first load lock connected between an equipment front end module (EFEM) and a wafer transport module, the EFEM being at a lab ambient condition, the wafer transport module being at a vacuum condition, the wafer transport module being part of a wafer transport assembly that is configured to transport wafers to and from one or more process modules that are connected to the wafer transport assembly; a second load lock disposed over the first load lock, the second load lock connected between the EFEM and the wafer transport module; a post-processing module disposed over the second load lock, the post-processing module configured for performing a post-processing operation on a processed wafer that has been processed in at least one of the process modules that are connected to the wafer transport assembly, the post-processing module being configured for connection to the wafer transport module.

公开(公告)号：US20160268148A1

公开(公告)日：2016-09-15

申请号：US14725257

申请日：2015-05-29

申请人： Bum Je WOO

发明人： Bum Je WOO

IPC分类号： H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67017 ,  H01L21/673 ,  H01L21/6732 ,  H01L21/67793

摘要： Provided are a purge gas spraying plate and a fume removing apparatus, and more particularly, a purge gas spraying plate capable of spraying a purge gas, which sprays the purge gas along a curvature of a wafer and efficiently removes fumes remaining on the wafer because a concave portion is formed at one side thereof and a spraying hole and a support member configured to support the wafer are formed in the concave portion, and a fume removing apparatus having the same.

摘要翻译： 提供了一种吹扫气体喷射板和烟雾去除装置，更具体地说，一种能够喷射吹扫气体的吹扫气体喷射板，其沿着晶片的曲率喷射吹扫气体，并有效地除去残留在晶片上的烟雾，因为 凹部形成在其一侧，并且在凹部中形成有用于支撑晶片的喷射孔和支撑构件，以及具有该凹部的除烟装置。

公开(公告)号：US20160218028A1

公开(公告)日：2016-07-28

申请号：US15001716

申请日：2016-01-20

申请人： Applied Materials, Inc.

发明人： Jason M. Schaller ,  Robert Brent Vopat ,  Paul E. Pergande ,  Benjamin B. Riordon ,  David T. Blahnik ,  William T. Weaver

IPC分类号： H01L21/673

CPC分类号： H01L21/67017 ,  H01L21/67109 ,  H01L21/6732 ,  H01L21/68742

摘要： Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.

摘要翻译： 晶片盒和使用方法为多个晶片提供加热冷却以减少处理室中的晶片切换之间的时间。 晶片支撑在晶片升降机上，其可以将所有晶片移动到一起或独立的提升销上，该提升销可移动各个晶片以进行加热和冷却。

公开(公告)号：US20150068948A1

公开(公告)日：2015-03-12

申请号：US14281880

申请日：2014-05-19

申请人： Samsung Electronics Co., Ltd.

发明人： Yi Koan HONG ,  Byung Lyul PARK ,  Jumyong PARK ,  Jisoon PARK ,  Kyu-Ha LEE ,  Siyoung CHOI

IPC分类号： H01L21/673

CPC分类号： H01L21/6733 ,  H01L21/6732 ,  H01L21/67323 ,  H01L21/67326

摘要： Embodiments of the present inventive concepts provide a wafer loader having one or more buffer zones to prevent damage to a wafer loaded in the wafer loader. The wafer loader may include a plurality of loading sections that protrude from a main body and are configured to be arranged at various locations along an edge of the wafer. Each of the loading sections may include a groove into which the edge of the wafer may be inserted. The loading section may include first and second protrusions having first and second inner sides, respectively, that face each other to define the groove therebetween. At least one of the first and second inner sides may include a recess to define the buffer zone.

摘要翻译： 本发明构思的实施例提供了具有一个或多个缓冲区的晶片装载器，以防止损坏装载在晶片装载器中的晶片。 晶片装载机可以包括从主体突出的多个装载部分，并被构造成沿着晶片的边缘布置在不同位置。 每个加载部分可以包括槽，其中可以插入晶片的边缘。 装载部分可以包括分别具有彼此面对以限定其间的凹槽的第一和第二内侧的第一和第二突起。 第一和第二内侧中的至少一个可以包括限定缓冲区的凹部。