公开(公告)号：US20240355660A1

公开(公告)日：2024-10-24

申请号：US18761592

申请日：2024-07-02

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Wei-Chih LIAO ,  Shih-Yu TSENG

IPC: H01L21/677 ,  B65G47/90 ,  H01L21/687

CPC classification number: H01L21/67742 ,  B65G47/90 ,  H01L21/67706 ,  H01L21/67745 ,  H01L21/67778 ,  H01L21/68707

Abstract: Air curtain devices can reduce defects on semiconductor wafers when implemented on a track equipped with robotic wafer transport. The air curtain devices can be added to one or more processing devices arranged along the track to prevent defects from landing on wafer surfaces. For example, the air curtain devices can prevent volatile organic solvent mist from drifting towards processing devices on the track and preventing contamination via a wafer transport system.

公开(公告)号：US20240347352A1

公开(公告)日：2024-10-17

申请号：US18683117

申请日：2022-08-15

Applicant: METRYX LTD.

Inventor： Gregor Robert ELLIOTT ,  Robert John WILBY ,  Abraham MOOSAVI ,  Sam OWENS

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67103 ,  H01L21/68707 ,  H01L21/68785

Abstract: A device for changing the temperature of a wafer, the device comprising: a surface that is configured to support the wafer and to exchange heat with the wafer, and a space that is configured to receive at least a distal part of an end effector, which is used to support the wafer from beneath, when the end effector is used to lower the wafer onto the surface, wherein the space extends from or to a side of the device; and wherein the space is configured so that the at least a distal part of the end effector can be withdrawn from the space from the side of the device.

公开(公告)号：US12115683B2

公开(公告)日：2024-10-15

申请号：US18355355

申请日：2023-07-19

Applicant: Applied Materials, Inc.

Inventor： Nicholas Michael Bergantz ,  Damon K. Cox ,  Alexander Berger

IPC: B25J9/16 ,  B65G47/90 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  B25J11/00 ,  B25J13/08

CPC classification number: B25J9/1692 ,  B65G47/905 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67259 ,  H01L21/67706 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68 ,  H01L21/68707 ,  B25J9/1697 ,  B25J11/0095 ,  B25J13/08

Abstract: A first robot arm places a calibration object into a load lock that separates a factory interface from a transfer chamber using a first taught position. A second robot arm retrieves the calibration object from the load lock using a second taught position. A controller determines, using a sensor, a first offset amount between a calibration object center of the calibration object and a pocket center of the second robot arm. The controller determines a characteristic error value that represents a misalignment between the first taught position of the first robot arm and the second taught position of the second robot arm based on the first offset amount. The first robot arm or the second robot arm uses the first characteristic error value to compensate for the misalignment for objects transferred between the first robot arm and the second robot arm via the load lock.

公开(公告)号：US20240312821A1

公开(公告)日：2024-09-19

申请号：US18670921

申请日：2024-05-22

Applicant: KABUSHIKI KAISHA YASKAWA DENKI

Inventor： Jung-ho YUN ,  Yonggu KANG ,  Mid Uem RYU ,  Hiroki SANEMASA ,  Takashi MINAMI ,  Daisuke HIGASHITARUMIZU

IPC: H01L21/68 ,  B25J9/16 ,  B65G47/90 ,  H01L21/687

CPC classification number: H01L21/681 ,  B25J9/163 ,  B65G47/905 ,  H01L21/68707

Abstract: An automatic teaching apparatus for semiconductor manufacturing equipment includes: an equipment front end module (EFEM); one or more load ports provided along an edge of one side of the EFEM to be connected to an inside of the EFEM; a transfer robot disposed in the inside of the EFEM and configured to transfer a wafer to the one or more load ports by an end effector to process the wafer, and a load port teaching unit configured to detect a fixed position of the end effector in a state of unloading the wafer such that the wafer is placed in the fixed position within the load port.

公开(公告)号：US12080586B2

公开(公告)日：2024-09-03

申请号：US17723154

申请日：2022-04-18

Applicant: T-Robotics Co., Ltd.

Inventor： Soo Jong Lee ,  Myung Jin Kim ,  Chang Seong Lee ,  Seung Young Baek ,  Chang Hyun Jee ,  Sang Hwi Ham ,  Moon Gi Hur ,  Jae Hyun Park ,  Tae Han Lee

IPC: H01L21/687

CPC classification number: H01L21/68707

Abstract: A substrate transfer robot for transferring a substrate in a vacuum chamber, includes: a transfer arm platform having coupling holes, each compartmentalized into a lower and an upper space, wherein a link connecting member with blades is engaged at a front area of the transfer arm platform and a support shaft of a lower support is inserted into the lower space of one of the coupling holes; and a first and a second transfer arm part each including an end effector for supporting the substrate, multiple transfer link arms and subordinate link arms, and a common link arm that are connected to each other or to the transfer arm platform, wherein, for each transfer arm part, drive shafts, interlocked with transfer driving motors or speed reducers installed on one of the transfer link arms, and output shafts interlocked with the drive shafts are installed on the transfer link arms.

公开(公告)号：US12080571B2

公开(公告)日：2024-09-03

申请号：US16923792

申请日：2020-07-08

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra Savandaiah ,  Srinivasa Rao Yedla ,  Thomas Brezoczky

IPC: H01L21/67 ,  C23C14/35 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67184 ,  C23C14/35 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707

Abstract: Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

公开(公告)号：US12077392B2

公开(公告)日：2024-09-03

申请号：US17315423

申请日：2021-05-10

Applicant: Tokyo Electron Limited

Inventor： Hitoshi Hashima ,  Tohru Tochihara ,  Michiaki Matsushita ,  Hidekazu Kiyama

IPC: B65G47/90 ,  G03F7/16 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687 ,  H05K9/00

CPC classification number: B65G47/90 ,  G03F7/162 ,  H01L21/67766 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/6875 ,  H05K9/0067

Abstract: A substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector. The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.

公开(公告)号：US20240258136A1

公开(公告)日：2024-08-01

申请号：US18430398

申请日：2024-02-01

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/67 ,  C23C14/35 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67184 ,  C23C14/35 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707

Abstract: Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

公开(公告)号：US20240249968A1

公开(公告)日：2024-07-25

申请号：US18626565

申请日：2024-04-04

Applicant: Tokyo Electron Limited

Inventor： Kousei IDE ,  Naruaki IIDA

IPC: H01L21/687 ,  B65G47/90 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/68707 ,  B65G47/90 ,  H01L21/67178 ,  H01L21/67712

Abstract: A substrate transfer device includes: a substrate holder configured to transfer a substrate to one of a plurality of processing modules that process the substrate; a base provided to be connected to the substrate holder; and a lift configured to move up and down the base. The lift includes: a plurality of rails and a plurality of seal belts arranged side by side in a left-right direction and extending in a longitudinal direction, a driver shared by the rails and configured to move up and down the base along an extending direction of each of the rails, a slider configured to move up and down while being supported by the lift and physically connected to the plurality of rails, and a connecting member. A portion of each seal belts is opened, and the slider and the base are connected to each other via the connecting member provided in the opening.

公开(公告)号：US20240248418A1

公开(公告)日：2024-07-25

申请号：US18434948

申请日：2024-02-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seok HEO ,  Cha Won KOH ,  Sang Joon HONG ,  Hyun Woo KIM ,  Kyung-Won KANG ,  Dong-Wook KIM ,  Kyung Won SEO ,  Young Il JANG ,  Yong Suk CHOI

IPC: G03F7/00 ,  G03F7/16 ,  H01L21/677 ,  H01L21/687

CPC classification number: G03F7/70875 ,  G03F7/168 ,  G03F7/70033 ,  H01L21/67703 ,  H01L21/68707

Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.