知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

52 条记录 (耗时 0.026 秒)

    SYSTEM FOR UNIFORM TEMPERATURE CONTROL OF CLUSTER PLATFORMS
    2.
    发明申请
    SYSTEM FOR UNIFORM TEMPERATURE CONTROL OF CLUSTER PLATFORMS 有权

    公开(公告)号：US20230116153A1

    公开(公告)日：2023-04-13

    申请号：US17851638

    申请日：2022-06-28

    申请人： Applied Materials, Inc.

    发明人： Lakshmikanth Krishnamurthy SHIRAHATTI ,  Kirankumar Neelasandra SAVANDAIAH ,  Prashant A. DESAI ,  Thomas BREZOCZKY

    IPC分类号： H01L21/67

    摘要： Aspects of the disclosure provided herein generally relate to a fluid flow network configured to cool subsystems of a substrate processing system. Aspects of the disclosure provide a fluid flow network and method that adjusts the flow of the cooling fluid through each subsystem of the substrate processing system. The methods described herein can include maintaining a flow rate of the cooling fluid through each subsystem over a range of cooling fluid pressures. The methods described herein can further include configuring the fluid flow network to equalize a flow rate of the cooling fluid through similar subsystems such that the flow rate through each subsystem is similar without adjustment.

    SUBSTRATE PROCESSING MODULE AND METHOD OF MOVING A WORKPIECE
    6.
    发明申请
    SUBSTRATE PROCESSING MODULE AND METHOD OF MOVING A WORKPIECE 有权

    公开(公告)号：US20220013383A1

    公开(公告)日：2022-01-13

    申请号：US16923792

    申请日：2020-07-08

    申请人： Applied Materials, Inc.

    发明人： Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

    IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  C23C14/35

    摘要： Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

    APPARATUS FOR IMPROVED ANODE-CATHODE RATIO FOR RF CHAMBERS
    7.
    发明申请
    APPARATUS FOR IMPROVED ANODE-CATHODE RATIO FOR RF CHAMBERS 有权

    公开(公告)号：US20210395877A1

    公开(公告)日：2021-12-23

    申请号：US16908344

    申请日：2020-06-22

    申请人： APPLIED MATERIALS, INC.

    发明人： Kirankumar Neelasandra SAVANDAIAH ,  Keith A. MILLER ,  Srinivasa Rao YEDLA ,  Chandrashekar KENCHAPPA ,  Martin Lee RIKER

    IPC分类号： C23C14/34

    摘要： Embodiments of process kits for use in plasma process chambers are provided herein. In some embodiments, a process kit for use in a process chamber includes an annular body having an upper portion and a lower portion extending downward and radially inward from the upper portion, wherein the annular body includes an inner surface having a first segment that extends downward, a second segment that extends radially outward from the first segment, a third segment that extends downward from the second segment, a fourth segment that extends radially outward from the third segment, a fifth segment that extends downward from the fourth segment, a sixth segment that extends radially inward from the fifth segment, a seventh segment that extends downward from the sixth segment, and an eighth segment that extends radially inward from the seventh segment.

    MULTISUBSTRATE PROCESS SYSTEM
    8.
    发明申请
    MULTISUBSTRATE PROCESS SYSTEM 审中-公开

    公开(公告)号：US20200381276A1

    公开(公告)日：2020-12-03

    申请号：US16877357

    申请日：2020-05-18

    申请人： Applied Materials, Inc.

    发明人： Srinivasa Rao YEDLA ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Bhaskar PRASAD ,  Shashikanth CHENNAKESHAVA ,  Sreenath SOVENAHALLI ,  Shankar KODLE

    IPC分类号： H01L21/67 ,  H01L21/687 ,  B25J15/00 ,  B25J9/04 ,  B25J11/00

    摘要： Aspects of the disclosure provided herein generally provide a substrate processing system that includes at least one processing module that includes a plurality of process stations coupled thereto and a substrate transferring device disposed within a transfer region of the processing module for transferring a plurality of substrates to two or more of the plurality of process stations. The methods and apparatuses disclosed herein are useful for performing vacuum processing on substrates wherein one or more substrates are transferred within the transfer region of processing module that is in direct communication with at least a portion of a processing region of a plurality of separately isolatable process stations during the process of transferring the one or more substrates. In some embodiments, a substrate is positioned and maintained on the same substrate support member during the process of transferring the substrate within the processing module and while the substrate is being processed in each of the plurality of process stations.