公开(公告)号：US20230116153A1

公开(公告)日：2023-04-13

申请号：US17851638

申请日：2022-06-28

Applicant: Applied Materials, Inc.

Inventor： Lakshmikanth Krishnamurthy SHIRAHATTI ,  Kirankumar Neelasandra SAVANDAIAH ,  Prashant A. DESAI ,  Thomas BREZOCZKY

IPC: H01L21/67

Abstract: Aspects of the disclosure provided herein generally relate to a fluid flow network configured to cool subsystems of a substrate processing system. Aspects of the disclosure provide a fluid flow network and method that adjusts the flow of the cooling fluid through each subsystem of the substrate processing system. The methods described herein can include maintaining a flow rate of the cooling fluid through each subsystem over a range of cooling fluid pressures. The methods described herein can further include configuring the fluid flow network to equalize a flow rate of the cooling fluid through similar subsystems such that the flow rate through each subsystem is similar without adjustment.

公开(公告)号：US20230088457A1

公开(公告)日：2023-03-23

申请号：US17863145

申请日：2022-07-12

Applicant: Applied Materials, Inc.

Inventor： Lakshmikanth Krishnamurthy SHIRAHATTI ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Pallab KARMAKAR

IPC: C23C14/54 ,  C23C14/24

Abstract: A substrate processing system that includes a multi-station processing chamber that includes a plurality of process stations is provided. Each process station has one or more processing components cooled by a cooling system. In one embodiment, the cooling system includes a closed loop monitoring system comprising a flow control valve fluidly coupled to a coolant supply line, a valve position measuring system for continuously monitoring the position of the valve, and a valve position controller for adjusting the position of the valve.

公开(公告)号：US20220076981A1

公开(公告)日：2022-03-10

申请号：US17014474

申请日：2020-09-08

Applicant: Applied Materials, Inc.

Inventor： Lakshmikanth Krishnamurthy SHIRAHATTI ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Ganesh SUBBUSWAMY

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67

Abstract: A substrate support for a processing region comprises a compliant sealing device comprising. The compliant sealing device comprises a coupling mechanism, a sealing device body, and a bellows. The coupling mechanism comprises a mating surface configured to interface with an opposing surface of an electrostatic chuck. The mating surface is configured to form a separable seal when disposed against the opposing surface of the electrostatic chuck. The sealing device body is connected to the coupling mechanism and comprises a passageway. The bellows surrounds the sealing device body.

公开(公告)号：US20220013383A1

公开(公告)日：2022-01-13

申请号：US16923792

申请日：2020-07-08

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  C23C14/35

Abstract: Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

公开(公告)号：US20200381276A1

公开(公告)日：2020-12-03

申请号：US16877357

申请日：2020-05-18

Applicant: Applied Materials, Inc.

Inventor： Srinivasa Rao YEDLA ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Bhaskar PRASAD ,  Shashikanth CHENNAKESHAVA ,  Sreenath SOVENAHALLI ,  Shankar KODLE

IPC: H01L21/67 ,  H01L21/687 ,  B25J15/00 ,  B25J9/04 ,  B25J11/00

Abstract: Aspects of the disclosure provided herein generally provide a substrate processing system that includes at least one processing module that includes a plurality of process stations coupled thereto and a substrate transferring device disposed within a transfer region of the processing module for transferring a plurality of substrates to two or more of the plurality of process stations. The methods and apparatuses disclosed herein are useful for performing vacuum processing on substrates wherein one or more substrates are transferred within the transfer region of processing module that is in direct communication with at least a portion of a processing region of a plurality of separately isolatable process stations during the process of transferring the one or more substrates. In some embodiments, a substrate is positioned and maintained on the same substrate support member during the process of transferring the substrate within the processing module and while the substrate is being processed in each of the plurality of process stations.

公开(公告)号：US20250069915A1

公开(公告)日：2025-02-27

申请号：US18811911

申请日：2024-08-22

Applicant: Applied Materials, Inc.

Inventor： Thomas BREZOCZKY ,  Punnati KRUSHNA REDDY ,  Azhar ALI M.A. ,  Kirankumar Neelasandra SAVANDAIAH ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Dhritiman Subha KASHYAP

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/677 ,  H01L21/687

Abstract: Degas stations for degassing substrates that are conveyed through a substrate processing system on a magnetically levitated carrier and related methods are provided. The method includes magnetically levitating a carrier with a substrate disposed thereon in a first position between a reflector assembly and a heater assembly disposed within a housing of the station. The method further includes moving both the reflector assembly and the heater assembly from a retracted position to an extended position while the carrier is disposed between the reflector assembly and heater assembly. The method further includes degassing the substrate disposed on the carrier with the heater assembly while the reflector assembly and heater assembly are each in the extended position, wherein the degassing includes pumping a purge gas through a gas port formed in at least one of the reflector assembly or the heater assembly towards the substrate.

公开(公告)号：US20240153803A1

公开(公告)日：2024-05-09

申请号：US18141931

申请日：2023-05-01

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

IPC: H01L21/677 ,  C23C14/34 ,  C23C14/50 ,  C23C14/56 ,  C23C16/458 ,  H01F7/20 ,  H01L21/687

CPC classification number: H01L21/67709 ,  C23C14/34 ,  C23C14/50 ,  C23C14/566 ,  C23C16/4583 ,  H01F7/206 ,  H01L21/67712 ,  H01L21/68742

Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

公开(公告)号：US20230178416A1

公开(公告)日：2023-06-08

申请号：US17923908

申请日：2021-04-12

Applicant: Applied Materials, Inc.

Inventor： Sreenath SOVENAHALLI ,  Kirankumar Neelasandra SAVANDAIAH ,  Bhaskar PRASAD ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/687

CPC classification number: H01L21/68742

Abstract: A floating pin for positioning a substrate relative to a substrate support includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.

公开(公告)号：US20220415635A1

公开(公告)日：2022-12-29

申请号：US17359348

申请日：2021-06-25

Applicant: Applied Materials, Inc.

Inventor： Srinivasa Rao YEDLA ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Hari Prasath RAJENDRAN

IPC: H01J37/34 ,  C23C14/54 ,  C23C14/35

Abstract: Aspects of the disclosure provided herein generally provide a substrate processing system that includes: a processing chamber including: a top plate having an array of process station openings disposed therethrough surrounding a central axis, a bottom plate having a first central opening, and a plurality of side walls between the top plate and the bottom plate; a plurality of heaters disposed in the top plate and the bottom plate and configured in a plurality of regions; and a system controller configured to independently control the plurality of heaters in each region.

公开(公告)号：US20220076979A1

公开(公告)日：2022-03-10

申请号：US17016030

申请日：2020-09-09

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Nitin Bharadwaj SATYAVOLU ,  Thomas BREZOCZKY

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  B65G47/92

Abstract: A pedestal assembly for a processing region and comprising first pins coupled to a substrate support, configured to mate with first terminals of an electrostatic chuck, and are configured to be coupled to a first power source. Each of the first pins comprises an interface element, and a compliance element supporting the interface element. Second pins are coupled to the substrate support, configured to mate with second terminals of the electrostatic chuck, and configured to couple to a second power source. Alignment elements are coupled to the substrate support and are configured to interface with centering elements of the electrostatic chuck. The flexible element is coupled to the substrate support, configured to interface with a passageway of the electrostatic chuck, and configured to be coupled to a gas source.