公开(公告)号：US20240347363A1

公开(公告)日：2024-10-17

申请号：US18752315

申请日：2024-06-24

Applicant: Taiwan Semiconductor Manufacturing Company, LTD.

Inventor： Sung-Ju Huang ,  Kuang-Wei Cheng ,  Cheng-Lung Wu ,  Yi-Fam Shiu ,  Chyi-Tsong Ni

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67742 ,  H01L21/67389 ,  H01L21/67766

Abstract: The present disclosure relates to systems and methods for reducing the humidity within a FOUP (Front Opening Unified Pod) when loaded on an EFEM (Equipment Front End Module) for transfer of a semiconductor wafer substrate during fabrication processes. A deflector of specified structure is placed inside the EFEM above the load port of the FOUP. The deflector directs airflow in the EFEM away from the load port. The deflector includes a body with a plurality of apertures in the deflector body, and with a sloped front surface. Thus, the degree of penetration of high-humidity air from the EFEM into the FOUP is reduced.

公开(公告)号：US20240334759A1

公开(公告)日：2024-10-03

申请号：US18742778

申请日：2024-06-13

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Joji KUWAHARA ,  Koji KANEYAMA

IPC: H10K59/124 ,  H01L21/67 ,  H01L21/677

CPC classification number: H10K59/124 ,  H01L21/67178 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67766

Abstract: Disclosed are a substrate treating apparatus and a substrate transporting method. A first treating block includes a developing-treatment layer and an interface layer arranged in an up-down direction. Accordingly, the interface layer is couplable with the indexer block. Moreover, a substrate transport mechanism of the indexer block transports a substrate from one of buffer units located at a predetermined height position in a substrate buffer to another of the buffer units located at a different height position in the substrate buffer. Accordingly, the interface layer is accessible to the buffer unit located at a height position corresponding to the interface layer. Thus, the interface layer can be made compact. Moreover, the interface layer is located in the upper part or the lower part of the developing-treatment layer, leading to reduction in footprint.

公开(公告)号：US12080571B2

公开(公告)日：2024-09-03

申请号：US16923792

申请日：2020-07-08

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra Savandaiah ,  Srinivasa Rao Yedla ,  Thomas Brezoczky

IPC: H01L21/67 ,  C23C14/35 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67184 ,  C23C14/35 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707

Abstract: Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

公开(公告)号：US12077392B2

公开(公告)日：2024-09-03

申请号：US17315423

申请日：2021-05-10

Applicant: Tokyo Electron Limited

Inventor： Hitoshi Hashima ,  Tohru Tochihara ,  Michiaki Matsushita ,  Hidekazu Kiyama

IPC: B65G47/90 ,  G03F7/16 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687 ,  H05K9/00

CPC classification number: B65G47/90 ,  G03F7/162 ,  H01L21/67766 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/6875 ,  H05K9/0067

Abstract: A substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector. The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.

公开(公告)号：US20240282610A1

公开(公告)日：2024-08-22

申请号：US18651776

申请日：2024-05-01

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jyh-Shiou HSU ,  Jeng-Shin MA ,  Cheng-Lung WU

IPC: H01L21/677 ,  B65G47/90 ,  H01L21/673

CPC classification number: H01L21/67772 ,  B65G47/90 ,  H01L21/67373 ,  H01L21/67376 ,  H01L21/67766

Abstract: A wafer transport carrier includes various components to provide improved air sealing to reduce air leakage into the wafer transport carrier. The wafer transport carrier may include a housing having a hollow shell that contains a vacuum or an inert gas to minimize and/or prevent humidity and oxygen ingress into the wafer transport carrier, a wafer rack that is integrated into the shell of the housing to minimize and/or prevent air leakage around the wafer rack, and/or an enhanced magnet-based door latch to provide air sealing around the full perimeter of the opening of the housing. These components and/or additional components described herein may reduce and/or prevent debris, moisture, and/or other types of contamination from the semiconductor fabrication facility from entering the wafer transport carrier and causing wafer defects and/or device failures.

公开(公告)号：US20240258136A1

公开(公告)日：2024-08-01

申请号：US18430398

申请日：2024-02-01

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/67 ,  C23C14/35 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67184 ,  C23C14/35 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707

Abstract: Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

公开(公告)号：US20240234195A9

公开(公告)日：2024-07-11

申请号：US18490741

申请日：2023-10-19

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Hua Hong Tan ,  Chee Kay Chow ,  Zong Xiang Cai ,  Wei Ming Xian ,  Yao Hong Wu ,  Wing Keung Lam

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/6838 ,  H01L21/4867 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67766

Abstract: A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.

公开(公告)号：US12030759B2

公开(公告)日：2024-07-09

申请号：US17778615

申请日：2020-10-02

Applicant: MURATA MACHINERY, LTD.

Inventor： Jun Sai ,  Kazuhiro Ishikawa

IPC: B66F9/07 ,  B65G1/04 ,  H01L21/677

CPC classification number: B66F9/07 ,  B65G1/0407 ,  B65G2249/02 ,  H01L21/67766

Abstract: In a stacker crane, a cover to cover an elevation area of an elevation portion is integrally attachable to side surface portions of a mast, which includes a reinforcement portion and an adjuster. The reinforcement portion between a pair of the side surface portions in a Y direction extends toward an opposite direction to an elevation surface of an elevation surface defining portion and has a higher stiffness than that of each of the pair of side surface portions. The adjuster is spaced from the elevation surface defining portion in an X direction perpendicular to a Z direction and the Y direction, and both edges thereof extendible in the Y direction are contactable with the reinforcement portion and each of the pair of side surface portions.

公开(公告)号：US20240194505A1

公开(公告)日：2024-06-13

申请号：US18581084

申请日：2024-02-19

Applicant: LAM RESEARCH CORPORATION

Inventor： Richard H. Gould ,  Richard Blank

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67201 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/67178 ,  Y10S414/139

Abstract: A transfer robot assembly arranged within an ATV transfer module includes a transfer robot that includes an end effector and one or more arm segments connected between the end effector and a transfer robot platform. A first robot alignment arm is connected to the transfer robot platform. A second robot alignment arm is connected to the first robot alignment arm and to a mounting chassis of the ATV transfer module. The transfer robot assembly is configured to actuate the first robot alignment arm and the second robot alignment arm to raise and lower the transfer robot to adjust a position of the transfer robot in a vertical direction and in a horizontal direction. The transfer robot is configured to fold into a folded configuration having a narrow profile occupying less than 50% of an overall depth of the ATV transfer module.

公开(公告)号：US20240087936A1

公开(公告)日：2024-03-14

申请号：US18273318

申请日：2022-01-17

Applicant: Tokyo Electron Limited

Inventor： Toshiaki KODAMA ,  Takeshi NIIDOME

IPC: H01L21/677 ,  G01J5/48 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L21/67778 ,  G01J5/48 ,  H01L21/67196 ,  H01L21/67248 ,  H01L21/67766 ,  H01L21/681

Abstract: A substrate processing system is provided with: a substrate processing apparatus including a loading/unloading port for a substrate and configured to execute predetermined processing on the substrate; a transfer device connected to the substrate processing apparatus via an opening/closing mechanism configured to open/close the loading/unloading port, and including a substrate transfer mechanism configured to load and unload the substrate into and from the substrate processing apparatus via the loading/unloading port; a thermal image generator provided on the substrate transfer mechanism and configured to generate a thermal image; and a control device. The control device is configured to: open, by the opening/closing mechanism, the loading/unloading port at a time at least either before or after the substrate processing apparatus executes the predetermined processing; and generate, by the thermal image generator, an in-apparatus thermal image as the thermal image indicating a temperature distribution inside the substrate processing apparatus.