公开(公告)号：US20230420275A1

公开(公告)日：2023-12-28

申请号：US18244041

申请日：2023-09-08

Applicant: Applied Materials, Inc.

Inventor： Michael Honan ,  David Blahnik ,  Robert Brent Vopat ,  Jeffrey Blahnik ,  Charles Carlson

IPC: H01L21/67 ,  H01L21/673 ,  F27D7/02 ,  H01L21/324 ,  C30B33/02 ,  C30B35/00

CPC classification number: H01L21/67109 ,  H01L21/67323 ,  F27D7/02 ,  H01L21/324 ,  H01L21/67248 ,  C30B33/02 ,  C30B35/00

Abstract: Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.

公开(公告)号：US20180247842A1

公开(公告)日：2018-08-30

申请号：US15556382

申请日：2017-05-19

Applicant: Heraeus Noblelight GmbH

Inventor： Thomas PIELA ,  Larisa VON RIEWEL

IPC: H01L21/67 ,  H01L21/673 ,  H05B1/02 ,  H05B3/24

CPC classification number: H01L21/67103 ,  H01L21/67303 ,  H01L21/67306 ,  H01L21/6732 ,  H01L21/67323 ,  H05B1/0233 ,  H05B3/24 ,  H05B3/26 ,  H05B2203/032

Abstract: An apparatus for thermal treatment of a substrate is provided. The apparatus has a heating device and a carrier provided with a support surface for the substrate. The apparatus permits a high substrate throughput. At least part of the carrier contains a composite material containing an amorphous matrix component and an additional component containing a semiconductor material, and a conductor path that is part of the heating device and made of an electrically conducting resistance material that generates heat when current passes through it is applied to a surface of the composite material.

公开(公告)号：US20160211159A1

公开(公告)日：2016-07-21

申请号：US14803922

申请日：2015-07-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.

Inventor： Yulong CHEN ,  Xuesong GAO ,  Lele XU

IPC: H01L21/673

CPC classification number: H01L21/67343 ,  H01L21/6732 ,  H01L21/67323 ,  H01L21/6734

Abstract: The present invention provides a stopper for a substrate cassette and a substrate cassette assembly, belonging to the technical field of manufacturing of display devices, which can solve the problem that an existing substrate cassette easily damages a substrate. The stopper for the substrate cassette of the present invention is strip-shaped, and arranged, in a length direction, on an inner side of a mullion of the substrate cassette; the stopper has a contact surface configured to contact the mullion of the substrate cassette and an exposed surface opposite to the contact surface, and the exposed surface, at least on a side facing the outside of the substrate cassette, is a convex cambered surface.

Abstract translation: 本发明提供一种用于基板盒和基板盒组件的止动件，属于显示装置的制造技术领域，其可以解决现有的基板盒容易损坏基板的问题。 本发明的基板盒的止动件是带状的，并且沿长度方向布置在基板盒的竖框的内侧上; 止动件具有接触表面，其被构造成接触基片盒的竖框和与接触表面相对的暴露表面，并且暴露表面至少在面向基底盒外侧的一侧是凸形弧形表面。

公开(公告)号：US07781035B2

公开(公告)日：2010-08-24

申请号：US10487840

申请日：2002-08-28

Applicant: Toshihiko Jimbo ,  Toshihide Murakami ,  Tadahiro Ohmi

Inventor： Toshihiko Jimbo ,  Toshihide Murakami ,  Tadahiro Ohmi

IPC: B32B1/02 ,  B32B27/00 ,  B32B1/08

CPC classification number: H01L21/67303 ,  H01L21/67306 ,  H01L21/67313 ,  H01L21/67316 ,  H01L21/6732 ,  H01L21/67323 ,  H01L21/67326 ,  H01L21/6733 ,  H01L21/67353 ,  H01L21/67359 ,  H01L21/67386 ,  Y10T428/13 ,  Y10T428/1303 ,  Y10T428/1352 ,  Y10T428/1359 ,  Y10T428/1386 ,  Y10T428/139

Abstract: A container for precision substrate having one or more component formed by molding a thermoplastic resin, characterized in that the component satisfies characteristics [1] and [2] below. [1] When being brought to contact ultra high purity argon gas (impurity concentration: 1 ppb or less) at 25° C. having a flow rate of 1.2 L/min., a water amount in said argon gas after 300 minutes is 30 ppb or less per a surface area 1 cm2 of the component. [2] When being placed in the air at 100° C., an increase amount of organics in the air in 300 minutes is 150 ng or less per weight 1 g of the component. According to the container, demands for low contamination can be satisfied.

Abstract translation: 一种用于通过模塑热塑性树脂形成的具有一种或多种组分的精密基材的容器，其特征在于该组分满足下面的特征[1]和[2]。 [1]在流量为1.2L / min的25℃下接触超高纯氩气（杂质浓度为1ppb以下）时，300分钟后的氩气中的水分为30 ppb以下的表面积为1cm 2的成分。 [2]当在100℃下放置在空气中时，在300分钟内空气中有机物的增加量为每重量1克150克或更少。 根据容器，可以满足低污染的要求。

公开(公告)号：US09502274B2

公开(公告)日：2016-11-22

申请号：US14281880

申请日：2014-05-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yi Koan Hong ,  Byung Lyul Park ,  Jumyong Park ,  Jisoon Park ,  Kyu-Ha Lee ,  Siyoung Choi

IPC: H01L21/673

CPC classification number: H01L21/6733 ,  H01L21/6732 ,  H01L21/67323 ,  H01L21/67326

Abstract: Embodiments of the present inventive concepts provide a wafer loader having one or more buffer zones to prevent damage to a wafer loaded in the wafer loader. The wafer loader may include a plurality of loading sections that protrude from a main body and are configured to be arranged at various locations along an edge of the wafer. Each of the loading sections may include a groove into which the edge of the wafer may be inserted. The loading section may include first and second protrusions having first and second inner sides, respectively, that face each other to define the groove therebetween. At least one of the first and second inner sides may include a recess to define the buffer zone.

Abstract translation: 本发明构思的实施例提供了具有一个或多个缓冲区的晶片装载器，以防止损坏装载在晶片装载器中的晶片。 晶片装载机可以包括从主体突出的多个装载部分，并被构造成沿着晶片的边缘布置在不同位置。 每个加载部分可以包括槽，其中可以插入晶片的边缘。 装载部分可以包括分别具有彼此面对以限定其间的凹槽的第一和第二内侧的第一和第二突起。 第一和第二内侧中的至少一个可以包括限定缓冲区的凹部。

公开(公告)号：US20050282101A1

公开(公告)日：2005-12-22

申请号：US11039968

申请日：2005-01-24

Applicant: Naoshi Adachi

Inventor： Naoshi Adachi

IPC: F27D5/00 ,  H01L21/22 ,  H01L21/31 ,  H01L21/324 ,  H01L21/673 ,  H01L21/68

CPC classification number: H01L21/67306 ,  F27D5/0037 ,  H01L21/67303 ,  H01L21/67309 ,  H01L21/6732 ,  H01L21/67323

Abstract: A heat treatment jig for supporting silicon semiconductor substrates by contacting, being loaded onto a heat treatment boat in a vertical heat treatment furnace, comprises; the configuration of a ring or a disc structure with the wall thickness between 1.5 and 6.0 mm; the deflection displacement of 100 μm or less at contact region in loaded condition; the outer diameter which is 65% or more of the diameter of said substrate; and the surface roughness (Ra) of between 1.0 and 100 μm at the contact region. The use of said jig enables to effectively retard the slip generation and to avoid the growth hindrance of thermally oxidized film at the back surface of said substrate, diminishing the surface steps causing the defocus in photolithography step in device fabrication process, thereby enabling to maintain high quality of silicon semiconductor substrates and to substantially enhance the device yield.

Abstract translation: 一种用于通过在立式热处理炉中加载到热处理船上的接触来支撑硅半导体衬底的热处理夹具包括： 环形或圆盘结构的结构，壁厚在1.5至6.0毫米之间; 载荷条件下接触区偏转位移为100mum以下; 外径为所述基材的直径的65％以上。 和接触区域的表面粗糙度（Ra）在1.0和100μm之间。 使用所述夹具能够有效地延缓滑移产生并避免热氧化膜在所述基板的背面的增长阻碍，减少在器件制造过程中在光刻步骤中导致散焦的表面步骤，由此能够保持高 硅半导体衬底的质量并且显着提高器件产量。

公开(公告)号：US20030087096A1

公开(公告)日：2003-05-08

申请号：US10224345

申请日：2002-08-21

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Michio Sato ,  Takashi Yamanobe

IPC: B32B009/00

CPC classification number: C23C14/024 ,  C23C14/0605 ,  H01L21/67323 ,  Y10T428/265 ,  Y10T428/30

Abstract: The present invention provides a carbon film coated member comprising: a base material; and a coated film formed on at least part of a surface of the base material, the coated film comprising: a matrix composed of amorphous carbon; and at least one of metal and metal carbide contained in the matrix, wherein an atomic ratio (M/C) of the metal (M) to carbon (C) constituting the coated film is 0.01 to 0.7. According to the above structure, there can be provided a carbon film coated member excellent in low-friction property, wear resistance and durability, and capable of suppressing a dust generation, peeling-off and deterioration of the coated film even if the carbon film coated member is used as semiconductor equipment members such as wafer cassette, dummy wafer, probe pin or the like under severe operating conditions, so that the carbon film coated member would not exert a bad influence onto the resultant semiconductor products.

Abstract translation: 本发明提供一种碳膜涂覆部件，包括：基材; 以及形成在所述基材的表面的至少一部分上的涂膜，所述涂膜包含：由无定形碳组成的基体; 和包含在基体中的金属和金属碳化物中的至少一种，其中构成涂膜的金属（M）与碳（C）的原子比（M / C）为0.01〜0.7。 根据上述结构，可以提供低摩擦性，耐磨性和耐久性优异的碳膜涂布构件，并且即使涂覆有碳膜的涂膜也能够抑制灰尘的产生，剥离和劣化 元件在恶劣的工作条件下用作诸如晶片盒，假晶片，探针等的半导体设备元件，使得碳膜涂覆元件不会对所得的半导体产品产生不良影响。

公开(公告)号：US20240339349A1

公开(公告)日：2024-10-10

申请号：US18131534

申请日：2023-04-06

Applicant: Applied Materials, Inc.

Inventor： Joseph Sommers ,  Joseph Behnke ,  Alexander Sulyman ,  Jaeyong Cho

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/6833 ,  H01L21/67115 ,  H01L21/67323

Abstract: Embodiments disclosed herein include an electrostatic chuck (ESC). In an embodiment, the ESC comprises a substrate with a first surface, where the first surface has a first surface roughness. The ESC may further comprise a plurality of mesas extending up from the first surface. In an embodiment, the plurality of mesas each include a second surface, where the second surface has a second surface roughness. In an embodiment the first surface roughness and the second surface roughness both have an average surface roughness Ra of approximately 0.3 μm or lower.

公开(公告)号：US20230143667A1

公开(公告)日：2023-05-11

申请号：US17980100

申请日：2022-11-03

Applicant: ASM IP Holding B.V.

Inventor： Gurupkar Nerwal ,  Senthil Sivaraman

IPC: H01L21/673 ,  H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67323 ,  H01L21/67775 ,  H01L21/68707 ,  H01L21/67167

Abstract: A substrate storage rack for a semiconductor processing system includes a bottom plate, a top plate, and a column assembly. The top plate is spaced apart from the bottom plate, the column assembly connects the top plate to the bottom plate, and a ball member is compressively seated within the column assembly. The ball member protrudes from the column assembly in a direction toward the top plate to support a substrate within the substrate storage rack and on the ball member. Semiconductor processing systems and methods of making substrate storage racks are also described.

公开(公告)号：US20150068948A1

公开(公告)日：2015-03-12

申请号：US14281880

申请日：2014-05-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yi Koan HONG ,  Byung Lyul PARK ,  Jumyong PARK ,  Jisoon PARK ,  Kyu-Ha LEE ,  Siyoung CHOI

IPC: H01L21/673

CPC classification number: H01L21/6733 ,  H01L21/6732 ,  H01L21/67323 ,  H01L21/67326

Abstract: Embodiments of the present inventive concepts provide a wafer loader having one or more buffer zones to prevent damage to a wafer loaded in the wafer loader. The wafer loader may include a plurality of loading sections that protrude from a main body and are configured to be arranged at various locations along an edge of the wafer. Each of the loading sections may include a groove into which the edge of the wafer may be inserted. The loading section may include first and second protrusions having first and second inner sides, respectively, that face each other to define the groove therebetween. At least one of the first and second inner sides may include a recess to define the buffer zone.

Abstract translation: 本发明构思的实施例提供了具有一个或多个缓冲区的晶片装载器，以防止损坏装载在晶片装载器中的晶片。 晶片装载机可以包括从主体突出的多个装载部分，并被构造成沿着晶片的边缘布置在不同位置。 每个加载部分可以包括槽，其中可以插入晶片的边缘。 装载部分可以包括分别具有彼此面对以限定其间的凹槽的第一和第二内侧的第一和第二突起。 第一和第二内侧中的至少一个可以包括限定缓冲区的凹部。