公开(公告)号：US20230253225A1

公开(公告)日：2023-08-10

申请号：US18301502

申请日：2023-04-17

申请人： ENKRIS SEMICONDUCTOR, INC.

发明人： Kai CHENG

IPC分类号： H01L21/673 ,  C23C16/458 ,  C30B25/12

CPC分类号： H01L21/67316 ,  C23C16/4584 ,  C30B25/12

摘要： Disclosed is a graphite disc solving a problem of poor performance uniformity of the epitaxial wafer, which is obtained during material epitaxial growth by using the graphite disc. The graphite disc includes a graphite disc body, where the graphite disc body includes a groove and a plurality of projections on a bottom wall of the groove, and the plurality of projections divide the groove into a plurality of independent regions. According to the graphite disc provided by the present disclosure, a plurality of regions are defined in the groove by using the projections, each region corresponds to one substrate, and different regions are interconnected. Compared with the graphite disc structure with one groove corresponding to one substrate in the related art, a space for gas flow is enlarged, therefore a problem that an edge of the epitaxial wafer is too thick caused by gas flow is alleviated.

公开(公告)号：US20230245868A1

公开(公告)日：2023-08-03

申请号：US17998541

申请日：2021-05-07

申请人： HANWHA Q CELLS GMBH

发明人： Martin SCHAPER

IPC分类号： H01J37/32 ,  H01L21/673 ,  C23C16/46 ,  C23C16/458

CPC分类号： H01J37/32724 ,  C23C16/463 ,  C23C16/4583 ,  H01L21/6733 ,  H01L21/67316 ,  H01J2237/002 ,  H01J2237/026 ,  H01J2237/201 ,  H01J2237/3321

摘要： A holding device for holding a plurality of substrates for plasma-enhanced deposition of a layer from the gas phase on the substrates, having: inner carrier plates, arranged parallel to one another and designed to carry substrates on mutually opposite sides; outer carrier plates, arranged parallel to the inner carrier plates and having an inner side facing the inner carrier plates, and an outer side facing away from the inner carrier plates, wherein each outer carrier plate is designed to carry one or more substrates on its inner side and to be free of substrates on its outer side; and shielding plates which are each arranged at a distance from the outer side of the outer carrier plate such that, as seen in a plan view of the outer carrier plates, the shielding plates at least predominantly shield the outer carrier plates, wherein each shielding plate is free of substrates.

公开(公告)号：US20180261482A1

公开(公告)日：2018-09-13

申请号：US15457330

申请日：2017-03-13

申请人： HIMAX TECHNOLOGIES LIMITED

发明人： Jui Tang Chang ,  Fang Wan Lu

IPC分类号： H01L21/673 ,  B29C45/14

CPC分类号： H01L21/67316 ,  H01L21/67313

摘要： A wafer cassette includes a front plate and a rear plate disposed opposite to face each other; and at least two top elongated rods, at least two middle elongated rods and at least two bottom elongated rods, each having a plurality of grooves shaped thereinto. The top elongated rods, the middle elongated rods and the bottom elongated rods each has two ends being pivotally connected to the front plate and the rear plate, respectively. The top elongated rods, the middle elongated rods and the bottom elongated rods each comprises a solid-iron rod enclosed with a cladding layer.

公开(公告)号：US10068787B2

公开(公告)日：2018-09-04

申请号：US15395955

申请日：2016-12-30

申请人： SunPower Corporation

发明人： Emmanuel Chua Abas

IPC分类号： A47G19/08 ,  H01L21/673 ,  H01L31/0368

CPC分类号： H01L21/67316 ,  H01L21/67313 ,  H01L21/67326 ,  H01L31/0368 ,  H01L31/18 ,  Y02E10/50 ,  Y02P70/521

摘要： Methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and wafer carriers can be used for increasing the rigidity of wafers, e.g., large and thin wafers, by intentionally bowing the wafers to an extent that does not break the wafers. In some examples, a method for processing semiconductor wafers includes loading each semiconductor wafer into a respective semiconductor wafer slot of a semiconductor wafer carrier, horizontally bowing each semiconductor wafer, and moving the semiconductor wafer carrier into a processing station and processing the semiconductor wafers at the processing station while the semiconductor wafers are loaded into the semiconductor wafer carrier and horizontally bowed.

公开(公告)号：US20160276142A1

公开(公告)日：2016-09-22

申请号：US15031138

申请日：2013-11-25

申请人： Applied Materials, Inc.

发明人： Andreas Ewald LOPP ,  Stefan KELLER ,  Uwe SCHÜßLER ,  Stefan BANGERT ,  Thomas GEBELE ,  Norbert SPATZ

IPC分类号： H01J37/32 ,  C23C16/458 ,  C23C14/50 ,  H01L21/673

CPC分类号： H01J37/32724 ,  C23C14/50 ,  C23C16/4581 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01L21/67316 ,  H01L21/67346 ,  H01L31/1876 ,  H01L31/1896

摘要： According to the present disclosure, a semiconductor substrate handling systems and substrate carrier is provided. The substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device includes a main portion for holding the substrate; a first end portion adapted to be supported by the transport device; and at least one first intermediate portion connecting the main portion with the first end portion. The at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.

摘要翻译： 根据本公开，提供了半导体衬底处理系统和衬底载体。 用于保持待处理的基板和用于在输送装置中或通过处理区域传送基板的基板载体包括用于保持基板的主要部分; 适于由所述运送装置支撑的第一端部; 以及将主要部分与第一端部连接起来的至少一个第一中间部分。 所述至少一个第一中间部分包括一个或多个切口，其适于减小主体部分和第一端部部分之间的热能传递。

公开(公告)号：US09184349B2

公开(公告)日：2015-11-10

申请号：US14071119

申请日：2013-11-04

申请人： LG INNOTEK CO., LTD.

发明人： Ji Eun Jeong ,  Da Eun Jeong

IPC分类号： H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00 ,  H01L31/0203 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L23/00 ,  H01L21/673 ,  H01L33/22 ,  H01L33/48

CPC分类号： H01L33/44 ,  H01L21/67316 ,  H01L21/6733 ,  H01L21/67366 ,  H01L24/97 ,  H01L33/22 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is a light emitting device. The light emitting device includes a body having a cavity; first and second lead frames spaced apart from each other in the cavity, a gap part between the first and second lead frames, an adhesive material extending from at least one of sidewalls of the cavity to a top surface of at least one of the first and second lead frames, a light emitting chip on at least one of the first and second lead frames, and a molding member adhering to the adhesive material in the cavity.

摘要翻译： 公开了一种发光器件。 发光装置包括具有空腔的主体; 在空腔中彼此间隔开的第一和第二引线框架，第一和第二引线框架之间的间隙部分，从空腔的侧壁中的至少一个延伸到第一和第二引线框架中的至少一个的顶表面的粘合材料 第二引线框架，在第一引线框架和第二引线框架中的至少一个上的发光芯片，以及附着到空腔中的粘合材料的模制构件。

公开(公告)号：US07781035B2

公开(公告)日：2010-08-24

申请号：US10487840

申请日：2002-08-28

申请人： Toshihiko Jimbo ,  Toshihide Murakami ,  Tadahiro Ohmi

发明人： Toshihiko Jimbo ,  Toshihide Murakami ,  Tadahiro Ohmi

IPC分类号： B32B1/02 ,  B32B27/00 ,  B32B1/08

CPC分类号： H01L21/67303 ,  H01L21/67306 ,  H01L21/67313 ,  H01L21/67316 ,  H01L21/6732 ,  H01L21/67323 ,  H01L21/67326 ,  H01L21/6733 ,  H01L21/67353 ,  H01L21/67359 ,  H01L21/67386 ,  Y10T428/13 ,  Y10T428/1303 ,  Y10T428/1352 ,  Y10T428/1359 ,  Y10T428/1386 ,  Y10T428/139

摘要： A container for precision substrate having one or more component formed by molding a thermoplastic resin, characterized in that the component satisfies characteristics [1] and [2] below. [1] When being brought to contact ultra high purity argon gas (impurity concentration: 1 ppb or less) at 25° C. having a flow rate of 1.2 L/min., a water amount in said argon gas after 300 minutes is 30 ppb or less per a surface area 1 cm2 of the component. [2] When being placed in the air at 100° C., an increase amount of organics in the air in 300 minutes is 150 ng or less per weight 1 g of the component. According to the container, demands for low contamination can be satisfied.

摘要翻译： 一种用于通过模塑热塑性树脂形成的具有一种或多种组分的精密基材的容器，其特征在于该组分满足下面的特征[1]和[2]。 [1]在流量为1.2L / min的25℃下接触超高纯氩气（杂质浓度为1ppb以下）时，300分钟后的氩气中的水分为30 ppb以下的表面积为1cm 2的成分。 [2]当在100℃下放置在空气中时，在300分钟内空气中有机物的增加量为每重量1克150克或更少。 根据容器，可以满足低污染的要求。

公开(公告)号：US20020083614A1

公开(公告)日：2002-07-04

申请号：US10097074

申请日：2002-03-12

申请人： Semitool, Inc.

发明人： Robert Weaver ,  Ronald Schlagenhaufer

IPC分类号： F26B017/24 ,  F26B017/30 ,  F26B011/02 ,  D06F058/00 ,  G05G001/00 ,  G05G003/00

CPC分类号： H01L21/67313 ,  H01L21/67316 ,  Y10S414/141

摘要： A rotor that may be used by itself or in a processing machine for processing semiconductor wafers includes two pairs of combs. A lock down mechanism has a lock bar, temporarily engaged and moved by a loading/unloading robot, drives a retainer against the edges of the wafers, to better hold them in place during processing. Contamination via generation of particles is reduced. Combs on the rotor have a resilient strip. The lower edges of the wafers compress slightly into or deflect the resilient strip, when urged into place by the lock down mechanism.

摘要翻译： 可以单独使用或用于处理半导体晶圆的处理机中的转子包括两对梳子。 锁定机构具有通过装载/卸载机器人临时接合和移动的锁定杆，将保持器驱动抵靠晶片的边缘，以在加工期间更好地将其保持在适当位置。 通过产生颗粒的污染减少。 转子上的梳子有一个弹性条。 当被锁定机构推动就位时，晶片的下边缘稍微压入或偏转弹性带。

公开(公告)号：US06227590B1

公开(公告)日：2001-05-08

申请号：US09592057

申请日：2000-06-12

申请人： David Korn ,  Keith Smith

发明人： David Korn ,  Keith Smith

IPC分类号： B65D8586

CPC分类号： H01L21/67316

摘要： A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.

摘要翻译： 用于半导体晶片的运输和存储的晶片载体。 更具体地，本发明是具有刚性结构和耐腐蚀涂层的晶片载体。 晶片载体包括具有通过连接构件连接的多个晶片支架的整体框架。 该框架涂覆有耐受通常用于半导体制造工艺中的腐蚀性材料的材料，例如氟聚合物。

公开(公告)号：US6086127A

公开(公告)日：2000-07-11

申请号：US128197

申请日：1998-08-03

申请人： David Korn ,  Keith Smith

发明人： David Korn ,  Keith Smith

IPC分类号： H01L21/673 ,  B65D85/86

CPC分类号： H01L21/67316

摘要： A method of making a wafer carrier for use in the transportation and storage of semiconductor wafers includes providing a unitary frame, forming a corrosion resistant coating, such as a fluoropolymer, covering the frame and providing wafer support elements mounted on the frame. A wafer carrier made by the present method may include a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.

摘要翻译： 制造用于半导体晶片的运输和储存的晶片载体的方法包括提供整体框架，形成耐腐蚀涂层，例如含氟聚合物，覆盖框架并提供安装在框架上的晶片支撑元件。 通过本方法制造的晶片载体可以包括具有通过连接构件连接的多个晶片支架的整体框架。 该框架涂覆有耐受通常用于半导体制造工艺中的腐蚀性材料的材料，例如氟聚合物。