公开(公告)号：US5788304A

公开(公告)日：1998-08-04

申请号：US649224

申请日：1996-05-17

申请人： David Korn ,  Keith Smith

发明人： David Korn ,  Keith Smith

IPC分类号： H01L21/673 ,  B65D85/86

CPC分类号： H01L21/67316

摘要： A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.

公开(公告)号：US6092851A

公开(公告)日：2000-07-25

申请号：US440839

申请日：1999-11-15

申请人： David Korn ,  Keith Smith

发明人： David Korn ,  Keith Smith

IPC分类号： H01L21/673 ,  B65D85/86

CPC分类号： H01L21/67316

摘要： A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.

摘要翻译： 用于半导体晶片的运输和存储的晶片载体。 更具体地，本发明是具有刚性结构和耐腐蚀涂层的晶片载体。 晶片载体包括具有通过连接构件连接的多个晶片支架的整体框架。 该框架涂覆有耐受通常用于半导体制造工艺中的腐蚀性材料的材料，例如氟聚合物。

公开(公告)号：US06227590B1

公开(公告)日：2001-05-08

申请号：US09592057

申请日：2000-06-12

申请人： David Korn ,  Keith Smith

发明人： David Korn ,  Keith Smith

IPC分类号： B65D8586

CPC分类号： H01L21/67316

摘要： A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.

摘要翻译： 用于半导体晶片的运输和存储的晶片载体。 更具体地，本发明是具有刚性结构和耐腐蚀涂层的晶片载体。 晶片载体包括具有通过连接构件连接的多个晶片支架的整体框架。 该框架涂覆有耐受通常用于半导体制造工艺中的腐蚀性材料的材料，例如氟聚合物。

公开(公告)号：US6086127A

公开(公告)日：2000-07-11

申请号：US128197

申请日：1998-08-03

申请人： David Korn ,  Keith Smith

发明人： David Korn ,  Keith Smith

IPC分类号： H01L21/673 ,  B65D85/86

CPC分类号： H01L21/67316

摘要： A method of making a wafer carrier for use in the transportation and storage of semiconductor wafers includes providing a unitary frame, forming a corrosion resistant coating, such as a fluoropolymer, covering the frame and providing wafer support elements mounted on the frame. A wafer carrier made by the present method may include a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.

摘要翻译： 制造用于半导体晶片的运输和储存的晶片载体的方法包括提供整体框架，形成耐腐蚀涂层，例如含氟聚合物，覆盖框架并提供安装在框架上的晶片支撑元件。 通过本方法制造的晶片载体可以包括具有通过连接构件连接的多个晶片支架的整体框架。 该框架涂覆有耐受通常用于半导体制造工艺中的腐蚀性材料的材料，例如氟聚合物。

公开(公告)号：US06237979B1

公开(公告)日：2001-05-29

申请号：US09592356

申请日：2000-06-12

申请人： David Korn ,  Keith Smith

发明人： David Korn ,  Keith Smith

IPC分类号： B65D8586

CPC分类号： H01L21/67316

摘要： A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.

摘要翻译： 用于半导体晶片的运输和存储的晶片载体。 更具体地，本发明是具有刚性结构和耐腐蚀涂层的晶片载体。 晶片载体包括具有通过连接构件连接的多个晶片支架的整体框架。 该框架涂覆有耐受通常用于半导体制造工艺中的腐蚀性材料的材料，例如氟聚合物。

公开(公告)号：US12121136B2

公开(公告)日：2024-10-22

申请号：US17893653

申请日：2022-08-23

申请人： Zachary Wachter ,  Keith Smith

发明人： Zachary Wachter ,  Keith Smith

IPC分类号： A45F5/00 ,  B25H3/02

CPC分类号： A45F5/00 ,  B25H3/02 ,  A45F2005/008 ,  A45F2200/0575

摘要： A protective tool pouch apparatus. The protective tool pouch apparatus includes a receptacle component for accepting and holding tools and/or building materials. The protective tool pouch apparatus includes keeping tools and/or building materials in a vertical orientation with friction and/or magnetics and/or grooves and/or ridges and/or removable dividers in a pre-determined size for preventing the tools and/or building materials from wearing a bottom surface and/or creating a hole in the bottom surface of the receptacle component. The protective tool pouch apparatus can be used as a standalone component and/or inserted into existing tool belts, arm belts, apron pockets, vest pockets, holsters, bags, pouches, clothing pockets, backpack pockets, etc.

公开(公告)号：US08151988B2

公开(公告)日：2012-04-10

申请号：US12623471

申请日：2009-11-23

申请人： Keith Smith ,  James C. Durham ,  Scott D. Greiwe

发明人： Keith Smith ,  James C. Durham ,  Scott D. Greiwe

IPC分类号： B65D73/00

CPC分类号： B65D73/0092 ,  B65D75/366

摘要： A display packaging system includes a front panel, a rear panel, and a blister cavity. The blister cavity has a product holding chamber configured to receive at least one product and a sealing flange that extends outwardly from the product holding chamber. The sealing flange includes a series of apertures and is sandwiched between the interior surface of the front panel and the interior surface of the rear panel. Respective portions of an interior surface of the front panel and an interior surface of the rear panel are then adhered only to each other with the respective portions including portions of the interior surface of the front panel and portions of the interior surface of the rear panel that are disposed on opposite sides of the series of apertures.

摘要翻译： 显示包装系统包括前面板，后面板和泡罩腔。 泡罩腔具有被配置为容纳至少一个产品的产品保持室和从产品保持室向外延伸的密封凸缘。 密封凸缘包括一系列孔，并且夹在前面板的内表面和后面板的内表面之间。 前面板的内表面和后面板的内表面的相应部分然后彼此粘合，各部分包括前面板的内表面的部分和后面板的内表面的部分， 设置在一系列孔的相对侧上。

公开(公告)号：US20080305355A1

公开(公告)日：2008-12-11

申请号：US12220543

申请日：2008-07-25

申请人： Michael A. Zimmerman ,  Keith Smith ,  Jacob Shverdin

发明人： Michael A. Zimmerman ,  Keith Smith ,  Jacob Shverdin

IPC分类号： F16J15/02 ,  B32B15/08

CPC分类号： H01L27/14618 ,  H01L23/10 ,  H01L23/3142 ,  H01L23/49861 ,  H01L24/48 ,  H01L27/14683 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4899 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/12569 ,  Y10T428/12618 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.

摘要翻译： 一种用于图像传感器或其它电子部件的塑料封装件，其包括塑料体，优选地由LCP材料构成，围绕引线框模制并限定其中要设置图像传感器的空腔。 提供一种盖组件，其具有保持在塑料盖框架中的透明玻璃盖，其可焊接或以其他方式粘合到包装的塑料体以封闭安装在腔中的图像传感器。 引线框通常由铜或铜合金或具有铜涂层的铁合金组成。 至少在与塑料体接触的那些部分中，在引线框架的表面上形成界面层，其用于提供引线框架和塑料材料之间的显着改善的粘合性，以实现金属和塑料材料之间的密封。 界面层由形成在引线框架的表面上的氧化亚铜基底层和形成在氧化亚铜层上的氧化铜层构成。 氧化铜外层具有针状结构，其在形成包装时提供用于与模制在其上的塑料材料粘合的互锁机构。

公开(公告)号：US20080010153A1

公开(公告)日：2008-01-10

申请号：US11739663

申请日：2007-04-24

申请人： Archie Pugh-O'Connor ,  York Baur ,  Keith Smith ,  Daniel Todd ,  Jeff Malek ,  Stanton Monlux

发明人： Archie Pugh-O'Connor ,  York Baur ,  Keith Smith ,  Daniel Todd ,  Jeff Malek ,  Stanton Monlux

IPC分类号： G06Q30/00 ,  G06Q40/00

CPC分类号： G06Q30/02 ,  G06Q20/10 ,  G06Q30/0213 ,  G06Q30/0251 ,  G06Q30/0256 ,  G06Q30/0274 ,  G06Q30/0275

摘要： A system for providing digital content to users under an advertising and revenue sharing basis. The system may provide music to users via the Internet, in combination with time-shifted advertisements presented by an application that resides on the user's computer. The system receives digital advertisements from advertisers and digital content from content providers. Advertisers provide compensation based on the presentation of their advertisements to users. Content providers receive a variable amount of compensation based on how many users access the digital content during a particular time period. Each content provider may receive a share of the advertising revenue that is generated by each user that accesses content during a particular time period.

摘要翻译： 一种在广告和收益分享的基础上向用户提供数字内容的系统。 系统可以通过因特网向用户提供音乐，结合由驻留在用户计算机上的应用呈现的时移广告。 该系统从广告商接收数字广告和来自内容提供商的数字内容。 广告商根据其向用户的广告呈现提供赔偿。 内容提供商根据在特定时间段内访问数字内容的用户数量，可以获得可变的补偿量。 每个内容提供商可以接收在特定时间段期间由访问内容的每个用户生成的广告收入的份额。

公开(公告)号：US20070169199A1

公开(公告)日：2007-07-19

申请号：US11530760

申请日：2006-09-11

申请人： John Quinnell ,  Mitchel Carlsen ,  Michael Ladner ,  Jeffrey Rudy ,  Keith Smith ,  Arthur Walasek

发明人： John Quinnell ,  Mitchel Carlsen ,  Michael Ladner ,  Jeffrey Rudy ,  Keith Smith ,  Arthur Walasek

IPC分类号： G06F11/00

CPC分类号： H04L63/1433 ,  G06F21/577 ,  G06F2221/2119

摘要： A web service vulnerability metadata exchange system that provides for verification of web services during development by testing for the latest vulnerabilities based on security, policy, and best practice profiles prior to release of the web services, and wherein the web service vulnerability metadata exchange system will automate the surveillance of deployed web services so that new vulnerabilities are profiled and captured for use in verifying new software releases, wherein the system includes a metadata registry coupled to a database including vulnerability metadata, an update manager for updating the database records, and an access manager for authenticating and/or authorizing access to the database records.

摘要翻译： 一种网络服务漏洞元数据交换系统，其通过在发布所述Web服务之前基于安全性，策略和最佳实践简档测试最新漏洞来提供开发期间的Web服务的验证，并且其中所述Web服务漏洞元数据交换系统将 自动化部署的Web服务的监视，以便对新的漏洞进行概要分析和捕获以用于验证新的软件版本，其中系统包括耦合到包括漏洞元数据的数据库的元数据注册表，用于更新数据库记录的更新管理器和访问 经理用于验证和/或授权访问数据库记录。