公开(公告)号：US20190161852A1

公开(公告)日：2019-05-30

申请号：US16092797

申请日：2016-05-02

Applicant: Applied Materials, Inc.

Inventor： Hyun Chan PARK ,  Thomas GEBELE ,  Ajay Sampath BHOOLOKAM

IPC: C23C14/35 ,  H01J37/34

Abstract: According to one aspect of the present disclosure, a method of coating a substrate with at least one cathode assembly having a sputter target and a magnet assembly that is rotatable around a rotation axis is provided. The method comprises: Coating of the substrate while moving the magnet assembly in a reciprocating manner in a first angular sector; and subsequent coating of the substrate while moving the magnet assembly in a reciprocating manner in a second angular sector different from the first angular sector. According to a second aspect, a coating apparatus for performing said method is provided.

公开(公告)号：US20160276142A1

公开(公告)日：2016-09-22

申请号：US15031138

申请日：2013-11-25

Applicant: Applied Materials, Inc.

Inventor： Andreas Ewald LOPP ,  Stefan KELLER ,  Uwe SCHÜßLER ,  Stefan BANGERT ,  Thomas GEBELE ,  Norbert SPATZ

IPC: H01J37/32 ,  C23C16/458 ,  C23C14/50 ,  H01L21/673

CPC classification number: H01J37/32724 ,  C23C14/50 ,  C23C16/4581 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01L21/67316 ,  H01L21/67346 ,  H01L31/1876 ,  H01L31/1896

Abstract: According to the present disclosure, a semiconductor substrate handling systems and substrate carrier is provided. The substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device includes a main portion for holding the substrate; a first end portion adapted to be supported by the transport device; and at least one first intermediate portion connecting the main portion with the first end portion. The at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.

Abstract translation: 根据本公开，提供了半导体衬底处理系统和衬底载体。 用于保持待处理的基板和用于在输送装置中或通过处理区域传送基板的基板载体包括用于保持基板的主要部分; 适于由所述运送装置支撑的第一端部; 以及将主要部分与第一端部连接起来的至少一个第一中间部分。 所述至少一个第一中间部分包括一个或多个切口，其适于减小主体部分和第一端部部分之间的热能传递。

公开(公告)号：US20240102154A1

公开(公告)日：2024-03-28

申请号：US17768799

申请日：2020-02-24

Applicant: Applied Materials, Inc.

Inventor： Chun Cheng CHEN ,  Hung-Wen CHANG ,  Shin-Hung LIN ,  Chi-Chang YANG ,  Christoph MUNDORF ,  Thomas GEBELE ,  Jürgen GRILLMAYER

IPC: C23C14/54 ,  C23C14/24 ,  C23C14/56

CPC classification number: C23C14/542 ,  C23C14/24 ,  C23C14/566

Abstract: A vacuum processing apparatus (110) for deposition of a material on a substrate is provided. The vacuum processing apparatus (110) includes a vacuum chamber comprising a processing area (111); a deposition apparatus (112) within the processing area (111) of the vacuum chamber; a cooling surface (113) inside the vacuum chamber; and one or more movable shields (220) between the cooling surface (113) and the processing area (111).

公开(公告)号：US20210355578A1

公开(公告)日：2021-11-18

申请号：US17391145

申请日：2021-08-02

Applicant: Applied Materials, Inc.

Inventor： Hyun Chan PARK ,  Thomas GEBELE ,  Ajay Sampath BHOOLOKAM

IPC: C23C14/35 ,  H01J37/34

Abstract: According to one aspect of the present disclosure, a method of coating a substrate (100) with at least one cathode assembly (10) having a sputter target (20) and a magnet assembly (25) that is rotatable around a rotation axis (A) is provided. The method comprises: Coating of the substrate (100) while moving the magnet assembly in a reciprocating manner in a first angular sector (12); and subsequent coating of the substrate (100) while moving the magnet assembly (25) in a reciprocating manner in a second angular sector (14) different from the first angular sector (12). According to a second aspect, a coating apparatus for performing said method is provided.

公开(公告)号：US20180211823A1

公开(公告)日：2018-07-26

申请号：US15746032

申请日：2015-08-24

Applicant: Daniel SEVERIN ,  Thomas GEBELE ,  Thomas LEIPNITZ ,  Applied Materials, Inc.

Inventor： Daniel SEVERIN ,  Thomas GEBELE ,  Thomas LEIPNITZ

IPC: H01J37/32 ,  H01L21/285 ,  H01J37/34 ,  H01L27/12 ,  C23C14/34 ,  C23C14/00 ,  C23C14/08 ,  C23C14/35

CPC classification number: H01J37/32844 ,  C23C14/0042 ,  C23C14/0063 ,  C23C14/086 ,  C23C14/3464 ,  C23C14/352 ,  H01J37/32449 ,  H01J37/32834 ,  H01J37/3405 ,  H01J37/3473 ,  H01J37/3494 ,  H01J2237/0203 ,  H01J2237/182 ,  H01J2237/24585 ,  H01J2237/332 ,  H01L21/2855 ,  H01L27/1262 ,  Y02C20/30

Abstract: A apparatus for vacuum sputter deposition is described. The apparatus includes, a vacuum chamber; three or more sputter cathodes within the vacuum chamber for sputtering material on a substrate; a gas distribution system for providing a processing gas including H2 to the vacuum chamber; a vacuum system for providing a vacuum inside the vacuum chamber; and a safety arrangement for reducing the risk of an oxy-hydrogen explosion, wherein the safety arrangement comprises a dilution gas feeding unit connected to the vacuum system for dilution of the H2-content of the processing gas.

公开(公告)号：US20210147975A1

公开(公告)日：2021-05-20

申请号：US17046975

申请日：2018-04-18

Applicant: Applied Materials, Inc.

Inventor： Thomas GEBELE ,  Wolfgang BUSCHBECK

IPC: C23C14/54 ,  C23C14/24 ,  C23C14/56

Abstract: An evaporation source for deposition of evaporated material on a substrate is described. The evaporation source including a crucible for material evaporation; a distribution assembly with one or more outlets for providing the evaporated material to the substrate, the distribution assembly being in fluid communication with the crucible; and a measurement assembly. The measurement assembly includes a tube connecting an interior space of the distribution assembly with a pressure sensor.

公开(公告)号：US20170314120A1

公开(公告)日：2017-11-02

申请号：US15531693

申请日：2014-12-17

Applicant: Applied Materials, Inc.

Inventor： Thomas GEBELE ,  Uwe SCHÜßLER ,  Jose Manuel DIEGUEZ-CAMPO ,  Andreas LOPP

IPC: C23C14/24 ,  C23C14/04 ,  H01L51/00

CPC classification number: C23C14/243 ,  C23C14/042 ,  C23C14/12 ,  C23C14/24 ,  H01L51/001 ,  H01L51/0011

Abstract: A material deposition arrangement for depositing evaporated material on a substrate in a vacuum chamber is described. The material deposition arrangement includes a crucible for providing material to be evaporated; a linear distribution pipe in fluid communication with the crucible; and a plurality of nozzles in the distribution pipe for guiding the evaporated material into the vacuum chamber. Each nozzle may have a nozzle inlet for receiving the evaporated material, a nozzle outlet for releasing the evaporated material to the vacuum chamber, and a nozzle passage between the nozzle inlet and the nozzle outlet. The nozzle passage of at least one of the plurality of nozzles includes a first section having a first length and a first size, and a second having a second length and a second size. The ratio of the second size to the first size is between 2 and 10.