公开(公告)号：US20160276142A1

公开(公告)日：2016-09-22

申请号：US15031138

申请日：2013-11-25

Applicant: Applied Materials, Inc.

Inventor： Andreas Ewald LOPP ,  Stefan KELLER ,  Uwe SCHÜßLER ,  Stefan BANGERT ,  Thomas GEBELE ,  Norbert SPATZ

IPC: H01J37/32 ,  C23C16/458 ,  C23C14/50 ,  H01L21/673

CPC classification number: H01J37/32724 ,  C23C14/50 ,  C23C16/4581 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01L21/67316 ,  H01L21/67346 ,  H01L31/1876 ,  H01L31/1896

Abstract: According to the present disclosure, a semiconductor substrate handling systems and substrate carrier is provided. The substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device includes a main portion for holding the substrate; a first end portion adapted to be supported by the transport device; and at least one first intermediate portion connecting the main portion with the first end portion. The at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.

Abstract translation: 根据本公开，提供了半导体衬底处理系统和衬底载体。 用于保持待处理的基板和用于在输送装置中或通过处理区域传送基板的基板载体包括用于保持基板的主要部分; 适于由所述运送装置支撑的第一端部; 以及将主要部分与第一端部连接起来的至少一个第一中间部分。 所述至少一个第一中间部分包括一个或多个切口，其适于减小主体部分和第一端部部分之间的热能传递。