公开(公告)号：US20240102154A1

公开(公告)日：2024-03-28

申请号：US17768799

申请日：2020-02-24

Applicant: Applied Materials, Inc.

Inventor： Chun Cheng CHEN ,  Hung-Wen CHANG ,  Shin-Hung LIN ,  Chi-Chang YANG ,  Christoph MUNDORF ,  Thomas GEBELE ,  Jürgen GRILLMAYER

IPC: C23C14/54 ,  C23C14/24 ,  C23C14/56

CPC classification number: C23C14/542 ,  C23C14/24 ,  C23C14/566

Abstract: A vacuum processing apparatus (110) for deposition of a material on a substrate is provided. The vacuum processing apparatus (110) includes a vacuum chamber comprising a processing area (111); a deposition apparatus (112) within the processing area (111) of the vacuum chamber; a cooling surface (113) inside the vacuum chamber; and one or more movable shields (220) between the cooling surface (113) and the processing area (111).