Mask pod and semiconductor device

    公开(公告)号:US12125726B2

    公开(公告)日:2024-10-22

    申请号:US17657799

    申请日:2022-04-04

    Abstract: The present disclosure relates to the technical field of semiconductors, and provides a mask pod and a semiconductor device. The mask pod includes: a body, wherein the body has an accommodation space configured to accommodate a mask, the accommodation space has a first opening, and the first opening is located on a circumferential side of the body; and a shielding member, wherein the shielding member is provided on the body and is movably provided relative to the body, to shield or release the first opening.

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20240192588A1

    公开(公告)日:2024-06-13

    申请号:US18582045

    申请日:2024-02-20

    CPC classification number: G03F1/66 H01L21/0274 H01L21/67359 G03F7/70741

    Abstract: A reticle enclosure includes a base including a first surface, a cover including a second surface and coupled to the base with the first surface facing the second surface. The base and the cover form an internal space that includes a reticle. The reticle enclosure includes restraining mechanisms arranged in the internal space and for securing the reticle, and structures disposed adjacent the reticle in the internal space. The structures enclose the reticle at least partially, and limit passage of contaminants between the internal space and an external environment of the reticle enclosure. The structures include barriers disposed on the first and second surfaces. In other examples, a padding is installed in gaps between the barriers and the first and second surfaces. In other examples, the structures include wall structures disposed on the first and second surfaces and between the restraining mechanisms.

    Lid opening-and-closing device
    5.
    发明授权

    公开(公告)号:US11961752B2

    公开(公告)日:2024-04-16

    申请号:US17432134

    申请日:2020-01-20

    CPC classification number: H01L21/67772 H01L21/67359

    Abstract: A first lid opening-and-closing mechanism includes: a first holder that holds an upper lid of a first container; a first protrusion provided to protrude from the first holder toward one side direction with respect to the first holder and extends to outside of a casing; and a first raising/lowering driver that raises and lowers the first holder in a cantilevered manner with the first protrusion interposed therebetween. A second lid opening-and-closing mechanism includes: a second holder that holds an upper lid of a second container; a second protrusion provided to protrude from the second holder toward the one side direction and extends to the outside of the casing; and a second raising/lowering driver that raises and lowers the second holder in a cantilevered manner with the second protrusion interposed therebetween. The first raising/lowering driver and the second raising/lowering driver are located outside the casing in the one side direction.

    Reticle enclosure for lithography systems

    公开(公告)号:US11940727B2

    公开(公告)日:2024-03-26

    申请号:US18126898

    申请日:2023-03-27

    CPC classification number: G03F1/66 H01L21/0274 H01L21/67359 G03F7/70741

    Abstract: A reticle enclosure includes a base including a first surface, a cover including a second surface and coupled to the base with the first surface facing the second surface. The base and the cover form an internal space that includes a reticle. The reticle enclosure includes restraining mechanisms arranged in the internal space and for securing the reticle, and structures disposed adjacent the reticle in the internal space. The structures enclose the reticle at least partially, and limit passage of contaminants between the internal space and an external environment of the reticle enclosure. The structures include barriers disposed on the first and second surfaces. In other examples, a padding is installed in gaps between the barriers and the first and second surfaces. In other examples, the structures include wall structures disposed on the first and second surfaces and between the restraining mechanisms.

    Reticle pod and wear parts thereof

    公开(公告)号:US11787621B2

    公开(公告)日:2023-10-17

    申请号:US16903337

    申请日:2020-06-16

    CPC classification number: B65D85/48 G03F1/66 G03F7/70741 H01L21/67359

    Abstract: The invention provides a reticle pod, in particular the reticle pod with wear parts. The reticle pod is a large-size reticle pod and includes a vertical accommodation space for accommodating reticles. The reticle pod mainly includes a cover and a box. The box is used to combine with the cover to form an internal space in order to accommodate reticles. Guiding members are disposed outside the box, and the guiding members can help guide the relative position of the box and the cover. The contact surfaces of the box contacting the upright reticles are disposed with at least two slots, and each of the slot is configured with at least one wear part. The wear part module further includes a first wear part disposed on the upper portion of the slot and a second wear part disposed on the lower portion of the slot.

    Reticle carrier and associated methods

    公开(公告)号:US11687011B2

    公开(公告)日:2023-06-27

    申请号:US17446402

    申请日:2021-08-30

    CPC classification number: G03F7/70741 H01L21/67359 H01L21/6831 H01L21/68742

    Abstract: A reticle carrier described herein is configured to quickly discharge the residual charge on a reticle so as to reduce, minimize, and/or prevent particles in the reticle carrier from being attracted to and/or transferred to the reticle. In particular, the reticle carrier may be configured to provide reduced capacitance between an inner baseplate of the reticle carrier and the reticle. The reduction in capacitance may reduce the resistance-capacitance (RC) time constant for discharging the residual charge on the reticle, which may increase the discharge speed for discharging the residual charge through support pins of the reticle carrier. The increase in discharge speed may reduce the likelihood that an electrostatic force in the reticle carrier may attract particles in the reticle carrier to the reticle. This may reduce pattern defects transferred to substrates that are patterned using the reticle, may increase semiconductor device manufacturing quality and yield, and may reduce scrap and rework of semiconductor devices and/or wafers.

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