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公开(公告)号：US20230302589A1
公开(公告)日：2023-09-28
申请号：US18199633
申请日：2023-05-19
发明人： Yu-Chen Chen , Chih-Hung Huang , Cheng-Lung Wu , Yang-Ann Chu , Jiun-Rong Pai
IPC分类号： B23P19/06 , B25J15/00 , B25B23/10 , H01L21/673
CPC分类号： B23P19/06 , B25B23/10 , B25J15/0019 , H01L21/6732 , Y10T29/49819
摘要： The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener from the pod, and the fastener head is received within the lower sleeve.
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公开(公告)号：US20230256549A1
公开(公告)日：2023-08-17
申请号：US17671795
申请日：2022-02-15
发明人： Yu-Chen Chen , Chih-Hung Huang , Cheng-Lung Wu , Yang-Ann Chu , Jiun-Rong Pai
IPC分类号： B23P19/06 , B25J15/00 , H01L21/673
CPC分类号： B23P19/06 , B25J15/0019 , H01L21/6732
摘要： The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener form the pod, and the fastener head is received within the lower sleeve.
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3.发明公开公开(公告)号：US20230268210A1
公开(公告)日：2023-08-24
申请号：US17677142
申请日：2022-02-22
发明人： CHUN-YU LIN , Chih-Hung Huang , Yu-Chen Chen , Cheng-Lung Wu , Jiun-Rong Pai
IPC分类号： H01L21/673
CPC分类号： H01L21/67309 , H01L21/67333
摘要： A tray of an automated handling system for transporting semiconductor devices includes: a receiving region that is configured to receive a boat, the boat carrying one or more semiconductor devices thereon; and a clamping mechanism that selectively clamps the boat, residing in the receiving region, to the tray. Suitably, the clamping mechanism is automatically disengaged when the tray is positioned in a designated location and automatically engaged when the tray is not positioned in the designated location, such that, when engaged, the clamping mechanism holds the boat, residing in the boat receiving region, securely within the tray, and when disengaged, the clamping mechanism releases the boat residing in the boat receiving region.
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公开(公告)号：US11302552B1
公开(公告)日：2022-04-12
申请号：US17248073
申请日：2021-01-07
发明人： Chih-Hung Huang , Cheng-Lung Wu , Yang-Ann Chu , Hsuan Lee , Jiun-Rong Pai
IPC分类号： H01L21/677 , H01L21/687
摘要： A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.
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公开(公告)号：US12119251B2
公开(公告)日：2024-10-15
申请号：US17647367
申请日：2022-01-07
发明人： Chih-Hung Huang , Cheng-Lung Wu , Yi-Fam Shiu , Yu-Chen Chen , Yang-Ann Chu , Jiun-Rong Pai
IPC分类号： H01L21/677 , B23Q15/00 , B23Q16/00 , G05D5/04 , H01L23/04
CPC分类号： H01L21/6773 , B23Q15/00 , B23Q16/00 , G05D5/04 , H01L21/67736 , H01L21/67778 , H01L23/04
摘要： A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
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公开(公告)号：US12084307B2
公开(公告)日：2024-09-10
申请号：US17446406
申请日：2021-08-30
发明人： Chih-Hung Huang , Cheng-Lung Wu , Yang-Ann Chu , Jiun-Rong Pai
摘要： In some implementations, a reeling device may receive material via a receiving end of a set of guiding blocks positioned around a reel. The set of guiding blocks are configured with an opening at the receiving end and with one or more inner surfaces configured to guide the material on a path around a surface of the reel. The one or more inner surfaces of the set of guiding blocks are arc-shaped to generally follow the surface of the reel. The reeling device may operate a motor that rotates the reel in a loading direction to facilitate loading the material onto the reel. The set of guiding blocks travel generally away from the surface of the reel based on the material being received and/or the motor operating in the loading direction.
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公开(公告)号：US12083648B2
公开(公告)日：2024-09-10
申请号：US17444602
申请日：2021-08-06
发明人： Yi-Fam Shiu , Cheng-Chao Tsai , Cheng-Lung Wu , Chih-Hung Huang , Jiun-Rong Pai
IPC分类号： B24B41/047
CPC分类号： B24B41/047
摘要： A system includes a loader tool to load a plate to which a sandpaper sheet is to be affixed to a surface of the plate. The system includes a sandpaper affixing tool to remove a liner from the sandpaper sheet to expose an adhesive surface of the sandpaper sheet, and to affix the sandpaper sheet to the surface of the plate using the adhesive surface of the sandpaper sheet. The system includes a flatness detector to determine whether a surface of the sandpaper sheet is sufficiently flat after the sandpaper sheet is affixed to the surface of the plate. The system includes an unloader tool to store the plate after the sandpaper sheet is affixed to the surface of the plate.
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公开(公告)号：US11929273B2
公开(公告)日：2024-03-12
申请号：US16939820
申请日：2020-07-27
发明人： Tsung-Sheng Kuo , Chih-Hung Huang , Guan-Wei Huang , Ping-Yung Yen , Hsuan Lee , Jiun-Rong Pai
IPC分类号： H01L21/67 , H01L21/673 , H01L21/677
CPC分类号： H01L21/67373 , H01L21/67303 , H01L21/67706 , H01L21/6773 , H01L21/67736
摘要： A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.
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公开(公告)号：US11915954B2
公开(公告)日：2024-02-27
申请号：US18161242
申请日：2023-01-30
发明人： Chih-Hung Huang , Cheng-Lung Wu , Zheng-Lin He , Yang-Ann Chu , Jiun-Rong Pai , Hsuan Lee
IPC分类号： H01L21/67 , B07C5/34 , G01R31/01 , H01L21/677
CPC分类号： H01L21/67271 , B07C5/3412 , G01R31/01 , H01L21/67703
摘要： A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.
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公开(公告)号：US11752582B1
公开(公告)日：2023-09-12
申请号：US17671795
申请日：2022-02-15
发明人： Yu-Chen Chen , Chih-Hung Huang , Cheng-Lung Wu , Yang-Ann Chu , Jiun-Rong Pai
IPC分类号： B23P19/06 , H01L21/673 , B25J15/00 , B25B23/10
CPC分类号： B23P19/06 , B25B23/10 , B25J15/0019 , H01L21/6732 , Y10T29/49819
摘要： The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener from the pod, and the fastener head is received within the lower sleeve.
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