公开(公告)号：US11302552B1

公开(公告)日：2022-04-12

申请号：US17248073

申请日：2021-01-07

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chih-Hung Huang ,  Cheng-Lung Wu ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC分类号： H01L21/677 ,  H01L21/687

摘要： A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.

公开(公告)号：US11929273B2

公开(公告)日：2024-03-12

申请号：US16939820

申请日：2020-07-27

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

发明人： Tsung-Sheng Kuo ,  Chih-Hung Huang ,  Guan-Wei Huang ,  Ping-Yung Yen ,  Hsuan Lee ,  Jiun-Rong Pai

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67373 ,  H01L21/67303 ,  H01L21/67706 ,  H01L21/6773 ,  H01L21/67736

摘要： A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.

公开(公告)号：US11302553B1

公开(公告)日：2022-04-12

申请号：US17248072

申请日：2021-01-07

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chih-Hung Huang ,  Cheng-Lung Wu ,  Yang-Ann Chu ,  Hsuan Lee ,  Jiun-Rong Pai

IPC分类号： H01L21/677

摘要： A transport carrier docking device may be capable of forming an air-tight seal around a transport carrier while a front portion of the transport carrier is inserted into a chamber of the transport carrier docking device. Semiconductor wafers in the transport carrier may be accessed by a transport tool while the air-tight seal exists around the transport carrier, which prevents and/or reduces the likelihood that contaminants in a semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.

公开(公告)号：US11569105B2

公开(公告)日：2023-01-31

申请号：US16901595

申请日：2020-06-15

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chih-Hung Huang ,  Cheng-Lung Wu ,  Zheng-Lin He ,  Yang-Ann Chu ,  Jiun-Rong Pai ,  Hsuan Lee

IPC分类号： H01L21/67 ,  G01R31/01 ,  B07C5/34 ,  H01L21/677

摘要： A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.