Invention Grant
- Patent Title: Sandpaper replacement system
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Application No.: US17444602Application Date: 2021-08-06
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Publication No.: US12083648B2Publication Date: 2024-09-10
- Inventor: Yi-Fam Shiu , Cheng-Chao Tsai , Cheng-Lung Wu , Chih-Hung Huang , Jiun-Rong Pai
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Harrity & Harrity, LLP
- Main IPC: B24B41/047
- IPC: B24B41/047

Abstract:
A system includes a loader tool to load a plate to which a sandpaper sheet is to be affixed to a surface of the plate. The system includes a sandpaper affixing tool to remove a liner from the sandpaper sheet to expose an adhesive surface of the sandpaper sheet, and to affix the sandpaper sheet to the surface of the plate using the adhesive surface of the sandpaper sheet. The system includes a flatness detector to determine whether a surface of the sandpaper sheet is sufficiently flat after the sandpaper sheet is affixed to the surface of the plate. The system includes an unloader tool to store the plate after the sandpaper sheet is affixed to the surface of the plate.
Public/Granted literature
- US20230039611A1 SANDPAPER REPLACEMENT SYSTEM Public/Granted day:2023-02-09
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