公开(公告)号：US20230187166A1

公开(公告)日：2023-06-15

申请号：US17547623

申请日：2021-12-10

Applicant: Applied Materials, Inc.

Inventor： Robert Mitchell ,  Frank Sinclair ,  Joseph C. Olson ,  William T. Weaver ,  Nick Parisi

IPC: H01J37/20 ,  H01J37/317 ,  H01L21/683 ,  C23C14/48 ,  C23C14/50

CPC classification number: H01J37/20 ,  H01J37/3171 ,  H01L21/6833 ,  C23C14/48 ,  C23C14/505 ,  H01J2237/20214

Abstract: A system comprising a spinning disk is disclosed. The system comprises a semiconductor processing system, such as a high energy implantation system. The semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces, which are disposed on the spinning disk. The spinning disk comprises a rotating central hub with a plurality of platens. The plurality of platens may extend outward from the central hub and workpieces are electrostatically clamped to the platens. The plurality of platens may also be capable of rotation. The central hub also controls the rotation of each of the platens about an axis orthogonal to the rotation axis of the central hub. In this way, variable angle implants may be performed. Additionally, this allows the workpieces to be mounted while in a horizontal orientation.

公开(公告)号：US11264258B2

公开(公告)日：2022-03-01

申请号：US16877641

申请日：2020-05-19

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US20200279763A1

公开(公告)日：2020-09-03

申请号：US16877641

申请日：2020-05-19

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US10699930B2

公开(公告)日：2020-06-30

申请号：US16127702

申请日：2018-09-11

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US20190259638A1

公开(公告)日：2019-08-22

申请号：US16400516

申请日：2019-05-01

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Robert Brent Vopat ,  Paul E. Pergande ,  Benjamin B. Riordon ,  David Blahnik ,  William T. Weaver

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/673

Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.

公开(公告)号：US20160355927A1

公开(公告)日：2016-12-08

申请号：US15163857

申请日：2016-05-25

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Robert Brent Vopat ,  Joseph Yudovsky ,  Jason M. Schaller

IPC: C23C16/458 ,  C23C16/455

CPC classification number: C23C16/4585 ,  C23C16/45551 ,  C23C16/4584 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68785 ,  H01L21/68792

Abstract: Apparatus and methods for aligning large susceptors in batch processing chambers are described. Apparatus and methods for controlling the parallelism of a susceptor relative to a gas distribution assembly are also described.

Abstract translation: 描述了用于在批处理室中对准大型基座的装置和方法。 还描述了用于控制基座相对于气体分配组件的平行度的装置和方法。

公开(公告)号：US20240145271A1

公开(公告)日：2024-05-02

申请号：US17977422

申请日：2022-10-31

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Michael Carrell ,  William T. Weaver ,  Charles T. Carlson

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67201 ,  H01L21/67718 ,  H01L21/68707

Abstract: A system for transferring semiconductor workpieces from a load lock to an orientation station and onto a platen is disclosed. The system comprises two load locks, a multi-workpiece orientation station, two multi-pick robots that transfer a plurality of workpieces between a respective load lock and the multi-workpiece orientation station, and two backend robots that transfer individual workpieces between the multi-workpiece orientation station and the platen.

公开(公告)号：US20240145270A1

公开(公告)日：2024-05-02

申请号：US17977417

申请日：2022-10-31

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Michael Carrell ,  William T. Weaver ,  Charles T. Carlson

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67201 ,  H01L21/67718 ,  H01L21/68707

Abstract: A system for transferring semiconductor workpieces from a load lock to an orientation station and on to a platen is disclosed. The system comprises two load locks, two robots, and one orientation station. Each robot is associated with a respective load lock and follows a fixed sequence. The robot returns a processed workpiece to the load lock and also removes an unprocessed workpiece. The robot then moved to the orientation station, where it removes an aligned workpiece from the orientation station and deposits the unprocessed workpiece on the orientation station. Next, the robot moves to the platen, where it removes a processed workpiece and deposits the aligned workpiece. The robot then returns to the load lock and repeats this sequence.

公开(公告)号：US10597779B2

公开(公告)日：2020-03-24

申请号：US15163857

申请日：2016-05-25

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Robert Brent Vopat ,  Joseph Yudovsky ,  Jason M. Schaller

IPC: C23C16/458 ,  C23C16/455 ,  H01L21/687

Abstract: Apparatus and methods for aligning large susceptors in batch processing chambers are described. Apparatus and methods for controlling the parallelism of a susceptor relative to a gas distribution assembly are also described.

公开(公告)号：US20180190535A1

公开(公告)日：2018-07-05

申请号：US15851096

申请日：2017-12-21

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jeffrey Blahnik

IPC: H01L21/687 ,  H01L21/677 ,  G06F9/30

CPC classification number: H01L21/68764 ,  B25J9/042 ,  B25J9/043 ,  G06F9/30032 ,  H01L21/67196 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67763 ,  H01L21/68707

Abstract: Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer assembly with a robot blade with an opening therethrough, the opening sized to allow the support surface of the support fixture to pass through the opening. A first actuator is connected to the wafer rotation assembly to rotate the support fixture assembly about an axis of the shaft. A second actuator is connected to the wafer rotation assembly to move the support fixture assembly a stroke distance along the axis of the shaft. Process kits including the wafer rotation assemblies and robot blades with openings can used to retrofit existing mainframe processing chambers.