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公开(公告)号：US20240145271A1
公开(公告)日：2024-05-02
申请号：US17977422
申请日：2022-10-31
Applicant: Applied Materials, Inc.
Inventor： Jason M. Schaller , Michael Carrell , William T. Weaver , Charles T. Carlson
IPC: H01L21/67 , H01L21/677 , H01L21/687
CPC classification number: H01L21/67201 , H01L21/67718 , H01L21/68707
Abstract: A system for transferring semiconductor workpieces from a load lock to an orientation station and onto a platen is disclosed. The system comprises two load locks, a multi-workpiece orientation station, two multi-pick robots that transfer a plurality of workpieces between a respective load lock and the multi-workpiece orientation station, and two backend robots that transfer individual workpieces between the multi-workpiece orientation station and the platen.
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公开(公告)号：US20240145270A1
公开(公告)日：2024-05-02
申请号：US17977417
申请日：2022-10-31
Applicant: Applied Materials, Inc.
Inventor： Jason M. Schaller , Michael Carrell , William T. Weaver , Charles T. Carlson
IPC: H01L21/67 , H01L21/677 , H01L21/687
CPC classification number: H01L21/67201 , H01L21/67718 , H01L21/68707
Abstract: A system for transferring semiconductor workpieces from a load lock to an orientation station and on to a platen is disclosed. The system comprises two load locks, two robots, and one orientation station. Each robot is associated with a respective load lock and follows a fixed sequence. The robot returns a processed workpiece to the load lock and also removes an unprocessed workpiece. The robot then moved to the orientation station, where it removes an aligned workpiece from the orientation station and deposits the unprocessed workpiece on the orientation station. Next, the robot moves to the platen, where it removes a processed workpiece and deposits the aligned workpiece. The robot then returns to the load lock and repeats this sequence.
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公开(公告)号：USD938373S1
公开(公告)日：2021-12-14
申请号：US29710816
申请日：2019-10-25
Applicant: Applied Materials, Inc.
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