公开(公告)号：USD938373S1

公开(公告)日：2021-12-14

申请号：US29710816

申请日：2019-10-25

Applicant: Applied Materials, Inc.

Designer： Jason M. Schaller ,  Benjamin Riordon ,  Mitchell DiSanto ,  Paul Forderhase ,  Gary Wyka ,  Jeffrey Hudgens ,  Paul Z. Wirth ,  Charles T. Carlson ,  Siva Chandrasekar ,  Michael Carrell ,  Venkata Raghavaiah Chowdhary Kode ,  Dmitry A. Dzilno ,  Juan Carlos Rocha-Alvarez

公开(公告)号：US20160358792A1

公开(公告)日：2016-12-08

申请号：US15238604

申请日：2016-08-16

Applicant: Applied Materials, Inc.

Inventor： Nagendra V. Madiwal ,  Robert Irwin Decottignies ,  Andrew Nguyen ,  Paul B. Reuter ,  Angela R. Sico ,  Michael Kuchar ,  Travis Morey ,  Mitchell DiSanto

IPC: H01L21/67 ,  C23C16/455

CPC classification number: H01L21/6719 ,  C23C14/564 ,  C23C14/566 ,  C23C16/4401 ,  C23C16/45563 ,  H01L21/67126 ,  Y10T29/49432

Abstract: An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.

Abstract translation: 电子设备制造系统可以包括提供传送室和处理室之间的界面的室端口组件。 在一些实施例中，室端口组件可以被配置成将净化气体流引导到腔室端口组件的衬底传送区域。 在其它实施例中，处理室和/或转移室可以被配置成将净化气体流引导到基板传送区域中。 吹扫气体流入衬底传送区域的流动可以防止和/或减少颗粒物质从腔室硬件到在转移室和处理室之间转移的衬底上的迁移。 还提供了组装腔室端口组件的方法，以及其他方面。

公开(公告)号：US10381247B2

公开(公告)日：2019-08-13

申请号：US15238604

申请日：2016-08-16

Applicant: Applied Materials, Inc.

Inventor： Nagendra V. Madiwal ,  Robert Irwin Decottignies ,  Andrew Nguyen ,  Paul B. Reuter ,  Angela R. Sico ,  Michael Kuchar ,  Travis Morey ,  Mitchell DiSanto

IPC: H01L21/67 ,  C23C14/56 ,  C23C16/44 ,  C23C16/455

Abstract: An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.