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公开(公告)号：US11555250B2
公开(公告)日：2023-01-17
申请号：US17241241
申请日：2021-04-27
Applicant: Applied Materials, Inc.
Inventor： Yuanhong Guo , Sheng Michael Guo , Marek W Radko , Steven Victor Sansoni , Nagendra Madiwal , Matvey Farber , Pingping Gou , Song-Moon Suh , Jeffrey C. Hudgens , Yuji Murayama , Anurag Bansal , Shaofeng Chen , Michael Kuchar
Abstract: A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.
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公开(公告)号：US11087998B2
公开(公告)日：2021-08-10
申请号：US16359561
申请日：2019-03-20
Applicant: Applied Materials, Inc.
Inventor： Michael Robert Rice , Michael Meyers , John J. Mazzocco , Dean C. Hruzek , Michael Kuchar , Sushant S. Koshti , Penchala N. Kankanala , Eric A. Englhardt
IPC: H01L21/67 , H01L21/677
Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
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3.发明申请公开(公告)号：US20180124960A1
公开(公告)日：2018-05-03
申请号：US15336279
申请日：2016-10-27
Applicant: Applied Materials, Inc.
Inventor： Joseph Vincent , Michael Kuchar , Dean C. Hruzek , Vijayabaskar Soundarrajan , Pandu Maddherla , Adam J. Wyatt , Robert M. McAndrew
CPC classification number: H05K13/021 , H01L21/67126 , H01L21/67201 , H05K7/1401 , H05K7/20209
Abstract: An equipment front end module interface of an equipment front end module including environmental controls. The equipment front end module interface includes a first mounting member configured to couple to a load lock assembly, and a flexible seal coupled to the first mounting member. The flexible seal provides sealing between the equipment front end module and the load lock assembly and also accommodates axial and other misalignment between the load lock assembly and the equipment front end module during assembly. Equipment front end modules including the equipment front end module interface and methods of assembling a load lock assembly to the equipment front end module using the equipment front end module interface are provided, as are other aspects.
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公开(公告)号：US09435025B2
公开(公告)日：2016-09-06
申请号：US14036754
申请日：2013-09-25
Applicant: Applied Materials, Inc.
Inventor： Nagendra V. Madiwal , Robert Irwin Decottignies , Andrew Nguyen , Paul B. Reuter , Angela R. Sico , Michael Kuchar , Travis Morey , Mitchell Disanto
IPC: H01L21/677 , C23C14/56 , H01L21/67 , C23C16/44
CPC classification number: H01L21/6719 , C23C14/564 , C23C14/566 , C23C16/4401 , C23C16/45563 , H01L21/67126 , Y10T29/49432
Abstract: An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.
Abstract translation: 电子设备制造系统可以包括提供传送室和处理室之间的界面的室端口组件。 在一些实施例中，室端口组件可以被配置成将净化气体流引导到腔室端口组件的衬底传送区域。 在其它实施例中，处理室和/或转移室可以被配置成将净化气体流引导到基板传送区域中。 吹扫气体流入衬底传送区域的流动可以防止和/或减少颗粒物质从腔室硬件到在转移室和处理室之间转移的衬底上的迁移。 还提供了组装腔室端口组件的方法，以及其他方面。
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公开(公告)号：US20210143034A1
公开(公告)日：2021-05-13
申请号：US17248395
申请日：2021-01-22
Applicant: Applied Materials, Inc.
Inventor： Michael Robert Rice , Michael Meyers , John J. Mazzocco , Dean C. Hruzek , Michael Kuchar , Sushant S. Koshti , Penchala N. Kankanala , Eric A. Englhardt
IPC: H01L21/67 , H01L21/677
Abstract: A substrate processing system includes a factory interface, a transfer chamber, and a robot. The transfer chamber includes four first facets adapted for attachment to one or more first processing chambers and three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets. The system includes a second processing chamber having a first interface attached to a first of the three second facets and a load lock attached to a second of the three second facets and to the factory interface. The system also includes a robot attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the one or more first processing chambers, the second processing chamber, and the load lock.
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Patent Agency Ranking
公开(公告)号：US10159169B2
公开(公告)日：2018-12-18
申请号：US15336279
申请日：2016-10-27
Applicant: Applied Materials, Inc.
Inventor： Joseph Vincent , Michael Kuchar , Dean C. Hruzek , Vijayabaskar Soundarrajan , Pandu Maddherla , Adam J. Wyatt , Robert M. McAndrew
Abstract: An equipment front end module interface of an equipment front end module including environmental controls. The equipment front end module interface includes a first mounting member configured to couple to a load lock assembly, and a flexible seal coupled to the first mounting member. The flexible seal provides sealing between the equipment front end module and the load lock assembly and also accommodates axial and other misalignment between the load lock assembly and the equipment front end module during assembly. Equipment front end modules including the equipment front end module interface and methods of assembling a load lock assembly to the equipment front end module using the equipment front end module interface are provided, as are other aspects.
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公开(公告)号：US20160358792A1
公开(公告)日：2016-12-08
申请号：US15238604
申请日：2016-08-16
Applicant: Applied Materials, Inc.
Inventor： Nagendra V. Madiwal , Robert Irwin Decottignies , Andrew Nguyen , Paul B. Reuter , Angela R. Sico , Michael Kuchar , Travis Morey , Mitchell DiSanto
IPC: H01L21/67 , C23C16/455
CPC classification number: H01L21/6719 , C23C14/564 , C23C14/566 , C23C16/4401 , C23C16/45563 , H01L21/67126 , Y10T29/49432
Abstract: An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.
Abstract translation: 电子设备制造系统可以包括提供传送室和处理室之间的界面的室端口组件。 在一些实施例中，室端口组件可以被配置成将净化气体流引导到腔室端口组件的衬底传送区域。 在其它实施例中，处理室和/或转移室可以被配置成将净化气体流引导到基板传送区域中。 吹扫气体流入衬底传送区域的流动可以防止和/或减少颗粒物质从腔室硬件到在转移室和处理室之间转移的衬底上的迁移。 还提供了组装腔室端口组件的方法，以及其他方面。
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公开(公告)号：US20150083330A1
公开(公告)日：2015-03-26
申请号：US14036754
申请日：2013-09-25
Applicant: Applied Materials, Inc.
Inventor： Nagendra V. Madiwal , Robert Irwin Decottignies , Andrew Nguyen , Paul B. Reuter , Angela R. Sico , Michael Kuchar , Travis Morey , Mitchell Disanto
CPC classification number: H01L21/6719 , C23C14/564 , C23C14/566 , C23C16/4401 , C23C16/45563 , H01L21/67126 , Y10T29/49432
Abstract: An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.
Abstract translation: 电子设备制造系统可以包括提供传送室和处理室之间的界面的室端口组件。 在一些实施例中，室端口组件可以被配置成将净化气体流引导到腔室端口组件的衬底传送区域。 在其它实施例中，处理室和/或转移室可以被配置成将净化气体流引导到基板传送区域中。 吹扫气体流入衬底传送区域的流动可以防止和/或减少颗粒物质从腔室硬件到在转移室和处理室之间转移的衬底上的迁移。 还提供了组装腔室端口组件的方法，以及其他方面。
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公开(公告)号：US11932950B2
公开(公告)日：2024-03-19
申请号：US18097152
申请日：2023-01-13
Applicant: Applied Materials, Inc.
Inventor： Yuanhong Guo , Sheng Michael Guo , Marek W. Radko , Steven Victor Sansoni , Nagendra Madiwal , Matvey Farber , Pingping Gou , Song-Moon Suh , Jeffrey C. Hudgens , Yuji Murayama , Anurag Bansal , Shaofeng Chen , Michael Kuchar
CPC classification number: C23F17/00 , B08B3/04 , B23C3/00 , C23C14/5873 , C23F1/16 , C23F1/20 , H01L21/67184
Abstract: A method includes machining a raw surface of a metal component to remove first native oxide from a metal base of the metal component to generate an as-machined surface of the metal component. A second native oxide is formed on the metal base of the as-machined surface of the metal component subsequent to the machining. The method further includes, subsequent to the machining, performing operations to generate a finished surface of the metal component. The operations include a surface machining of the as-machined surface of the metal component to remove the second native oxide.
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公开(公告)号：US20230151497A1
公开(公告)日：2023-05-18
申请号：US18097152
申请日：2023-01-13
Applicant: Applied Materials, Inc.
Inventor： Yuanhong Guo , Sheng Michael Guo , Marek W. Radko , Steven Victor Sansoni , Nagendra Madiwal , Matvey Farber , Pingping Gou , Song-Moon Suh , Jeffrey C. Hudgens , Yuji Murayama , Anurag Bansal , Shaofeng Chen , Michael Kuchar
Abstract: A method includes machining a raw surface of a metal component to remove first native oxide from a metal base of the metal component to generate an as-machined surface of the metal component. A second native oxide is formed on the metal base of the as-machined surface of the metal component subsequent to the machining. The method further includes, subsequent to the machining, performing operations to generate a finished surface of the metal component. The operations include a surface machining of the as-machined surface of the metal component to remove the second native oxide.
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