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公开(公告)号：US20240357775A1
公开(公告)日：2024-10-24
申请号：US18760410
申请日：2024-07-01
发明人： Mark Edward SHAW , Husam Atallah Alissa , Brandon Rubenstein , Robert Jason LANKSTON, II , Christian Belady , Bharath Ramakrishnan
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/20209 , H05K7/20263 , H05K7/20272 , H05K7/20281
摘要： Techniques for controlling cooling of electronic components in computing facilities are disclosed herein. In one embodiment, a method includes detecting a pressure drop of a coolant flowing across multiple servers in an enclosure between the inlet and outlet manifolds and a supply temperature of the coolant at the inlet manifold. The method further includes automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint.
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公开(公告)号：US20240345638A1
公开(公告)日：2024-10-17
申请号：US18298769
申请日：2023-04-11
申请人： Dell Products L.P.
发明人： ENOCH CHEN , TRAVIS C. NORTH , POMIN SHIH
CPC分类号： G06F1/203 , H05K7/20145 , H05K7/20172 , H05K7/20209
摘要： A thermal management apparatus, including: a blower, including: an impeller configured to direct airflow towards an egress; a base; and a cover, wherein the cover is coupled to the base to encase the impeller; a fin-stack configured to receive the airflow and transfer heat from the airflow, including: a plate having a perimeter; internal fins coupled to the plate and contained within the perimeter of the plate; and external fins extending external to the perimeter of the plate, wherein the fin-stack is coupled to the blower such that the external fins are positioned between the base and the cover, the external fins configured to distribute the airflow across the egress and the internal fins of the fin-stack.
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公开(公告)号：US20240334643A1
公开(公告)日：2024-10-03
申请号：US18206126
申请日：2023-06-06
发明人： RUEI-HUNG CHIOU , WEI-CHIH WANG
IPC分类号： H05K7/20
CPC分类号： H05K7/20209 , H05K7/20136
摘要： A multi-fan control system is provided. A controller, within each of a plurality of time intervals, outputs a control signal including a reading command to one of a plurality of fans, and outputs a control signal including a writing command to another of the plurality of fans. The controller, within each of the plurality of time intervals, only reads operation state data of the one of the plurality of fans that receives the control signal including the reading command, and writes operation control commands respectively into the plurality of fans.
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公开(公告)号：US12100637B2
公开(公告)日：2024-09-24
申请号：US17187397
申请日：2021-02-26
发明人： Jae Ho Chung , Soo Ho Noh , Jin Seok Park , Se Young Jang
IPC分类号： H01L23/367 , C09K5/14 , G06F1/20 , H01L23/373 , H05K1/02 , H05K7/20 , H05K9/00
CPC分类号： H01L23/3675 , C09K5/14 , G06F1/20 , G06F1/203 , H01L23/3736 , H05K1/0203 , H05K7/20 , H05K7/20209 , H05K9/00 , H05K1/0216 , H05K2201/10371
摘要： An example electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.
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公开(公告)号：US12089351B2
公开(公告)日：2024-09-10
申请号：US16884568
申请日：2020-05-27
申请人： BLACK & DECKER INC.
发明人： Snehal S. Choksi , Geoffrey S. Howard , Daniel L. Schwarz , Thomas C. Kohler , Keith Hopwood , Richard A. Sy , Chun-Te Chin , Jiunping Huang , Minghuang Hung
IPC分类号： H05K5/00 , H01M10/42 , H01M10/613 , H01M10/6235 , H01M10/627 , H01M10/6551 , H01M10/6554 , H01M10/6563 , H01M50/244 , H01M50/247 , H04B3/54 , H05K1/02 , H05K7/14 , H05K7/20 , H04B14/02
CPC分类号： H05K5/0086 , H01M10/425 , H01M10/4257 , H01M10/613 , H01M10/6235 , H01M10/627 , H01M10/6551 , H01M10/6554 , H01M10/6563 , H01M50/244 , H01M50/247 , H04B3/54 , H05K1/0203 , H05K7/1427 , H05K7/20154 , H05K7/20172 , H05K7/20209 , H01M2010/4271 , H01M2220/20 , H01M2220/30 , H04B14/026
摘要： A power supply apparatus is provided including a housing, at least one battery receptacle for receiving at least one removable battery pack, an inverter that converts a direct-current (DC) signal from the at least one battery pack to an alternating-current (AC) signal, and a controller that applies a pulse-width modulation (PWM) signal to the inverter to shape the AC signal with a lower harmonic distortion relative to a square wave. For each full cycle of the AC signal, the controller sets the duty cycle to approximately 100% within a first period corresponding to a peak area of the AC signal, to less than approximately 100% but greater than approximately 0% within a second period in which the AC signal transitions from the peak to a zero-cross following the first period, and to 0% within a third period corresponding to the zero-cross of the AC signal following the second period.
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公开(公告)号：US12079317B2
公开(公告)日：2024-09-03
申请号：US18329486
申请日：2023-06-05
申请人： Vapor IO Inc.
发明人： Colton Malone Crawford , Steven White , Ben Chavez , Frank Basso
IPC分类号： G06F21/31 , E04H5/02 , G05B19/042 , G06F21/86 , H05K7/14 , H05K7/18 , H05K7/20 , A62C37/40 , E05B47/00 , H02S20/22
CPC分类号： G06F21/31 , E04H5/02 , G05B19/042 , G06F21/86 , H05K7/1495 , H05K7/1497 , H05K7/1498 , H05K7/18 , H05K7/183 , H05K7/20209 , H05K7/20745 , H05K7/2079 , H05K7/20836 , A62C37/40 , E05B47/0002 , G05B2219/2614 , G05B2219/2639 , H02S20/22
摘要： Provided is a rack, comprising: a plurality of rack units; and a plurality of lockers each housing a different respective subset of the rack units, wherein respective lockers among the plurality comprise: a first respective barrier disposed between a respective pair of the rack units; a second respective barrier disposed between another respective pair of the rack units; a third respective barrier that is orthogonal to the first barrier and the second barrier, the third respective barrier being moveably or removably coupled to the rack; a respective volume configured to receive one or more computing devices; and a respective lock configured to secure the third respective barrier to the rack in the closed position when in a locked state.
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公开(公告)号：US20240268066A1
公开(公告)日：2024-08-08
申请号：US18135507
申请日：2023-04-17
发明人： TSUNG-MING CHEN
CPC分类号： H05K7/20209 , G06F1/20 , H05K7/20172
摘要： A method for controlling fan and a heat dissipation device are provided, the heat dissipation device includes a plurality of dual-rotor fans and a boost unit. Each dual-rotor fan includes two rotor units. A first end of the boost unit is connected to the rotor units of the dual-rotor fans, a second end is connected to a power supply terminal. The heat dissipation device determines if the dual-rotor fan with one of the rotor units fails to be a target fan; controls the boost unit to increase a voltage of a power supply of the power supply terminal to a first predetermined voltage value, to output the power supply to a normal one of the rotor units of the target fan.
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公开(公告)号：US20240268064A1
公开(公告)日：2024-08-08
申请号：US18638846
申请日：2024-04-18
发明人： Edward Joy , Albert Pedoeem , Kriss Replogle , Charles Magrino
IPC分类号： H05K7/20
CPC分类号： H05K7/20172 , H05K7/20209 , H05K7/20409
摘要： An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.
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公开(公告)号：US12029015B2
公开(公告)日：2024-07-02
申请号：US17132600
申请日：2020-12-23
发明人： Mark Edward Shaw , Husam Atallah Alissa , Brandon Rubenstein , Robert Jason Lankston, II , Christian Belady , Bharath Ramakrishnan
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/20209 , H05K7/20263 , H05K7/20272 , H05K7/20281
摘要： Techniques for controlling cooling of electronic components in computing facilities are disclosed herein. In one embodiment, a method includes detecting a pressure drop of a coolant flowing across multiple servers in an enclosure between the inlet and outlet manifolds and a supply temperature of the coolant at the inlet manifold. The method further includes automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint.
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公开(公告)号：US12029006B2
公开(公告)日：2024-07-02
申请号：US17871692
申请日：2022-07-22
申请人： Dell Products L.P.
CPC分类号： H05K7/20209 , G06F1/206 , H05K7/20145
摘要： Methods and systems for thermally managing data processing systems are disclosed. Data processing systems may provide computer implemented services to users thereof and/or other devices. The data processing systems may include various hardware components that perform computations used to provide the computer implemented services and may generate heat as a byproduct. To dissipate the heat generated by the hardware components, airflows proximate to the hardware components may be used to extract the heat. Once extracted, the heated airflows may be exhausted from the data processing systems. To facilitate use of the exhausted airflows, the airflows may be selectively directed in accordance with user preferences.
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