ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER

    公开(公告)号:US20220009106A1

    公开(公告)日:2022-01-13

    申请号:US17473188

    申请日:2021-09-13

    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

    ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER

    公开(公告)号:US20210008727A1

    公开(公告)日:2021-01-14

    申请号:US16922805

    申请日:2020-07-07

    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

    Robot for simultaneous substrate transfer

    公开(公告)号:US11590662B2

    公开(公告)日:2023-02-28

    申请号:US17473188

    申请日:2021-09-13

    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

    TEMPERATURE-CONTROLLABLE PROCESS CHAMBERS, ELECTRONIC DEVICE PROCESSING SYSTEMS, AND MANUFACTURING METHODS

    公开(公告)号:US20210358777A1

    公开(公告)日:2021-11-18

    申请号:US17389201

    申请日:2021-07-29

    Inventor: Paul Z. Wirth

    Abstract: A process chamber includes one or more vertical walls at least partially defining a chamber portion of the process chamber, and multiple zones located about a periphery of the one or more vertical walls, wherein one or more of the multiple zones extends from a top to a bottom of the one or more vertical walls. The process chamber further includes a plurality of temperature control devices, each thermally coupled to the one or more vertical walls in one of the multiple zones, and a controller coupled to the plurality of temperature control devices and configured to set temperatures of one or more of the plurality of temperature control devices to obtain temperature uniformity within 2% across a substrate located in the chamber portion.

    TEMPERATURE-CONTROLLABLE PROCESS CHAMBERS, ELECTRONIC DEVICE PROCESSING SYSTEMS, AND MANUFACTURING METHODS

    公开(公告)号:US20200243354A1

    公开(公告)日:2020-07-30

    申请号:US16261763

    申请日:2019-01-30

    Inventor: Paul Z. Wirth

    Abstract: A temperature-controllable process chamber configured to process substrates may include one or more vertical walls at least partially defining a chamber portion of the process chamber. Multiple zones may be located about a periphery of the one or more vertical walls and multiple temperature control devices are thermally coupled to the periphery of the one or more vertical walls in each of the multiple zones. A controller coupled to the temperature control devices may be configured to individually control temperatures of the multiple temperature control devices to obtain substantial temperature uniformity across a substrate located in the chamber portion. Other systems and methods of manufacturing substrates are disclosed.

    DISTURBANCE COMPENSATION FOR SUBSTRATE PROCESSING RECIPES

    公开(公告)号:US20230195072A1

    公开(公告)日:2023-06-22

    申请号:US17559061

    申请日:2021-12-22

    CPC classification number: G05B19/188 G05B2219/45031

    Abstract: A method includes receiving first sensor data associated with a first iteration of a first recipe operation of a substrate processing recipe. The method further includes determining disturbance data, the disturbance data being a difference between the first sensor data and first setpoint data of the first recipe operation. The method further includes determining, based at least in part on the disturbance data, a first actuation value associated with one or more components of a processing chamber. Actuation of the one or more components according to the first actuation value compensates for the disturbance data. The method further includes causing the actuation of the one or more components based on the first actuation value during a subsequent iteration of the first recipe operation of the substrate processing recipe to compensate for the disturbance data.

    SLIT VALVE PNEUMATIC CONTROL
    10.
    发明申请

    公开(公告)号:US20210301929A1

    公开(公告)日:2021-09-30

    申请号:US16836231

    申请日:2020-03-31

    Abstract: Disclosed are a slit valve apparatus and a method for controlling a slit valve. The slit valve apparatus includes a slit valve assembly and a servo-control system in communication with the slit valve assembly. The slit valve assembly includes at least one gate able to transition between an open position and a closed position, at least one pneumatic actuator, at least one proportional pneumatic valve including a plurality of controllers, and a continuous position sensor. The servo-control system includes a centralized controller that generates a control signal and adjusts the movement of the at least one gate based on the position trajectory for the gate, a linear position measurement of the gate from the continuous position sensor, and fluid pressure/flow measurements from the plurality of controllers.

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