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公开(公告)号：US11940216B1
公开(公告)日：2024-03-26
申请号：US18242752
申请日：2023-09-06
发明人： Huanfeng Feng , Gangfeng Sun , Zhongzhan Zhang
CPC分类号： F27B3/18 , F27D3/0031 , F27D13/00 , F27D17/002 , F27D17/004 , F27D2003/0034
摘要： Disclosed is a high-temperature flue gas recovery apparatus for a melting furnace, which relates to copper production, including a preheating chamber and a feeding mechanism, a lower end of the preheating chamber being in communication with a feeding port of the melting furnace, the feeding mechanism being disposed above the preheating chamber to deliver feedstock into the preheating chamber, a plurality of layers of buffer mechanisms layered in an upper-lower manner being provided in the preheating chamber, each layer of the buffer mechanism including a buffer element and a drive element, the drive element driving the corresponding buffer element to move such that the feedstock on the buffer element of an upper-layer buffer mechanism falls onto the buffer element of a lower-layer buffer mechanism, a gap allowing a gas to pass through being provided between the buffer mechanisms and an inner wall of the preheating chamber. The solution may recover the high-temperature flue gas produced by the melting furnace to preheat the feedstock, thereby enhancing the energy utilization ratio during the production process; moreover, with the plurality of buffer mechanisms, the solution may charge the feedstock into the melting furnace in small quantity per time and in multiple times, facilitating accurate control of the feeding rate and amount of the feedstock.
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公开(公告)号：US20240071787A1
公开(公告)日：2024-02-29
申请号：US18270148
申请日：2021-12-27
申请人： Viatron Co., Ltd.
发明人： Hyoung June Kim , Byung Kuk Kim , Wang Jun Park , Oh Sung Kwon , Tae Hyeong Kim , Byeong Gyu Jeong
CPC分类号： H01L21/67115 , F27B17/0025 , F27D3/0084 , G01J5/0007
摘要： The present disclosure discloses a substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam transmitting plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a VCSEL beam having a single wavelength to a lower surface of the flat substrate through the beam transmitting plate; and an emissivity measuring configured to measure the laser beam reflected from the lower surface or an upper surface the flat substrate, thereby measuring the emissivity of the flat substrate.
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公开(公告)号：US11892236B2
公开(公告)日：2024-02-06
申请号：US17038910
申请日：2020-09-30
申请人： Schenck Process LLC
发明人： Michael M. Chen
IPC分类号： F27B1/00 , B01J6/00 , B01D46/02 , B01D46/48 , C04B11/036 , F27B1/08 , F27B1/21 , F27B1/26 , F27B1/28 , F27D1/00 , F27D3/08 , F27D15/02 , F27D3/00 , F27D19/00
CPC分类号： F27B1/005 , B01D46/023 , B01D46/48 , B01J6/004 , C04B11/036 , F27B1/08 , F27B1/21 , F27B1/26 , F27B1/28 , F27D1/0003 , F27D3/08 , F27D15/02 , F27D2003/0038 , F27D2003/0046 , F27D2003/0083 , F27D2019/0071
摘要： A system for conditioning stucco particulate material includes a vessel having separation chamber in communication with a holding chamber having a holding volume therein. The conditioning system includes the holding volume sufficient to condition the stucco particulate material therein and/or a control system configured to delay discharge of the stucco particulate material from the holding chamber. The system for conditioning stucco particulate material is configured to increase residence time of the stucco particulate material in the holding chamber to promote calcining conditioning therein.
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公开(公告)号：US11858036B2
公开(公告)日：2024-01-02
申请号：US16877296
申请日：2020-05-18
发明人： Paul V. Cooper
IPC分类号： B22D41/00 , B22D35/04 , F04D7/06 , F27D3/14 , F27D27/00 , F27B3/04 , B22D39/02 , F04D29/02 , B22D39/00 , F27D3/00 , F04D29/42
CPC分类号： B22D41/00 , B22D35/04 , B22D39/02 , F04D7/065 , F04D29/026 , F27B3/045 , F27D3/14 , F27D27/005 , B22D39/00 , F04D29/426 , F27D2003/0054 , F27M2001/012
摘要： A system and method for filling a mold with molten aluminum includes a molten metal pump, a vessel configured to contain molten metal, a mold for receiving molten metal, and a conduit between the vessel and the mold. Molten metal is pumped in the vessel until it reaches a level at which it flows through the conduit and into the mold. The flow of molten metal into the mold is stabilized to maintain a level of molten metal in the mold. A skin of solid metal forms between the mold and the conduit, at which time the pumping of molten metal can cease. The mold with solid metal in it can be moved.
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公开(公告)号：US20230395405A1
公开(公告)日：2023-12-07
申请号：US18235467
申请日：2023-08-18
申请人： ASM IP Holding B.V.
CPC分类号： H01L21/67161 , B65G47/90 , F27D3/0084 , F27D5/0037 , F27D7/06 , H01L21/67017 , H01L21/67109 , H01L21/67126 , H01L21/67196 , H01L21/67742 , H01L21/67766 , B65G2201/0297 , H01L21/67769
摘要： The disclosure relates to substrate processing apparatus, with a first and second reactor, each reactor configured for processing a plurality of substrates; and, a substrate handling robot constructed and arranged to transfer substrates between a substrate cassette at a substrate transfer position and the first and second reactor. The apparatus is constructed and arranged with a maintenance area between the first and second reactors to allow maintenance of the reactors from the maintenance area to both the first and second reactor.
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公开(公告)号：US11798821B2
公开(公告)日：2023-10-24
申请号：US17072457
申请日：2020-10-16
IPC分类号： H01L21/67 , H01L21/683 , H01L21/687 , F27B17/00 , G03F7/16 , F27D3/00 , H05B3/22 , H05B1/02 , F27D5/00
CPC分类号： H01L21/67109 , F27B17/0025 , F27B17/0083 , F27D3/0084 , F27D5/0037 , G03F7/168 , H01L21/6838 , H01L21/68742 , H05B1/0233 , H05B3/22
摘要： A substrate processing apparatus includes: a heat processing unit configured to perform a heat process on a substrate having a film formed on the substrate; and a control unit configured to control the heat processing unit, wherein the heat processing unit comprises: a heater configured to support and heat the substrate; a chamber configured to cover the substrate supported on the heater; a gas ejector having a head in which ejection holes are formed, and configured to eject a gas from the ejection holes toward a surface of the substrate; an outer peripheral exhauster configured to evacuate a processing space inside the chamber from an outer peripheral region located further outward than a peripheral edge of the substrate supported on the heater; and a central exhauster configured to evacuate the processing space from a central region located further inward than the peripheral edge of the substrate supported on the heater.
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公开(公告)号：US11634241B1
公开(公告)日：2023-04-25
申请号：US17737588
申请日：2022-05-05
摘要： Certain embodiments of the inventive technology may be described as apparatus for melting and reshaping metal from a first shape into a second shape in a microgravity or zero gravity environment, such as a space foundry, where such apparatus includes feedstock input componentry (5) configured to accept conductive metal feedstock (7) having the first shape, a furnace and a furnace pre-stage (22) established upflow of the furnace, a plurality of electromagnetic field generators (10), each of which is configured to generate an electromagnetic field, to, e.g., steer, melt and/or move the metal, whether melt or otherwise, and casting componentry (15) configured to reshape molten metal to the second shape. Certain embodiments may achieve a high degree of control over electromagnetic fields by offering individual adjustment of one or more electrical parameters of the electromagnetic field generators (10).
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公开(公告)号：US11598580B2
公开(公告)日：2023-03-07
申请号：US16959410
申请日：2019-01-15
摘要： The present invention relates to a furnace device for heating a plate, in particular a metal plate, by convection. The furnace device has a housing, in which a temperature control region for temperature-controlling a component part and an adjustment region are formed, wherein the adjustment region has a temperature control device for adjusting a temperature of a temperature control fluid. Further, the furnace device has a positioning device for positioning the plate in the temperature control region in a predetermined orientation, and a ventilator, which is arranged in the housing and which is adapted to circulate the temperature control fluid in the housing between the temperature control region and the adjustment region such that the temperature control fluid is flowable in a flow direction along a surface of the plate.
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公开(公告)号：US11587815B2
公开(公告)日：2023-02-21
申请号：US16935275
申请日：2020-07-22
申请人： ASM IP Holding B.V.
IPC分类号： H01L21/68 , H01L21/677 , F27B17/00 , B65G1/04 , F27D3/00 , H01L21/67 , H01L21/673 , F27D3/12
摘要： A vertical batch furnace assembly for processing wafers comprising a cassette handling space, a wafer handling space, and a first wall separating the cassette handling space from the wafer handling space. The wall having a wafer transfer opening. The wafer transfer opening is associated with a cassette carrousel comprising a carrousel stage having a plurality of cassette support surfaces each configured for supporting a wafer cassette. The carrousel stage is rotatable by an actuator around a substantially vertical axis to transfer each cassette support surface to a wafer transfer position in front of the wafer transfer opening and to at least one cassette load/retrieve position, wherein the vertical batch furnace assembly is configured to load or retrieve a wafer cassette on or from a cassette support surface of the carrousel stage which is in the at least one load/retrieve position.
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公开(公告)号：US11587814B2
公开(公告)日：2023-02-21
申请号：US16935269
申请日：2020-07-22
申请人： ASM IP Holding B.V.
IPC分类号： B65G1/04 , H01L21/677 , F27B17/00 , F27D3/12 , F27D3/00 , H01L21/67 , H01L21/673 , B65G1/06
摘要： A vertical batch furnace assembly for processing wafers comprising a cassette handling space, a wafer handling space, and an internal wall separating the cassette handling space and the wafer handling space. The cassette handling space is provided with a cassette storage configured to store a plurality of wafer cassettes provided with a plurality of wafers. The cassette handling space is also provided with a cassette handler configured to transfer wafer cassettes between the cassette storage and a wafer transfer position. The wafer handling space is provided with a wafer handler configured to transfer wafers between a wafer cassette in the wafer transfer position and a wafer boat in a wafer boat transfer position. The internal wall is provided with a wafer transfer opening adjacent the wafer transfer position for a wafer cassette from or to which wafers are to be transferred. The cassette storage comprises two cassette storage carousels.
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