公开(公告)号：US12224156B2

公开(公告)日：2025-02-11

申请号：US17244824

申请日：2021-04-29

Applicant: Applied Materials, Inc.

Inventor： Xiaopu Li ,  Jozef Kudela ,  Kallol Bera ,  Tsutomu Tanaka ,  Dmitry A. Dzilno

IPC: H01J37/32

Abstract: Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating a plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave generator is electrically coupled to the first end of the powered electrode through a first feed and a second microwave generator is electrically coupled to the second end of the powered electrode through a second feed.

公开(公告)号：US20250014934A1

公开(公告)日：2025-01-09

申请号：US18773943

申请日：2024-07-16

Applicant: Applied Materials, Inc.

Inventor： Jian Li ,  Dmitry A. Dzilno ,  Juan Carlos Rocha-Alvarez ,  Zheng J. Ye ,  Paul L. Brillhart

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/687

Abstract: Exemplary support assemblies may include an electrostatic chuck body defining a support surface that defines a substrate seat. The assemblies may include a support stem coupled with the chuck body. The assemblies may include a heater embedded within the chuck body. The assemblies may include a first bipolar electrode embedded within the electrostatic chuck body between the heater and support surface. The assemblies may include a second bipolar electrode embedded within the chuck body between the heater and support surface. Peripheral edges of one or both of the first and second bipolar electrodes may extend beyond an outer periphery of the seat. The assemblies may include an RF power supply coupled with the first and second bipolar electrodes. The assemblies may include a first floating DC power supply coupled with the first bipolar electrode. The assemblies may include a second floating DC power supply coupled with the second bipolar electrode.

公开(公告)号：US12094748B2

公开(公告)日：2024-09-17

申请号：US17405929

申请日：2021-08-18

Applicant: Applied Materials, Inc.

Inventor： Jian Li ,  Edward P. Hammond ,  Juan Carlos Rocha-Alvarez ,  Dmitry A. Dzilno ,  Wenhao Zhang

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/67 ,  H05B3/22

CPC classification number: H01L21/6833 ,  H01J37/32357 ,  H01J37/32724 ,  H01L21/67196 ,  H05B3/22 ,  H01L21/67167

Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a plurality of apertures. The systems may include a plurality of lid stacks equal to a number of the plurality of apertures. The systems may include a plurality of substrate support assemblies equal to the number of apertures defined through the lid plate. Each assembly may be disposed in one of the processing regions and may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. Each assembly may include a heater embedded within the chuck body. Each assembly may include bipolar electrodes between the heater and the substrate support surface. Each assembly may include a conductive mesh embedded within the body between the heater and bipolar electrodes.

公开(公告)号：US11956883B2

公开(公告)日：2024-04-09

申请号：US18088310

申请日：2022-12-23

Applicant: Applied Materials, Inc.

Inventor： Zheng John Ye ,  Daemian Raj Benjamin Raj ,  Shailendra Srivastava ,  Nikhil Sudhindrarao Jorapur ,  Ndanka O. Mukuti ,  Dmitry A. Dzilno ,  Juan Carlos Rocha

IPC: H01J37/32 ,  H05H1/46

CPC classification number: H05H1/46 ,  H01J37/32128 ,  H01J37/32165 ,  H01J37/32183

Abstract: A method and apparatus for controlling RF plasma attributes is disclosed. Some embodiments of the disclosure provide RF sensors within processing chambers operable at high temperatures. Some embodiments provide methods of measuring RF plasma attributes using RF sensors within a processing chamber to provide feedback control for an RF generator.

公开(公告)号：US11823871B2

公开(公告)日：2023-11-21

申请号：US16976569

申请日：2019-03-01

Applicant: Applied Materials, Inc.

Inventor： Jozef Kudela ,  Tsutomu Tanaka ,  Alexander V. Garachtchenko ,  Dmitry A. Dzilno ,  Avinash Shervegar ,  Kallol Bera ,  Xiaopu Li ,  Anantha K. Subramani ,  John C. Forster

IPC: C23C16/509 ,  H01J37/32 ,  C23C16/455

CPC classification number: H01J37/32211 ,  C23C16/45536 ,  H01J37/3244 ,  H01J37/32348 ,  H01J37/32541 ,  H01J2237/332

Abstract: Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave generator is electrically coupled to the first end of the powered electrode through a first feed and a second microwave generator is electrically coupled to the second end of the powered electrode through a second feed.

公开(公告)号：US11705312B2

公开(公告)日：2023-07-18

申请号：US17134280

申请日：2020-12-26

Applicant: Applied Materials, Inc.

Inventor： Tsutomu Tanaka ,  Jared Ahmad Lee ,  Rakesh Ramadas ,  Dmitry A. Dzilno ,  Gregory J. Wilson ,  Sriharish Srinivasan

IPC: H01J37/32

CPC classification number: H01J37/32733 ,  H01J37/3244 ,  H01J37/32082 ,  H01J37/32522 ,  H01J2237/20235 ,  H01J2237/332

Abstract: The disclosure describes a plasma source assemblies comprising a differential screw assembly, an RF hot electrode, a top cover, an upper housing and a lower housing. The differential screw assembly is configured to provide force to align the plasma source assembly vertically matching planarity of a susceptor. More particularly, the differential screw assembly increases a distance between the top cover and the upper housing to align the gap with the susceptor. The disclosure also provides a better thermal management by cooling fins. A temperature capacity of the plasma source assemblies is extended by using titanium electrode. The disclosure provides a cladding material covering a portion of a first surface of RF hot electrode, a second surface of RF hot electrode, a bottom surface of RF hot electrode, a portion of a surface of the showerhead and a portion of lower housing surface.

公开(公告)号：US20220208531A1

公开(公告)日：2022-06-30

申请号：US17134280

申请日：2020-12-26

Applicant: Applied Materials, Inc.

Inventor： Tsutomu Tanaka ,  Jared Ahmad Lee ,  Rakesh Ramadas ,  Dmitry A. Dzilno ,  Gregory J. Wilson ,  Sriharish Srinivasan

IPC: H01J37/32

Abstract: The disclosure describes a plasma source assemblies comprising a differential screw assembly, an RF hot electrode, a top cover, an upper housing and a lower housing. The differential screw assembly is configured to provide force to align the plasma source assembly vertically matching planarity of a susceptor. More particularly, the differential screw assembly increases a distance between the top cover and the upper housing to align the gap with the susceptor. The disclosure also provides a better thermal management by cooling fins. A temperature capacity of the plasma source assemblies is extended by using titanium electrode. The disclosure provides a cladding material covering a portion of a first surface of RF hot electrode, a second surface of RF hot electrode, a bottom surface of RF hot electrode, a portion of a surface of the showerhead and a portion of lower housing surface.

公开(公告)号：US11315763B2

公开(公告)日：2022-04-26

申请号：US17009167

申请日：2020-09-01

Applicant: Applied Materials, Inc.

Inventor： Kallol Bera ,  Dmitry A. Dzilno ,  Anantha K. Subramani ,  John C. Forster ,  Tsutomu Tanaka

IPC: H01J37/32

Abstract: Plasma source assemblies comprising an RF hot electrode having a body and at least one return electrode spaced from the RF hot electrode to provide a gap in which a plasma can be formed. An RF feed is connected to the RF hot electrode at a distance from the inner peripheral end of the RF hot electrode that is less than or equal to about 25% of the length of the RF hot electrode. The RF hot electrode can include a leg and optional triangular portion near the leg that extends at an angle to the body of the RF hot electrode. A cladding material on one or more of the RF hot electrode and the return electrode can be variably spaced or have variable properties along the length of the plasma gap.

公开(公告)号：US11114282B2

公开(公告)日：2021-09-07

申请号：US16895904

申请日：2020-06-08

Applicant: Applied Materials, Inc.

Inventor： Philip Allan Kraus ,  Thai Cheng Chua ,  Christian Amormino ,  Dmitry A. Dzilno

IPC: H01J37/32 ,  H01Q3/34 ,  H01Q21/00 ,  H03B5/24

Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.

公开(公告)号：US10720311B2

公开(公告)日：2020-07-21

申请号：US16669257

申请日：2019-10-30

Applicant: Applied Materials, Inc.

Inventor： Philip Allan Kraus ,  Thai Cheng Chua ,  Christian Amormino ,  Dmitry A. Dzilno

IPC: H01J37/32 ,  H01Q3/34 ,  H01Q21/00 ,  H03B5/24

Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.