-
公开(公告)号：US20200303167A1
公开(公告)日：2020-09-24
申请号：US16895904
申请日：2020-06-08
Applicant: Applied Materials, Inc.
Inventor： Philip Allan Kraus , Thai Cheng Chua , Christian Amormino , Dmitry A. Dzilno
Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.
-
公开(公告)号：US11081317B2
公开(公告)日：2021-08-03
申请号：US15958470
申请日：2018-04-20
Applicant: Applied Materials, Inc.
Inventor： Thai Cheng Chua , Christian Amormino , Hanh Nguyen , Kallol Bera , Philip Allan Kraus
Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.
-
公开(公告)号：US20180294143A1
公开(公告)日：2018-10-11
申请号：US15485217
申请日：2017-04-11
Applicant: APPLIED MATERIALS, INC.
Inventor： Thai Cheng Chua , Farzad Houshmand , Christian Amormino , Philip Allan Kraus
IPC: H01J37/32
Abstract: Embodiments include a plasma processing tool that includes a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources include an array of applicators that are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. Additionally, the plurality of modular microwave sources may include an array of microwave amplification modules. In an embodiment, each microwave amplification module may be coupled to at least one of the applicators in the array of applicators. According to an embodiment, the dielectric body be planar, non-planar, symmetric, or non-symmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In such an embodiment, at least one applicator may be positioned in at least one of the recesses.
-
公开(公告)号：US20240282554A1
公开(公告)日：2024-08-22
申请号：US18652609
申请日：2024-05-01
Applicant: Applied Materials, Inc.
Inventor： Thai Cheng Chua , Christian Amormino , Hanh Nguyen , Kallol Bera , Philip Allan Kraus
CPC classification number: H01J37/32201 , H01J37/32311 , H01J2237/3321 , H01J2237/3323 , H01J2237/334 , H01J2237/335 , H03F3/19 , H03F3/21
Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.
-
公开(公告)号：US10714372B2
公开(公告)日：2020-07-14
申请号：US15710763
申请日：2017-09-20
Applicant: Applied Materials, Inc.
Inventor： Thai Cheng Chua , Philip Allan Kraus , Travis Lee Koh , Christian Amormino , Jaeyong Cho
IPC: H01L21/00 , H01L21/683 , H01J37/32 , C23C16/511 , C23C16/505 , C23C16/458 , C23C16/455 , H01L21/67 , H01L21/687 , C23C16/50 , C23C16/46 , H01L21/02 , H01L21/223 , H01L21/3065
Abstract: The present disclosure generally relates to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide independent pulses of DC voltage through a switching system to electrodes disposed through the ESC substrate support, or to electrodes disposed on a surface of the ESC, or to electrodes embedded in the ESC substrate support. The switching system can independently alter the frequency and duty cycle of the pulsed DC voltage that is coupled to each electrode. During processing of the substrate, the process rate, such as etch rate or deposition rate, can be controlled independently in regions of the substrate because the process rate is a function of the frequency and duty cycle of the pulsed DC voltage. The processing uniformity of the process performed on the substrate is improved.
-
Patent Agency Ranking
公开(公告)号：US20210327685A1
公开(公告)日：2021-10-21
申请号：US17359318
申请日：2021-06-25
Applicant: Applied Materials, Inc.
Inventor： Thai Cheng Chua , Christian Amormino , Hanh Nguyen , Kallol Bera , Philip Allan Kraus
IPC: H01J37/32
Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.
-
公开(公告)号：US11114282B2
公开(公告)日：2021-09-07
申请号：US16895904
申请日：2020-06-08
Applicant: Applied Materials, Inc.
Inventor： Philip Allan Kraus , Thai Cheng Chua , Christian Amormino , Dmitry A. Dzilno
Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.
-
公开(公告)号：US10720311B2
公开(公告)日：2020-07-21
申请号：US16669257
申请日：2019-10-30
Applicant: Applied Materials, Inc.
Inventor： Philip Allan Kraus , Thai Cheng Chua , Christian Amormino , Dmitry A. Dzilno
Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.
-
公开(公告)号：US12002654B2
公开(公告)日：2024-06-04
申请号：US17359318
申请日：2021-06-25
Applicant: Applied Materials, Inc.
Inventor： Thai Cheng Chua , Christian Amormino , Hanh Nguyen , Kallol Bera , Philip Allan Kraus
CPC classification number: H01J37/32201 , H01J37/32311 , H01J2237/3321 , H01J2237/3323 , H01J2237/334 , H01J2237/335 , H03F3/19 , H03F3/21
Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.
-
公开(公告)号：US10707058B2
公开(公告)日：2020-07-07
申请号：US15485217
申请日：2017-04-11
Applicant: APPLIED MATERIALS, INC.
Inventor： Thai Cheng Chua , Farzad Houshmand , Christian Amormino , Philip Allan Kraus
IPC: H01J37/32
Abstract: Embodiments include a plasma processing tool that includes a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources include an array of applicators that are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. Additionally, the plurality of modular microwave sources may include an array of microwave amplification modules. In an embodiment, each microwave amplification module may be coupled to at least one of the applicators in the array of applicators. According to an embodiment, the dielectric body be planar, non-planar, symmetric, or non-symmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In such an embodiment, at least one applicator may be positioned in at least one of the recesses.
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.022 seconds)
