公开(公告)号：US12094707B2

公开(公告)日：2024-09-17

申请号：US17070821

申请日：2020-10-14

Applicant: Applied Materials, Inc.

Inventor： Kelvin Chan ,  Travis Koh ,  Simon Huang ,  Philip Allan Kraus

IPC: H01L21/02 ,  C23C16/26 ,  C23C16/50 ,  C23C16/52

CPC classification number: H01L21/02274 ,  C23C16/26 ,  C23C16/52 ,  C23C16/50

Abstract: Embodiments include a method of processing a substrate. In an embodiment, the method comprises flowing one or more source gasses into a processing chamber, and inducing a plasma from the source gases with a plasma source that is operated in a first mode. In an embodiment, the method may further comprise biasing the substrate with a DC power source that is operated in a second mode. In an embodiment, the method may further comprise depositing a film on the substrate.

公开(公告)号：US12002654B2

公开(公告)日：2024-06-04

申请号：US17359318

申请日：2021-06-25

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Christian Amormino ,  Hanh Nguyen ,  Kallol Bera ,  Philip Allan Kraus

IPC: H01J37/32 ,  H03F3/19 ,  H03F3/21

CPC classification number: H01J37/32201 ,  H01J37/32311 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01J2237/334 ,  H01J2237/335 ,  H03F3/19 ,  H03F3/21

Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.

公开(公告)号：US11551905B2

公开(公告)日：2023-01-10

申请号：US15925739

申请日：2018-03-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Yaoling Pan ,  Vijaykumar Krithivasan ,  Shimin Mao ,  Kelvin Chan ,  Michael D. Willwerth ,  Anantha Subramani ,  Ashish Goel ,  Chih-shun Lu ,  Philip Allan Kraus ,  Patrick John Tae ,  Leonard Tedeschi

IPC: H01J37/244 ,  H01L21/67 ,  H01L41/047 ,  H01L41/053 ,  H01L41/29 ,  H01L41/04 ,  H01J37/32 ,  H01L41/31

Abstract: Embodiments described herein include a resonant process monitor and methods of forming such a resonant process monitor. In an embodiment, the resonant process monitor includes a frame that has a first opening and a second opening. In an embodiment, a resonant body seals the first opening of the frame. In an embodiment, a first electrode on a first surface of the resonant body contacts the frame and a second electrode is on a second surface of the resonant body. Embodiments also include a back plate that seals the second opening of the frame. In an embodiment the back plate is mechanically coupled to the frame, and the resonant body, the back plate, and interior surfaces of the frame define a cavity.

公开(公告)号：US20210313153A1

公开(公告)日：2021-10-07

申请号：US17351088

申请日：2021-06-17

Applicant: Applied Materials, Inc.

Inventor： Joseph F. AuBuchon ,  James Carducci ,  Larry D. Elizaga ,  Richard C. Fovell ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.

公开(公告)号：US11049694B2

公开(公告)日：2021-06-29

申请号：US16586597

申请日：2019-09-27

Applicant: Applied Materials, Inc.

Inventor： Joseph F. AuBuchon ,  James Carducci ,  Larry D. Elizaga ,  Richard C. Fovell ,  Philip Allan Kraus ,  Thai Cheng Chua

IPC: H01J37/32 ,  H01P1/208

Abstract: Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.

公开(公告)号：US11037764B2

公开(公告)日：2021-06-15

申请号：US15588597

申请日：2017-05-06

Applicant: Applied Materials, Inc.

Inventor： Philip Allan Kraus ,  Thai Cheng Chua ,  Mani Subramani

IPC: H01J37/32 ,  H01J27/18 ,  H05H1/46 ,  C23C16/511 ,  C23C14/35

Abstract: Embodiments include methods and apparatuses that include a plasma processing tool that includes a plurality of magnets. In one embodiment, a plasma processing tool may comprise a processing chamber and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources includes an array of applicators positioned over a dielectric plate that forms a portion of an outer wall of the processing chamber, and an array of microwave amplification modules. In an embodiment, each microwave amplification module is coupled to one or more of the applicators in the array of applicators. In an embodiment, the plasma processing tool may include a plurality of magnets. In an embodiment, the magnets are positioned around one or more of the applicators.

公开(公告)号：US10985009B2

公开(公告)日：2021-04-20

申请号：US16374345

申请日：2019-04-03

Applicant: Applied Materials, Inc.

Inventor： Lakmal Charidu Kalutarage ,  Mark Saly ,  David Thompson ,  William John Durand ,  Kelvin Chan ,  Hanhong Chen ,  Philip Allan Kraus

IPC: H01L21/02 ,  C23C16/513 ,  C23C16/26

Abstract: Embodiments include a method for forming a carbon containing film. In an embodiment, the method comprises flowing a precursor gas into a processing chamber. For example the precursor gas comprises carbon containing molecules. In an embodiment, the method further comprises flowing a co-reactant gas into the processing chamber. In an embodiment, the method further comprises striking a plasma in the processing chamber. In an embodiment plasma activated co-reactant molecules initiate polymerization of the carbon containing molecules in the precursor gas. Embodiments may also include a method that further comprises depositing a carbon containing film onto a substrate in the processing chamber.

公开(公告)号：US10904996B2

公开(公告)日：2021-01-26

申请号：US15710667

申请日：2017-09-20

Applicant: Applied Materials, Inc.

Inventor： Travis Lee Koh ,  Haitao Wang ,  Philip Allan Kraus ,  Vijay D. Parkhe ,  Daniel Distaso ,  Christopher A. Rowland ,  Mark Markovsky ,  Robert Casanova

IPC: H05H1/34 ,  H02N13/00 ,  H05B7/18 ,  H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: Embodiments described herein generally relate to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide pulsed DC voltage, and methods of applying a pulsed DC voltage, to a substrate during plasma assisted or plasma enhanced semiconductor manufacturing processes.

公开(公告)号：US20200343065A1

公开(公告)日：2020-10-29

申请号：US16828602

申请日：2020-03-24

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Hanh Nguyen ,  Philip Allan Kraus

IPC: H01H37/76 ,  H05H1/46 ,  H01L35/28 ,  H05K7/20

Abstract: Embodiments disclosed herein include a high-frequency emission module. In an embodiment, the high-frequency emission module comprises a solid state high-frequency power source, an applicator for propagating high-frequency electromagnetic radiation from the power source, and a thermal break coupled between the power source and the applicator. In an embodiment, the thermal break comprises a substrate, a trace on the substrate, and a ground plane.

公开(公告)号：US20200340858A1

公开(公告)日：2020-10-29

申请号：US16828609

申请日：2020-03-24

Applicant: Applied Materials, Inc.

Inventor： Philip Allan Kraus ,  Kelvin Chan ,  Travis Koh ,  Blake Erickson ,  Upendra Ummethala

IPC: G01J3/18 ,  G02B6/42 ,  G01J3/02

Abstract: Embodiments disclosed herein include an optical sensor system. In an embodiment, the optical sensor system comprises a processing chamber and a sensor. In an embodiment, the sensor comprises a first diffraction grating oriented in a first direction, a second diffraction grating oriented in a second direction, and a detector for detecting electromagnetic radiation diffracted from the first grating and the second grating. In an embodiment, the optical sensor system further comprises an optical coupling element, where the optical coupling element optically couples an interior of the processing chamber to the sensor.