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公开(公告)号:US12132191B2
公开(公告)日:2024-10-29
申请号:US17904699
申请日:2021-02-18
申请人: VITO NV
发明人: Danny Havermans , Sébastien Sallard , Ahmed Shafique , Dirk Vangeneugden , Annick Vanhulsel , An Hardy
IPC分类号: H01M4/04 , C01B17/02 , C23C16/26 , C23C16/30 , C23C16/34 , C23C16/40 , H01M4/36 , H01M4/62 , H01M4/02 , H01M10/052
CPC分类号: H01M4/0428 , C01B17/0248 , C23C16/26 , C23C16/305 , C23C16/34 , C23C16/40 , H01M4/366 , H01M4/624 , H01M4/625 , C01P2002/52 , C01P2004/80 , C01P2006/40 , H01M2004/028 , H01M10/052
摘要: The present disclosure is related to a method for applying a functional compound on sulfur particles by means of an atmospheric pressure plasma discharge including a gas or an activated gas flow resulting from the atmospheric pressure plasma discharge. The coating composition includes an inorganic electrically conductive compound, an electrically conductive carbon compound, an organic precursor compound of a conjugated polymer, a precursor of a hybrid organic-inorganic compound, or a mixture, and the functional compound provides the sulfur particles with an electrically conductive surface.
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公开(公告)号:US12129078B2
公开(公告)日:2024-10-29
申请号:US17685554
申请日:2022-03-03
申请人: YETI Coolers, LLC
发明人: Colby Brunet
IPC分类号: B65D25/14 , A47G19/22 , B65D81/38 , C23C16/26 , C23C16/509
CPC分类号: B65D25/14 , A47G19/2288 , B65D81/3869 , C23C16/26 , C23C16/509
摘要: Systems and methods for coating one or more surfaces of a drinking container with diamond-like carbon. The systems and methods may position a metallic structure of a container into electrically-conducting contact with a first electrode, and use a probe that combines an electrode and gas channel to introduce a precursor gas into an internal compartment of a container for enhanced surface coating of the metallic structure.
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公开(公告)号:US20240347335A1
公开(公告)日:2024-10-17
申请号:US18635055
申请日:2024-04-15
申请人: TES Co., Ltd
发明人: Kwang-Ki Kim , Nam-Seo Kim
IPC分类号: H01L21/02 , C23C16/26 , C23C16/505
CPC分类号: H01L21/02115 , C23C16/26 , C23C16/505 , H01L21/02205 , H01L21/02274
摘要: Disclosed are an amorphous carbon film having relatively low compressive stress while also having high selectivity and a method for depositing the same. The method includes (a) loading a substrate into a chamber, and (b) depositing an amorphous carbon film doped with oxygen and nitrogen on the substrate by discharging a precursor containing carbon, a precursor containing oxygen, and a precursor containing nitrogen.
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公开(公告)号:US20240337030A1
公开(公告)日:2024-10-10
申请号:US18743569
申请日:2024-06-14
申请人: Commonwealth Scientific and Industrial Research Organisation , NewSouth Innovations Pty Limited
发明人: Zhaojun Han , Constantine Tsounis , Rose Amal
IPC分类号: C25B11/065 , C01B32/184 , C01B32/186 , C01B32/194 , C23C16/26 , C23C16/44 , C23C16/50 , C23C16/56 , C25B1/02 , C25B3/07 , C25B3/26 , H01B1/04 , H01G11/34 , H01M4/62
CPC分类号: C25B11/065 , C01B32/184 , C01B32/186 , C01B32/194 , C23C16/26 , C23C16/4418 , C23C16/50 , C23C16/56 , C25B1/02 , C25B3/07 , C25B3/26 , H01B1/04 , H01M4/625 , C01P2002/82 , C01P2002/85 , C01P2004/03 , C01P2006/40 , H01G11/34
摘要: Provided are a method for preparing a vertical branched graphene comprising treating a pristine vertical graphene with an inert plasma in the absence of an introduced carbon source to develop a vertical branched graphene. The method may also include pre-treating a substrate surface with an inert plasma; depositing a pristine vertical graphene onto the substrate surface by contacting the substrate surface with a deposition plasma comprising a carbon source gas for a deposition period. Also provided are a vertical branched graphene attached to a substrate surface, the vertical branched graphene having a trunk portion extending from the substrate surface, said trunk possessing an increased degree of branching as the distance from the substrate surface increases; and a freestanding branched graphene with a proximal end and a distal end, the proximal end comprising a trunk portion, the trunk portion possessing and increased degree of branching as the distance from the proximal end increases and the distance to the distal end decreases.
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公开(公告)号:US20240327974A1
公开(公告)日:2024-10-03
申请号:US18260785
申请日:2022-01-18
申请人: Viesturs Kalnins
发明人: Viesturs Kalnins
IPC分类号: C23C16/26 , C01B32/186 , C23C16/46
CPC分类号: C23C16/26 , C01B32/186 , C23C16/463
摘要: The presented invention relates to the graphene and other carbon nanomaterial synthesis which requires a metal substrate-catalyst, elevated temperature and carbon precursors. The method for the synthesis of graphene and other carbon nanomaterials on a ferromagnetic substrate in the ambient atmosphere includes the following steps: 1) a ferromagnetic substrate is introduced in a closed chamber in the ambient atmosphere: 2) a carbon precursor is introduced in the same chamber: 3) the substrate is heated by electromagnetic induction 4) the carbon precursor is evaporated and/or thermally decomposed: 5) produced gases come into contact with the hot substrate: 6) the substrate is rapidly cooled. In addition, the carbon precursor is ignited, or the combustion and evaporation and/or thermal decomposition are performed separately by using the same or two different carbon precursors.
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公开(公告)号:US20240304436A1
公开(公告)日:2024-09-12
申请号:US18546140
申请日:2022-02-14
发明人: Miyako KANEKO , Naoko SUZUKI
IPC分类号: H01L21/02 , C23C16/26 , C23C16/455 , C23C16/458 , C23C16/505 , C23C16/52
CPC分类号: H01L21/02115 , C23C16/26 , C23C16/45529 , C23C16/45544 , C23C16/4586 , C23C16/505 , C23C16/52
摘要: Provided are a substrate processing method and a substrate processing apparatus that improve an etching resistance and suppress a film stress. A substrate processing method of forming a carbon-based film on a substrate includes: a process of placing the substrate on a stage; a first film forming process of forming a first carbon-based film having a first stress; a second film forming process of forming a second carbon-based film having a second stress; and a third film forming process of repeating the first film forming process and the second film forming process to form a stacked body of the first carbon-based film and the second carbon-based film, wherein the first stress and the second stress are oriented in a same direction, and the first stress and the second stress have different intensities.
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公开(公告)号:US12084758B2
公开(公告)日:2024-09-10
申请号:US17625016
申请日:2020-07-07
申请人: PARAGRAF LIMITED
发明人: Hugh Glass , Ivor Guiney , Martin Tyler , Robert Wallis , Rosie Baines , Simon Thomas
IPC分类号: C01B32/186 , B23K26/402 , C23C16/26 , C23C16/46 , C23C16/56 , G01R33/00 , G01R33/07 , B23K101/40
CPC分类号: C23C16/26 , B23K26/402 , C23C16/46 , C23C16/56 , G01R33/0052 , G01R33/07 , B23K2101/40
摘要: The present invention provides a method for the production of an electronic device, the method comprising: (i) providing a substrate comprising first and second layers on a heated susceptor in a reaction chamber, the chamber having a plurality of cooled inlets arranged so that, in use, the inlets are distributed across the substrate and have a constant separation from the substrate, (ii) supplying a flow comprising a precursor compound through the inlets and into the reaction chamber to thereby decompose the precursor compound and form a graphene layer structure on a surface of the first layer of the substrate, wherein the inlets are cooled to less than 100° C. and the susceptor is heated to a temperature of at least 50° C. in excess of a decomposition temperature of the precursor, (iii) selectively laser ablating the graphene to expose one or more portions of the surface of the first layer of the substrate, and (iv) selectively laser ablating the surface of the first layer of the substrate to expose one or more portions of the second layer of the substrate, wherein the first layer is an electrically conductive layer and the second layer is an electrically insulative layer, or wherein the second layer is an electrically conductive layer and the first layer is an electrically insulative layer.
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公开(公告)号:US20240290615A1
公开(公告)日:2024-08-29
申请号:US18647252
申请日:2024-04-26
申请人: Soitec
发明人: Young-Pil Kim
CPC分类号: H01L21/02658 , C23C16/24 , C23C16/26 , C23C16/4404 , C23C16/4405 , H01L21/02238
摘要: A support for a semiconductor structure comprises a base substrate and a charge trapping layer on the base substrate. The charge trapping layer comprises an alternating stack of at least one polycrystalline charge trapping material and at least one polycrystalline interlayer. The charge trapping material has a grain size between 100 nanometers (nm) and 1000 nm, and/or a lattice parameter greater than a lattice parameter of the at least one interlayer. Also disclosed is a semiconductor structure comprising such support.
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公开(公告)号:US20240280383A1
公开(公告)日:2024-08-22
申请号:US18652060
申请日:2024-05-01
发明人: Hikaru FUJIWARA
CPC分类号: G01D5/24 , C23C16/26 , C23C16/505 , C23C16/52 , G01B11/27 , H01J37/32642 , H01J2237/24564 , H01J2237/24578 , H01J2237/3321
摘要: A measurement method according to an exemplary embodiment acquires a measured value indicating a capacitance between a measuring instrument and an edge ring in a chamber. The measuring instrument includes a base substrate and a sensor electrode provided on the base substrate. The method includes holding, on a stage in the chamber, the edge ring having a conductive film formed on a surface thereof. The method includes transporting the measuring instrument to a region on the stage which is surrounded by the edge ring. The method includes acquiring the measured value indicating the capacitance between the measuring instrument and the edge ring having the conductive film by using the measuring instrument transported to the inner side of the region.
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公开(公告)号:US12062537B2
公开(公告)日:2024-08-13
申请号:US17439948
申请日:2020-03-18
IPC分类号: H01L21/02 , C23C16/26 , C23C16/455 , C23C16/505 , H01L21/308 , H01L21/311 , H01L21/3213
CPC分类号: H01L21/02274 , C23C16/26 , C23C16/45536 , C23C16/505 , H01L21/02115 , H01L21/0228 , H01L21/3081 , H01L21/3086 , H01L21/31144 , H01L21/32139
摘要: A method for depositing a carbon ashable hard mask layer on a substrate includes a) arranging a substrate in a processing chamber; b) setting chamber pressure in a predetermined pressure range; c) setting a substrate temperature in a predetermined temperature range from −20° C. to 200° C.; d) supplying a gas mixture including hydrocarbon precursor and one or more other gases; and e) striking plasma by supplying RF plasma power for a first predetermined period to deposit a carbon ashable hard mask layer on the substrate.
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