公开(公告)号：US20250037969A1

公开(公告)日：2025-01-30

申请号：US18734266

申请日：2024-06-05

Applicant: NuFlare Technology, Inc.

Inventor： Tatsuya MUROFUSHI ,  Kuniaki KAWAHARA ,  Yasuo SENGOKU ,  Ayako TANAKA ,  Toru ARIIZUMI

IPC: H01J37/304 ,  H01J37/244 ,  H01J37/317

Abstract: In one embodiment, a charged particle beam writing apparatus includes a high-voltage power supply configured to apply an acceleration voltage for charged particles to an emission unit, a deflector configured to deflect a charged particle beam emitted from the emission unit, a discharge sensor configured to output an output value indicating a change in a case where a discharge occurs in a column in which the emission unit and the deflector are arranged or in the high-voltage power supply, and a discharge detection control unit configured to convert the output value from the discharge sensor into a conversion value with the same sign, calculate an integral value of the conversion value over a fixed period of time, and determine, based on the integral value, whether or not a discharge that causes a pattern error has occurred.

公开(公告)号：US12205791B2

公开(公告)日：2025-01-21

申请号：US17158811

申请日：2021-01-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Arvind Shankar Raman ,  Harikrishnan Rajagopal ,  John Forster

IPC: H01J37/244 ,  G01R21/133 ,  G01R27/26 ,  G06N20/00 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H04Q9/00

Abstract: Methods and systems for rating a current substrate support assembly based on impedance circuit electron flow are provided. Data associated with an amount of radio frequency (RF) power flowed through an electrical component of a current substrate support assembly during a current testing process performed for the current substrate support assembly is provided as input to a trained machine learning model. One or more outputs of the trained machine learning model are obtained. A measurement value for an electron flow across an impedance circuit of the current substrate support assembly is extracted from the one or more outputs. In response to a determination that the extracted measurement value for the electron flow satisfies an electron flow criterion, a first quality rating is assigned to the current substrate support assembly.

公开(公告)号：US12198893B2

公开(公告)日：2025-01-14

申请号：US18647096

申请日：2024-04-26

Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)

Inventor： Hak Sung Kim ,  Dong Woon Park ,  Heon Su Kim ,  Sang Ii Kim

IPC: H01J37/244 ,  H01J37/32

Abstract: A plasma process monitoring apparatus using terahertz waves is provided. A plasma process monitoring apparatus using terahertz waves may comprise: a first monitoring module disposed in a direction parallel to the width direction of a wafer on the outside of a plasma chamber in which the wafer is introduced and monitoring plasma formed inside the plasma chamber during a plasma process for forming a film on the wafer by using terahertz waves; and a second monitoring module disposed outside the plasma chamber in the thickness direction of the wafer so as to face the wafer and monitoring the wafer on which a film is formed on a surface through the plasma process by using the terahertz waves.

公开(公告)号：US12196692B2

公开(公告)日：2025-01-14

申请号：US17769690

申请日：2020-09-30

Applicant: ASML NETHERLANDS B.V.

Inventor： Weiming Ren ,  Xuedong Liu ,  Zhong-wei Chen ,  Xiaoyu Ji ,  Xiaoxue Chen ,  Weimin Zhou ,  Frank Nan Zhang

IPC: G01N23/2202 ,  G01N1/44 ,  G01N23/2251 ,  H01J37/02 ,  H01J37/244 ,  H01J37/28

Abstract: Systems and methods of providing a probe spot in multiple modes of operation of a charged-particle beam apparatus are disclosed. The method may comprise activating a charged-particle source to generate a primary charged-particle beam and selecting between a first mode and a second mode of operation of the charged-particle beam apparatus. In the flooding mode, the condenser lens may focus at least a first portion of the primary charged-particle beam passing through an aperture of the aperture plate to form a second portion of the primary charged-particle beam, and substantially all of the second portion is used to flood a surface of a sample. In the inspection mode, the condenser lens may focus a first portion of the primary charged-particle beam such that the aperture of the aperture plate blocks off peripheral charged-particles to form the second portion of the primary charged-particle beam used to inspect the sample surface.

公开(公告)号：US20240412940A1

公开(公告)日：2024-12-12

申请号：US18332969

申请日：2023-06-12

Applicant: AIRSEM TECHNOLOGIES LTD.

Inventor： Jenny SHKLOVSKY ,  Peter BEKER ,  Vladimir WAINSTEIN

IPC: H01J37/18 ,  H01J37/16 ,  H01J37/20 ,  H01J37/244

Abstract: A charged particle beam device, comprising a charged particle beam source situated in a first-pressure environment, a sample support operative to support a sample situated in a second-pressure environment, the second-pressure environment having a higher pressure than the first-pressure environment, and a membrane assembly separating the first-pressure environment from the second-pressure environment, the membrane assembly comprising a pressure-sealing membrane being substantially transparent to a charged particle beam from the charged particle beam source, a supporting membrane layer being formed with a cornerless aperture, the pressure-sealing membrane being bonded to the supporting membrane layer, and a holding frame being formed with a second aperture larger than and overlying the cornerless aperture. The charged particle beam device may further comprise an electron-detecting subassembly, the electron-detecting subassembly comprising at least one metal line defining a shape, for detection of electrons resulting from an interaction of the charged particle beam and the sample.

公开(公告)号：US20240369389A1

公开(公告)日：2024-11-07

申请号：US18772701

申请日：2024-07-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Srikanth Krishnamurthy ,  Ming Xu ,  Ashley M. Okada ,  Ramachandra Murthy Gunturi ,  Vijay Parkhe

IPC: G01F1/20 ,  C23C16/40 ,  C23C16/455 ,  H01J37/244 ,  H01J37/32 ,  H01L21/67 ,  H05K3/30

Abstract: A sensor assembly includes a substrate including an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further including electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the outer region to provide a hermetic seal. The sensor assembly further includes a sensor device coupled to the substrate, via the electrical contact pads, at the inner region.

公开(公告)号：US20240363318A1

公开(公告)日：2024-10-31

申请号：US18765661

申请日：2024-07-08

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Wun-Kai TSAI ,  Wen-Che LIANG ,  Chao-Keng LI ,  Zheng-Jie XU ,  Chih-Kuo CHANG ,  Sing-Tsung LI ,  Feng-Kuang WU ,  Hsu-Shui LIU

IPC: H01J37/32 ,  C23C16/505 ,  G05B19/4065 ,  H01J37/244 ,  H01L21/66 ,  H01L21/67

CPC classification number: H01J37/32926 ,  C23C16/505 ,  G05B19/4065 ,  H01J37/244 ,  H01J37/32183 ,  H01L21/67069 ,  H01L21/67253 ,  H01L22/20 ,  G05B2219/45031 ,  H01J2237/3321 ,  H01J2237/334

Abstract: A fabrication system for fabricating IC is provided. A processing tool includes a RF sensor. The RF sensor wirelessly detects intensity of a RF signal. A computation device extracts statistical characteristics with a sampling rate. When the detected intensity of the RF signal exceeds a threshold value or a threshold range, a fault detection and classification (FDC) system notifies the processing tool to adjust the RF signal or stop tool to check parts damage.

公开(公告)号：US12131881B2

公开(公告)日：2024-10-29

申请号：US17718976

申请日：2022-04-12

Applicant: JEOL Ltd.

Inventor： Takeshi Kaneko ,  Norihiro Okoshi ,  Yu Jimbo ,  Sang Tae Park

IPC: H01J37/22 ,  H01J37/244 ,  H01J37/28

CPC classification number: H01J37/22 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/022 ,  H01J2237/2802

Abstract: A contamination prevention irradiation device includes a generation unit and a mirror unit. The generation unit generates a laser beam. The mirror unit has a mirror surface for reflecting a laser beam. The laser beam reflected on the mirror surface is applied to a specimen disposed inside an objective lens. The laser beam is composed of a pulse train. Once a laser beam is applied to the specimen before observation of the specimen, deposition of contaminants on the specimen can be prevented for a predetermined subsequent period.

公开(公告)号：US20240354924A1

公开(公告)日：2024-10-24

申请号：US18303446

申请日：2023-04-19

Applicant: FEI Company

Inventor： John Flanagan ,  Andrei Novikov

IPC: G06T7/00 ,  H01J37/244

CPC classification number: G06T7/0004 ,  H01J37/244 ,  G06T2200/24 ,  G06T2207/10056 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/20092 ,  G06T2207/30148 ,  H01J2237/221

Abstract: Disclosed herein are scientific instrument support systems, as well as related methods, computing devices, and computer-readable media. For example, in some embodiments, a scientific instrument support apparatus may include: first logic to receive, from a charged particle microscope, a microscopy image of a sample; second logic to generate a first processed image by processing the microscopy image through a general machine-learning model trained using a plurality of previously processed microscopy images; third logic to retrain the general machine-learning model with a related microscopy image, wherein the related microscopy image includes a label of an object related to the sample and the related microscopy image is not included in the plurality of previously processed microscopy images; and fourth logic to generate a second processed image, different from the first processed image, by processing the microscopy image through the retrained general machine-learning model.

公开(公告)号：US12125667B2

公开(公告)日：2024-10-22

申请号：US17638275

申请日：2019-09-20

Applicant: Hitachi High-Tech Corporation

Inventor： Yasuhiro Shirasaki ,  Makoto Sakakibara ,  Momoyo Enyama ,  Hajime Kawano ,  Akira Ikegami

IPC: H01J37/22 ,  H01J37/244 ,  H01J37/28

CPC classification number: H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/24514 ,  H01J2237/2803

Abstract: A charged particle beam device includes a plurality of detectors configured to detect one or more signal charged particle beams caused by irradiation on a sample with one or more primary charged particle beams, and a control system. The control system is configured to measure an intensity distribution of the one or more signal charged particle beams detected by the plurality of detectors, and correct the intensity distribution by using a correction function. The control system is configured to generate an image based on the corrected intensity distribution.