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公开(公告)号:US12074076B2
公开(公告)日:2024-08-27
申请号:US17279810
申请日:2020-03-11
发明人: Soichiro Eto
IPC分类号: H01L21/66 , G01B11/06 , H01J37/22 , H01J37/244 , H01J37/32 , H01L21/3065 , H01L21/67
CPC分类号: H01L22/26 , G01B11/06 , G01B11/0625 , G01B11/0633 , G01B11/0666 , G01B11/0683 , H01J37/22 , H01J37/244 , H01J37/32082 , H01J37/32917 , H01J37/32926 , H01J37/32963 , H01J37/32972 , H01L21/3065 , H01L21/67253 , H01L22/12 , H01J2237/2445 , H01J2237/24578 , H01J2237/3343
摘要: A plasma processing apparatus and method with an improved processing yield, the plasma processing apparatus including detector configured to detect an intensity of a first light of a plurality of wavelengths in a first wavelength range and an intensity of a second light of a plurality of wavelengths in a second wavelength range, the first light being obtained by receiving a light which is emitted into the processing chamber from a light source disposed outside the processing chamber and which is reflected by an upper surface of the wafer, and the second light being a light transmitted from the light source without passing through the processing chamber; and a determination unit configured to determine a remaining film thickness of the film layer by comparing the intensity of the first light corrected using a change rate of the intensity of the second light.
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公开(公告)号:US20240120168A1
公开(公告)日:2024-04-11
申请号:US17768244
申请日:2019-10-31
发明人: Takashi Ohshima , Hideo Morishita , Tatsuro Ide , Naohiro Kohmu , Momoyo Enyama , Yoichi Ose , Toshihide Agemura , Junichi Katane
IPC分类号: H01J37/073 , H01J1/34 , H01J37/147 , H01J37/22 , H01J37/26 , H01J37/285
CPC分类号: H01J37/073 , H01J1/34 , H01J37/1474 , H01J37/22 , H01J37/265 , H01J37/285 , H01J2237/06333
摘要: An electron beam emitted from a photoexcited electron gun is increased in luminance. An electron gun 15 includes: a photocathode 1 including a substrate 11 and a photoelectric film 10; a light source 7 that emits pulsed excitation light; a condenser lens 2 that focuses the pulsed excitation light toward the photocathode; and an extractor electrode 3 that faces the photocathode and that accelerates an electron beam generated from the photoelectric film by focusing the pulsed excitation light by the condenser lens, transmitting the pulsed excitation light through the substrate of the photocathode, and causing the pulsed excitation light to be incident on the photocathode. The pulsed excitation light is condensed at different timings at different positions on the photoelectric film of the photocathode.
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公开(公告)号:US11875966B2
公开(公告)日:2024-01-16
申请号:US17403006
申请日:2021-08-16
发明人: Bernardo Kastrup , Johannes Catharinus Hubertus Mulkens , Marinus Aart Van Den Brink , Jozef Petrus Henricus Benschop , Erwin Paul Smakman , Tamara Druzhinina , Coen Adrianus Verschuren
CPC分类号: H01J37/263 , H01J37/023 , H01J37/15 , H01J37/22 , H01J37/244 , H01J37/28 , H01J2237/0245 , H01J2237/2817
摘要: An electron beam inspection apparatus, the apparatus including a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns, the actuator system including a plurality of first movable structures at least partly overlapping a plurality of second movable structures, the first and second movable structures supporting the plurality of electron beam columns.
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公开(公告)号:US20230420215A1
公开(公告)日:2023-12-28
申请号:US18328828
申请日:2023-06-05
IPC分类号: H01J37/244 , H01J37/22 , H01J37/302 , H01J37/32
CPC分类号: H01J37/244 , H01J37/22 , H01J37/3026 , H01J37/32174 , H01J2237/2448
摘要: A charged particle beam device for irradiating a sample arranged in a sample chamber to be observed with an electron beam includes: a plasma generation device to which a bias voltage is applicable to generate plasma containing charged particles for applying charges onto a side wall of a pattern of the sample; and a guide that guides the charged particles in the plasma generated by the plasma generation device to the pattern of the sample.
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公开(公告)号:US11749494B2
公开(公告)日:2023-09-05
申请号:US17545936
申请日:2021-12-08
IPC分类号: H01J37/22 , H01J37/244 , G01N23/2251
CPC分类号: H01J37/22 , G01N23/2251 , H01J37/244 , G01N2223/07 , G01N2223/507 , G01N2223/646 , H01J2237/2448 , H01J2237/2482
摘要: A computing unit generates a to-be-used-in-computation netlist on the basis of a to-be-used-in-calculation device model corresponding to a correction sample, estimates a first application result, on the basis of the to-be-used-in-computation netlist and an optical condition, when a charged particle beam is applied to the correction sample under the optical condition, compares the first application result and a second application result based on a detection signal when the charged particle beam is applied to the correction sample under the optical condition, and corrects the optical condition when the first application result and the second application result differ from each other.
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公开(公告)号:US20230230803A1
公开(公告)日:2023-07-20
申请号:US18190930
申请日:2023-03-27
发明人: Xingfei MAO , Gang WEI , Wei WANG , Guodong CHEN
CPC分类号: H01J37/32119 , H01J65/044 , H01J37/22 , H01L21/0273
摘要: A semiconductor reaction chamber includes a chamber body, a dielectric window, a gas inlet member, a carrier, an upper radio frequency assembly, and a plurality of ultraviolet light generation devices. The dielectric window is arranged at a top of the chamber body. The gas inlet member is arranged at a center position of the dielectric window and configured to introduce a process gas into the chamber body. The carrier is arranged inside the chamber body and configured to carry a to-be-processed wafer. The upper radio frequency assembly is arranged above the chamber body and configured to ionize the process gas introduced into the chamber body to generate a plasma and first ultraviolet light. The plurality of ultraviolet light generation devices is arranged between the dielectric window and the carrier and around the gas inlet member and configured to generate second ultraviolet light radiating toward the carrier.
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公开(公告)号:US20230207254A1
公开(公告)日:2023-06-29
申请号:US18171750
申请日:2023-02-21
申请人: FEI Company
发明人: Alexander Henstra , Pleun Dona
IPC分类号: H01J37/153 , H01J37/244 , H01J37/22
CPC分类号: H01J37/153 , H01J37/244 , H01J37/22 , H01J2237/1534
摘要: Disclosed herein are electron microscopes with improved imaging. An example electron microscope at least includes an illumination system, for directing a beam of electrons to irradiate a specimen, an elongate beam conduit, through which the beam of electrons is directed; a multipole lens assembly configured as an aberration corrector, and a detector for detecting radiation emanating from the specimen in response to said irradiation, wherein at least a portion of said elongate beam conduit extends at least through said aberration corrector and has a composite structure comprising intermixed electrically insulating material and electrically conductive material, wherein the elongate beam conduit has an electrical conductivity σ and a thickness t, with σt
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公开(公告)号:US20230197400A1
公开(公告)日:2023-06-22
申请号:US17922823
申请日:2020-06-12
发明人: Yusuke SEKI , Mitsuhiro NAKAMURA , Keisuke TANUMA
CPC分类号: H01J37/20 , H01J37/22 , H01J2237/28 , H01J2237/153
摘要: A dielectric microscopic observation is possible, which suppresses image flow regardless of scanning speed. There are provided a sample chamber 120 holding a sample 200 between a first insulating layer 121 on which a conductive layer 211 to be irradiated with a charged particle beam is laminated and a second insulating layer 122, an amplifier 141 that amplifies a potential change that occurs at an interface between the first insulating layer and the sample as the conductive layer is irradiated with the charged particle beam, and outputs the amplified result as a measurement signal, a main control unit 142 that converts the measurement signal from the amplifier into image data, and corrects the image data with a deconvolution filter 302 to generate corrected image data, a display unit 144 including an observation image display unit 501 and a filter adjustment unit 502 that displays setting information of the deconvolution filter, and an information processing device that displays the corrected image data on the observation image display unit, and when the setting information of the deconvolution filter displayed in the filter adjustment unit is changed, adjusts the deconvolution filter according to the changed setting information.
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公开(公告)号:US20230170181A1
公开(公告)日:2023-06-01
申请号:US18159852
申请日:2023-01-26
发明人: Stefan Schubert
IPC分类号: H01J37/26 , H01J37/22 , H01J37/147 , H01J37/28 , H01J37/244
CPC分类号: H01J37/265 , H01J37/22 , H01J37/28 , H01J37/244 , H01J37/1472 , H01J37/14 , H01J2237/103 , H01J2237/1532
摘要: A multiple particle beam system with a mirror mode of operation, a method for operating a multiple particle beam system with a mirror mode of operation and an associated computer program product are disclosed. The multiple particle beam system can be operated in different mirror modes of operation which allow the multiple particle beam system to be inspected and recalibrated thoroughly. A detection system configured to operate in a first detection mode and/or in a second detection mode is used for the analysis.
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10.
公开(公告)号:US20190096631A1
公开(公告)日:2019-03-28
申请号:US16132618
申请日:2018-09-17
发明人: Hidekazu Takekoshi
CPC分类号: H01J37/268 , G06T7/001 , H01J37/22 , H01J37/265 , H01J37/28 , H01J2237/082 , H01J2237/1501 , H01J2237/2817
摘要: An electron beam image acquisition apparatus includes a deflector to deflect an electron beam, a deflection control system to control the deflector, a measurement circuitry to measure, while moving a stage for placing thereon a substrate on which a figure pattern is formed, an edge position of a mark pattern arranged on the stage by scanning the mark pattern with an electron beam, a delay time calculation circuitry to calculate, using information on the edge position, a deflection control delay time which is a delay time to start deflection control occurring in the deflection control system, a correction circuitry to correct, using the deflection control delay time, a deflection position of the electron beam, and an image acquisition mechanism to include the deflector and acquire an image of the figure pattern at a corrected deflection position on the substrate.
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