Invention Grant
- Patent Title: Modular microwave source with embedded ground surface
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Application No.: US16586597Application Date: 2019-09-27
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Publication No.: US11049694B2Publication Date: 2021-06-29
- Inventor: Joseph F. AuBuchon , James Carducci , Larry D. Elizaga , Richard C. Fovell , Philip Allan Kraus , Thai Cheng Chua
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01P1/208

Abstract:
Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.
Public/Granted literature
- US20210098236A1 MODULAR MICROWAVE SOURCE WITH EMBEDDED GROUND SURFACE Public/Granted day:2021-04-01
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