公开(公告)号：US20240282554A1

公开(公告)日：2024-08-22

申请号：US18652609

申请日：2024-05-01

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Christian Amormino ,  Hanh Nguyen ,  Kallol Bera ,  Philip Allan Kraus

IPC: H01J37/32 ,  H03F3/19 ,  H03F3/21

CPC classification number: H01J37/32201 ,  H01J37/32311 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01J2237/334 ,  H01J2237/335 ,  H03F3/19 ,  H03F3/21

Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.

公开(公告)号：US10269593B2

公开(公告)日：2019-04-23

申请号：US14771494

申请日：2014-03-07

Applicant: APPLIED MATERIALS, INC.

Inventor： Joe Griffith Cruz ,  Hanh Nguyen ,  Randy Vrana ,  Karl Armstrong

IPC: H01L21/67 ,  H01L21/687 ,  C23C16/27

Abstract: Apparatus for coupling a hot wire source to a process chamber is provided herein. In some embodiments, an apparatus for coupling a hot wire source to a process chamber may include: a housing having an open end and a through hole formed through a top and a bottom of the housing; and a filament assembly configured to be disposed within the housing, the filament assembly having a frame and a plurality of filaments disposed across the frame, wherein the plurality of filaments of the filament assembly are substantially parallel with the top and the bottom of the housing and at least a portion of the plurality of filaments are disposed within the through hole of the housing when the filament assembly is disposed within the housing.

公开(公告)号：US12002654B2

公开(公告)日：2024-06-04

申请号：US17359318

申请日：2021-06-25

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Christian Amormino ,  Hanh Nguyen ,  Kallol Bera ,  Philip Allan Kraus

IPC: H01J37/32 ,  H03F3/19 ,  H03F3/21

CPC classification number: H01J37/32201 ,  H01J37/32311 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01J2237/334 ,  H01J2237/335 ,  H03F3/19 ,  H03F3/21

Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.

公开(公告)号：US20200343065A1

公开(公告)日：2020-10-29

申请号：US16828602

申请日：2020-03-24

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Hanh Nguyen ,  Philip Allan Kraus

IPC: H01H37/76 ,  H05H1/46 ,  H01L35/28 ,  H05K7/20

Abstract: Embodiments disclosed herein include a high-frequency emission module. In an embodiment, the high-frequency emission module comprises a solid state high-frequency power source, an applicator for propagating high-frequency electromagnetic radiation from the power source, and a thermal break coupled between the power source and the applicator. In an embodiment, the thermal break comprises a substrate, a trace on the substrate, and a ground plane.

公开(公告)号：US20210327685A1

公开(公告)日：2021-10-21

申请号：US17359318

申请日：2021-06-25

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Christian Amormino ,  Hanh Nguyen ,  Kallol Bera ,  Philip Allan Kraus

IPC: H01J37/32

Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.

公开(公告)号：US10943768B2

公开(公告)日：2021-03-09

申请号：US15958562

申请日：2018-04-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Hanh Nguyen ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: C23C16/455 ,  H01J37/32

Abstract: Embodiments described herein include an applicator frame for a processing chamber. In an embodiment, the applicator frame comprises a first major surface of the applicator frame and a second major surface of the applicator frame opposite the first major surface. In an embodiment, the applicator frame further comprises a through hole, wherein the through hole extends entirely through the applicator frame. In an embodiment, the applicator frame also comprises a lateral channel embedded in the applicator frame. In an embodiment the lateral channel intersects the through hole.

公开(公告)号：US20220319812A1

公开(公告)日：2022-10-06

申请号：US17840500

申请日：2022-06-14

Applicant: Applied Materials, Inc.

Inventor： Hanh Nguyen ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H01J37/32

Abstract: Embodiments described herein include a processing tool that comprises a processing chamber, a chuck for supporting a substrate in the processing chamber, a dielectric window forming a portion of the processing chamber, and a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source comprises a plurality of high-frequency emission modules. In an embodiment, each high-frequency emission module comprises, an oscillator module, amplification module, and an applicator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, the applicator is positioned proximate to the dielectric window.

公开(公告)号：US20220254641A1

公开(公告)日：2022-08-11

申请号：US17174224

申请日：2021-02-11

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Christian Valencia ,  Chikuang Wang ,  Bencherki Mebarki ,  Hanh Nguyen ,  Philip Allan Kraus

IPC: H01L21/285 ,  H01L23/532 ,  H01J37/32 ,  C23C16/26 ,  C23C16/02 ,  C23C16/511

Abstract: Embodiments disclosed herein include methods and apparatuses used to deposit graphene layers. In an embodiment, a method of depositing a graphene layer on a substrate comprises providing a substrate within a modular microwave plasma chamber, and flowing a carbon source and a hydrogen source into the modular microwave plasma chamber. In an embodiment, the method further comprises striking a plasma in the modular microwave plasma chamber, where a substrate temperature is below approximately 400° C., and depositing the graphene layer on the substrate.

公开(公告)号：US20210183621A1

公开(公告)日：2021-06-17

申请号：US17164703

申请日：2021-02-01

Applicant: Applied Materials, Inc.

Inventor： Hanh Nguyen ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H01J37/32

Abstract: Embodiments described herein include an applicator frame for a processing chamber. In an embodiment, the applicator frame comprises a first major surface of the applicator frame and a second major surface of the applicator frame opposite the first major surface. In an embodiment, the applicator frame further comprises a through hole, wherein the through hole extends entirely through the applicator frame. In an embodiment, the applicator frame also comprises a lateral channel embedded in the applicator frame. In an embodiment the lateral channel intersects the through hole.

公开(公告)号：US11501955B2

公开(公告)日：2022-11-15

申请号：US17164703

申请日：2021-02-01

Applicant: Applied Materials, Inc.

Inventor： Hanh Nguyen ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H01J37/32

Abstract: Embodiments described herein include an applicator frame for a processing chamber. In an embodiment, the applicator frame comprises a first major surface of the applicator frame and a second major surface of the applicator frame opposite the first major surface. In an embodiment, the applicator frame further comprises a through hole, wherein the through hole extends entirely through the applicator frame. In an embodiment, the applicator frame also comprises a lateral channel embedded in the applicator frame. In an embodiment the lateral channel intersects the through hole.