公开(公告)号：US12061215B2

公开(公告)日：2024-08-13

申请号：US17737682

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Xiaopu Li ,  Michelle SanPedro

IPC: G01R19/00 ,  G01R15/18 ,  G01R19/165 ,  G01R19/25

CPC classification number: G01R19/0007 ,  G01R15/18 ,  G01R19/16533 ,  G01R19/2513

Abstract: Embodiments disclosed herein include a sensor. In an embodiment, the sensor comprises a board, wherein an aperture is formed through the board, a current loop winding through the board around the aperture, and a voltage ring around the aperture and within an inner perimeter of the current loop, wherein the voltage ring comprises an interior ring, an insulator ring around the interior ring, and an exterior ring around the insulator ring.

公开(公告)号：US20230011938A1

公开(公告)日：2023-01-12

申请号：US17371575

申请日：2021-07-09

Applicant: Applied Materials, Inc.

Inventor： Saketh Pemmasani ,  Daemian Raj Benjamin Raj ,  Xiaopu Li ,  Akshay Dhanakshirur ,  Mayur Govind Kulkarni ,  Madhu Santosh Kumar Mutyala ,  Deenesh Padhi ,  Hang Yu

IPC: C23C16/455 ,  C23C16/505 ,  H01J37/32

Abstract: Exemplary semiconductor processing chambers may include a chamber body. The chambers may include a substrate support disposed within the chamber body. The substrate support may define a substrate support surface. The chambers may include a showerhead positioned supported atop the chamber body. The substrate support and a bottom surface of the showerhead may at least partially define a processing region within the semiconductor processing chamber. The showerhead may define a plurality of apertures through the showerhead. The bottom surface of the showerhead may define an annular groove or ridge that is positioned directly above at least a portion of the substrate support.

公开(公告)号：US20220028710A1

公开(公告)日：2022-01-27

申请号：US16934227

申请日：2020-07-21

Applicant: Applied Materials, Inc.

Inventor： Anantha K. Subramani ,  Yang Guo ,  Seyyed Abdolreza Fazeli ,  Nitin Pathak ,  Badri N. Ramamurthi ,  Kallol Bera ,  Xiaopu Li ,  Philip A. Kraus ,  Swaminathan T. Srinivasan

IPC: H01L21/67 ,  B65G47/90

Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body along a first surface of the first lid plate. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the plurality of apertures defined through the first lid plate. The systems may include a plurality of isolators. An isolator of the plurality of isolators may be positioned between each lid stack of the plurality of lid stacks and a corresponding aperture of the plurality of apertures defined through the first lid plate. The systems may include a plurality of dielectric plates. A dielectric plate of the plurality of dielectric plates may be seated on each isolator of the plurality of isolators.

公开(公告)号：US20240249924A1

公开(公告)日：2024-07-25

申请号：US18158379

申请日：2023-01-23

Applicant: Applied Materials, Inc.

Inventor： Jian Li ,  Kallol Bera ,  Edward P. Hammond ,  Dmitry A. Dzilno ,  Juan Carlos Rocha-Alvarez ,  Xiaopu Li

IPC: H01J37/32 ,  C23C16/458 ,  H01L21/683

CPC classification number: H01J37/32724 ,  C23C16/4586 ,  H01J37/32082 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32577 ,  H01L21/6833 ,  H01J2237/2007 ,  H01J2237/332

Abstract: Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a first bipolar electrode embedded within the electrostatic chuck body. The assemblies may include a second bipolar electrode embedded within the electrostatic chuck body. An entirety of the second bipolar electrode may be radially inward of at least a portion of the first bipolar electrode. The first bipolar electrode and the second bipolar electrode may be coaxial with one another. Each of the first bipolar electrode and the second bipolar electrode may be coupled with at least one RF power supply. Each of the first bipolar electrode and the second bipolar electrode may be coupled with at least one DC power supply.

公开(公告)号：US11908662B2

公开(公告)日：2024-02-20

申请号：US16663215

申请日：2019-10-24

Applicant: Applied Materials, Inc.

Inventor： Xiaopu Li ,  Kallol Bera ,  Edward P. Hammond, IV ,  Jonghoon Baek ,  Amit Kumar Bansal ,  Jun Ma ,  Satoru Kobayashi

IPC: H01L21/306 ,  C23C16/00 ,  H01J37/32 ,  C23C16/505

CPC classification number: H01J37/32467 ,  C23C16/505 ,  H01J37/32091 ,  H01J37/32174 ,  H01J37/32715 ,  H01J2237/24564 ,  H01J2237/3321

Abstract: Embodiments described herein relate to apparatus and techniques for radio frequency (RF) phase control in a process chamber. A process volume is defined in the process chamber by a faceplate electrode and a support pedestal. A grounding bowl is disposed within the process chamber about the support pedestal opposite the process volume. The grounding bowl substantially fills a volume other than the process volume below the support pedestal. A phase tuner circuit is coupled to an RF mesh disposed in the support pedestal and the faceplate electrode. The tuner circuit adjusts a phase difference between a phase of the faceplate electrode and a phase of the RF mesh.

公开(公告)号：US20230358790A1

公开(公告)日：2023-11-09

申请号：US17737682

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Xiaopu Li ,  Michelle SanPedro

IPC: G01R19/00 ,  G01R19/25 ,  G01R19/165 ,  G01R15/18

CPC classification number: G01R19/0007 ,  G01R19/2513 ,  G01R19/16533 ,  G01R15/18

Abstract: Embodiments disclosed herein include a sensor. In an embodiment, the sensor comprises a board, wherein an aperture is formed through the board, a current loop winding through the board around the aperture, and a voltage ring around the aperture and within an inner perimeter of the current loop, wherein the voltage ring comprises an interior ring, an insulator ring around the interior ring, and an exterior ring around the insulator ring.

公开(公告)号：US20210050187A1

公开(公告)日：2021-02-18

申请号：US16976569

申请日：2019-03-01

Applicant: Applied Materials, Inc.

Inventor： Jozef Kudela ,  Tsutomu Tanaka ,  Alexander V. Garachtchenko ,  Dmitry A. Dzilno ,  Avinash Shervegar ,  Kallol Bera ,  Xiaopu Li ,  Anantha K. Subramani ,  John C. Forster

IPC: H01J37/32 ,  C23C16/455

Abstract: Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave generator is electrically coupled to the first end of the powered electrode through a first feed and a second microwave generator is electrically coupled to the second end of the powered electrode through a second feed.

公开(公告)号：US12224156B2

公开(公告)日：2025-02-11

申请号：US17244824

申请日：2021-04-29

Applicant: Applied Materials, Inc.

Inventor： Xiaopu Li ,  Jozef Kudela ,  Kallol Bera ,  Tsutomu Tanaka ,  Dmitry A. Dzilno

IPC: H01J37/32

Abstract: Plasma source assemblies, gas distribution assemblies including the plasma source assembly and methods of generating a plasma are described. The plasma source assemblies include a powered electrode with a ground electrode adjacent a first side and a dielectric adjacent a second side. A first microwave generator is electrically coupled to the first end of the powered electrode through a first feed and a second microwave generator is electrically coupled to the second end of the powered electrode through a second feed.

公开(公告)号：US20240145252A1

公开(公告)日：2024-05-02

申请号：US17979572

申请日：2022-11-02

Applicant: Applied Materials, Inc.

Inventor： Rutvij Naik ,  Vijay Sarthy Mysore Sreedhara ,  Xiaopu Li ,  Shawyon Jafari ,  Chidambara A. Ramalingam ,  Edward P. Hammond ,  Juan Carlos Rocha-Alvarez

IPC: H01L21/3065 ,  H01J37/32

CPC classification number: H01L21/3065 ,  H01J37/32623

Abstract: Exemplary semiconductor processing chamber faceplates may include a body having a first surface and a second surface opposite the first surface. The body may define a plurality of apertures that extend through one or both of the first surface and the second surface. The faceplates may include a heater disposed within an interior of the body. The faceplates may include a first RF mesh disposed between the heater and the first surface. The faceplates may include a second RF mesh disposed between the heater and the second surface. The first RF mesh and the second RF mesh may be coupled together and form a Faraday cage about the heater.

公开(公告)号：US11959868B2

公开(公告)日：2024-04-16

申请号：US17166967

申请日：2021-02-03

Applicant: Applied Materials, Inc.

Inventor： Xiaopu Li ,  Kallol Bera ,  Yaoling Pan ,  Kelvin Chan ,  Amir Bayati ,  Philip Allan Kraus ,  Kenric T. Choi ,  William John Durand

IPC: C23C16/40 ,  C23C16/455 ,  C23C16/52 ,  G01N27/22 ,  G01N33/00 ,  H01L21/67

CPC classification number: G01N27/22 ,  C23C16/45544 ,  C23C16/45561 ,  C23C16/52 ,  G01N33/0027 ,  H01L21/67017 ,  H01L21/67253

Abstract: Embodiments disclosed herein include gas concentration sensors, and methods of using such gas concentration sensors. In an embodiment, a gas concentration sensor comprises a first electrode. In an embodiment the first electrode comprises first fingers. In an embodiment, the gas concentration sensor further comprises a second electrode. In an embodiment, the second electrode comprises second fingers that are interdigitated with the first fingers.