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公开(公告)号：US20250054797A1
公开(公告)日：2025-02-13
申请号：US18929425
申请日：2024-10-28
Applicant: Applied Materials, Inc.
Inventor： Katherine Woo , Paul L. Brillhart , Jian Li , Shinnosuke Kawaguchi , David W. Groechel , Dorothea Buechel-Rimmel , Juan Carlos Rocha-Alvarez , Paul E. Fisher , Chidambara A. Ramalingam , Joseph J. Farah
Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.
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公开(公告)号：US11851758B2
公开(公告)日：2023-12-26
申请号：US17235258
申请日：2021-04-20
Applicant: Applied Materials, Inc.
Inventor： Sumit Agarwal , Katherine Woo , Shawyon Jafari , Jian Li , Chidambara A. Ramalingam
IPC: C23C16/455 , B22D30/00
CPC classification number: C23C16/45565 , B22D30/00 , C23C16/45525 , Y10T29/49433
Abstract: Methods of manufacturing a semiconductor processing chamber showerheads may include forming a melted aluminum alloy composition, cooling the melted aluminum alloy composition at a rate of at least 103 K/sec to form solid aluminum alloy particles, and forming a core region of a showerhead from the solid aluminum alloy particles. The core region of the showerhead may include an inner core region and an outer core region that may be coupled together. The inner core region may define a plurality of apertures. The outer core region may define a channel that receives a heating element. The methods may include coating the core region with one of aluminum or aluminum oxide and joining a peripheral edge of the outer core region with an inner edge of a metallic annular liner. The metallic annular liner may have a lower thermal conductivity than the core region of the showerhead.
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公开(公告)号：US12131934B2
公开(公告)日：2024-10-29
申请号：US17063334
申请日：2020-10-05
Applicant: Applied Materials, Inc.
Inventor： Katherine Woo , Paul L. Brillhart , Jian Li , Shinnosuke Kawaguchi , David W. Groechel , Dorothea Buechel-Rimmel , Juan Carlos Rocha-Alvarez , Paul E. Fisher , Chidambara A. Ramalingam , Joseph J. Farah
CPC classification number: H01L21/68 , G01L9/08 , H01J37/32724 , H04Q9/00 , H01J2237/20264 , H01L21/67103 , H01L21/6833 , H01L21/6838
Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.
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公开(公告)号：US20210287924A1
公开(公告)日：2021-09-16
申请号：US16820205
申请日：2020-03-16
Applicant: Applied Materials, Inc,
Inventor： Jian Li , Paul L. Brillhart , Juan Carlos Rocha-Alvarez , Abdul Aziz Khaja , Vinay K. Prabhakar , Kwangduk Douglas Lee , Chidambara A. Ramalingam , Venkata Sharat Chandra Parimi
IPC: H01L21/683 , H01L21/324 , H01L21/67 , H01J37/32 , C23C16/50 , C23C16/458 , C23C16/46
Abstract: Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface. The substrate support assemblies may include a support stem coupled with the electrostatic chuck body. The substrate support assemblies may include a heater embedded within the electrostatic chuck body. The substrate support assemblies may include an electrode embedded within the electrostatic chuck body between the heater and the substrate support surface. The substrate support assembly may include a ceramic material characterized by a grain size of less than or about 5 μm.
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公开(公告)号：US20240145252A1
公开(公告)日：2024-05-02
申请号：US17979572
申请日：2022-11-02
Applicant: Applied Materials, Inc.
Inventor： Rutvij Naik , Vijay Sarthy Mysore Sreedhara , Xiaopu Li , Shawyon Jafari , Chidambara A. Ramalingam , Edward P. Hammond , Juan Carlos Rocha-Alvarez
IPC: H01L21/3065 , H01J37/32
CPC classification number: H01L21/3065 , H01J37/32623
Abstract: Exemplary semiconductor processing chamber faceplates may include a body having a first surface and a second surface opposite the first surface. The body may define a plurality of apertures that extend through one or both of the first surface and the second surface. The faceplates may include a heater disposed within an interior of the body. The faceplates may include a first RF mesh disposed between the heater and the first surface. The faceplates may include a second RF mesh disposed between the heater and the second surface. The first RF mesh and the second RF mesh may be coupled together and form a Faraday cage about the heater.
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公开(公告)号：US20230302582A1
公开(公告)日：2023-09-28
申请号：US17703505
申请日：2022-03-24
Applicant: Applied Materials, Inc.
Inventor： Chidambara A. Ramalingam , Shawyon Jafari
IPC: B23K26/384 , B23K26/00 , B23K26/073
CPC classification number: B23K26/384 , B23K26/0093 , B23K26/073 , B23K2101/40
Abstract: Exemplary methods of fabricating a faceplate for a processing chamber may include drilling a first portion of each of a plurality of apertures in a first surface of a faceplate. Each first portion may extend at least partially through a thickness of the faceplate. The methods may include detecting a center of each first portion using a laser drilling apparatus. The methods may include drilling a diffuser portion in each of the plurality of apertures using the laser drilling apparatus. Each diffuser portion is centered with respect to a respective one of the first portions.
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公开(公告)号：US20220333244A1
公开(公告)日：2022-10-20
申请号：US17235258
申请日：2021-04-20
Applicant: Applied Materials, Inc.
Inventor： Sumit Agarwal , Katherine Woo , Shawyon Jafari , Jian Li , Chidambara A. Ramalingam
IPC: C23C16/455 , B22D30/00
Abstract: Exemplary semiconductor processing chamber showerheads include an inner core region. The inner core region may define a plurality of apertures. The showerheads may include an outer core region disposed about an outer periphery of the inner core region. The outer core region may define an annular channel. The showerheads may include a heating element disposed within the annular channel. The showerheads may include an annular liner disposed about an outer periphery of the outer core region. The inner core region and the outer core region may include an aluminum alloy. The annular liner may have a lower thermal conductivity than the aluminum alloy.
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公开(公告)号：US20220108907A1
公开(公告)日：2022-04-07
申请号：US17063334
申请日：2020-10-05
Applicant: Applied Materials, Inc.
Inventor： Katherine Woo , Paul L. Brillhart , Jian Li , Shinnosuke Kawaguchi , David W. Groechel , Dorothea Buechel-Rimmel , Juan Carlos Rocha-Alvarez , Paul E. Fisher , Chidambara A. Ramalingam , Joseph J. Farah
Abstract: Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.
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公开(公告)号：US20240153745A1
公开(公告)日：2024-05-09
申请号：US17981394
申请日：2022-11-05
Applicant: Applied Materials, Inc.
Inventor： Katherine Woo , Jennifer Y. Sun , Jian Li , Wenhao Zhang , Mayur Govind Kulkarni , Chidambara A. Ramalingam , Ryan Sheil , Martin J. Seamons , Nitin Deepak
IPC: H01J37/32 , C23C16/455 , C23C28/04 , C25D11/18
CPC classification number: H01J37/32495 , C23C16/45525 , C23C28/046 , C25D11/18 , H01J37/32467
Abstract: Semiconductor fabrication component preparation methods are described. In embodiments, the methods include forming a first layer on a surface of the semiconductor fabrication component. The first layer is characterized by a porosity of greater than or about 0.01 vol. %. The methods further include depositing a second layer on the first layer, where the second layer is characterized by a porosity of less than or about 20 vol. %. Treated semiconductor fabrication components are also described. In embodiments, the treated components include a first layer formed in the surface of the semiconductor fabrication component, where the first layer is characterized by a porosity of greater than or about 0.01 vol. %., and a second layer positioned on the first layer, where the second layer is characterized by a porosity of less than or about 20 vol. %.
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公开(公告)号：US11848218B2
公开(公告)日：2023-12-19
申请号：US17077711
申请日：2020-10-22
Applicant: Applied Materials, Inc.
Inventor： Katty Guyomard , Chidambara A. Ramalingam , Shawyon Jafari , Palash Joshi , Moin Ahmed Khan , Kirubanandan Naina Shanmugam , Subhaschandra Shreepad Salkod , Avishek Ghosh , David W. Groechel , Li Wu , Dorothea Buechel-Rimmel
CPC classification number: H01L21/67057 , B08B3/048
Abstract: Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.
