Abstract:
A reticle pod with antistatic capability includes a base and plural of support members. The base has a carrying surface having a recess formed thereon and defined by a bottom surface. The support members encircle the carrying surface of the base and are adapted to support a reticle. The recess is defined by a depth extending between the carrying surface and the bottom surface. The depth ranges from 300 μm to 3400 μm to thereby weaken the electrostatic force exerted upon particles on the carrying surface.
Abstract:
Rechargeable wafer carrier systems and methods are provided. A rechargeable wafer carrier system includes, for instance, a housing for holding at least one wafer and at least one electronics system therein, a rechargeable power source operably connected to the housing for powering the at least one electronics system, and a charging interface for receiving a supply of power for charging the rechargeable power source. The housing may be configured for transport within an automated material handling system. Also provided are methods of charging a rechargeable wafer carrier system, which includes, for instance, providing a rechargeable wafer carrier system having at least one electronics system and a rechargeable power source, operably connecting the rechargeable wafer carrier system to a charging base, and supplying power from the charging base to the rechargeable power source.
Abstract:
According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.
Abstract:
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
Abstract:
The packaging system includes an enclosure having an interior volume. A wafer stack, comprising plural wafers and separators in contact with the wafers, is located in the interior volume. The separators have raised bumps extending from each side. The bumps create spaces that allow air to flow therethrough. The separator film intercepts and captures airborne molecular contaminants belonging to organic and inorganic chemical families. In addition, the film is dissipative to static discharge. Furthermore, the bumps provided by the separators protect the fragile wafers from damage due to mechanical shock. The separators are also provided with a peripheral ring or embossment, which contacts the wafer edges and further protects the wafers from damage to mechanical shock. Air cushions can be provided in the wafer stack, which cushions are provided with bands to regulate the compression.
Abstract:
The present invention provides an anti-electrostatic cassette, which mainly comprises at least an electrostatic discharge (ESD) device connected electrically to the carrying frames, which are disposed in the substrate cassette and carry the substrates, and to the handles, which are disposed on the outer sides of the substrate cassette, for forming the conductive path. By means of the contact between the equipment and the two handles of the substrate cassette, the residual static charges on the substrates are conducted to the ground for reducing the residual static charges on the substrates. Consequently, the ESD phenomena in the substrates due to friction can be avoided and hence preventing the damages in the substrates caused by static charges.
Abstract:
A front opening wafer carrier formed principally of plastic and comprising an enclosure portion and door has a path to ground with respect to the wafers, the path to ground effectuated by the door. The base “ground” may be provided at the machine interface upon which the carrier sits, or through the robotic arm that grasps, operates and moves the door.
Abstract:
A continuously electrically-conductive container contains an electrically-insulating support for holding an electric-field-sensitive article, such as a reticle, so that the article is shielded from external electric fields and is not in electrical contact with a conductive container wall. A SMIF pod comprises an electrically conductive container for holding an electric-field-sensitive article. A system has boundary walls that form a chamber for a controlled environment. The system includes a load port for receiving a SMIF pod and an end effector made of insulating material for moving a field-sensitive article within the chamber to and from the SMIF pod. An ionizer neutralizes electric charges on the field-sensitive article.
Abstract:
A photomask pod and a photomask transport pod are provided for preventing particles in the environment from defiling a photomask as well as charge accumulation on the photomask from causing ESD damage. The photomask pod comprises two covers and the supporters or retainers on at least one of the two covers are made of a static dissipative material, which facilitates reducing charge accumulation and protecting the photomask from ESD damage.
Abstract:
The present invention provides a reticle pod preventing particles in the environment from contaminating the reticle and preventing statistic electricity discharge caused by accumulated electric charge from damaging the reticle pod. The reticle pod of the present invention comprises two cover members and at least one of the cover members is made of a macromolecule material doped with metal. The metal may be stainless steel wires, conductive metal wires or metal particles.