Invention Grant
- Patent Title: Front opening wafer carrier with path to ground effectuated by door
- Patent Title (中): 前开口晶片载体具有通过门的路径
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Application No.: US13024817Application Date: 2011-02-10
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Publication No.: US08276759B2Publication Date: 2012-10-02
- Inventor: Gregory Bores , Suraj Kalia , Anthony Mathius Tieben
- Applicant: Gregory Bores , Suraj Kalia , Anthony Mathius Tieben
- Applicant Address: US MA Billerica
- Assignee: Entegris, Inc.
- Current Assignee: Entegris, Inc.
- Current Assignee Address: US MA Billerica
- Agency: Patterson Thuente Christensen Pedersen, P.A.
- Main IPC: B65D85/00
- IPC: B65D85/00
Abstract:
A front opening wafer carrier formed principally of plastic and comprising an enclosure portion and door has a path to ground with respect to the wafers, the path to ground effectuated by the door. The base “ground” may be provided at the machine interface upon which the carrier sits, or through the robotic arm that grasps, operates and moves the door.
Public/Granted literature
- US20110131800A1 FRONT OPENING WAFER CONTANER WITH PATH TO GROUND EFFECTUATED BY DOOR Public/Granted day:2011-06-09
Information query
IPC分类:
