摘要:
An object holder for a lithographic apparatus has a main body having a surface. A plurality of burls to support an object are formed on the surface or in apertures of a thin-film stack. At least one of the burls is formed by laser-sintering. At least one of the burls formed by laser-sintering may be a repair of a damaged burl previously formed by laser-sintering or another method.
摘要:
Provided is a substrate processing apparatus including a substrate floating unit for floating a substrate, a nozzle unit positioned above the substrate floating unit to eject a liquid chemical onto the substrate, a measurement unit for measuring a floating amount of the substrate, and a controller for obtaining a serial number of the substrate and providing control to change, based on the serial number, reference signal data used by the measurement unit to measure the floating amount of the substrate.
摘要:
A method of measuring wear of a substrate holder that is configured to hold a production substrate, the method includes: clamping a measurement substrate to the substrate holder; and measuring strain in the measurement substrate to generate a measurement result. The measurement substrate may have a body having dimensions similar to that of the production substrate; and a strain sensor in the body configured to measure strain in a peripheral portion of the measurement substrate.
摘要:
An edge exposure apparatus for exposure of an outer circumferential portion of a semiconductor substrate to light includes a light source provided to be able to emit light to the outer circumferential portion and a mirror having a reflection surface arranged to extend in a direction intersecting with an optical axis of light emitted from the light source. The mirror is provided between the outer circumferential portion and a center of the semiconductor substrate in a radial direction of the semiconductor substrate in exposure of the outer circumferential portion of the semiconductor substrate to light.
摘要:
A processing facility for manufacturing integrated circuits on semiconductor wafers is provided with at least one radiation generator that generates an EUV (extreme ultraviolet) radiation that is supplied to at least one lithography machine, housed in a factory building, for exposure of the semiconductor wafers. The radiation generator is housed in a building or a building section separate from the factory building. At least one beam guide extends from the building or the building section to the factory building, wherein the EUV radiation is supplied from the building or the building section through the at least one beam guide to the factory building. At least one supply line branches off at an obtuse angle from the at least one beam guide inside the factory building, wherein at least a portion of the EUV radiation is supplied through the at least one supply line to the lithography machine.
摘要:
An apparatus for protecting an extreme ultra violet (EUV) mask includes an EUV pellicle that allows EUV light to be radiated through the EUV pellicle onto the EUV mask, the EUV pellicle having a size corresponding to a size of a slit limiting the EUV light to a predetermined portion of the EUV mask, a flexible blocking film at opposite sides of the EUV pellicle in a first direction, the first direction being a scan direction of an exposure apparatus, and a roller unit including a first roller and a second roller, a first portion of the flexible blocking film being wound around the first roller at a first side of the EUV pellicle, and a second portion of the flexible blocking film being wound around the second roller at a second side of the EUV pellicle.
摘要:
A substrate holder for a lithographic apparatus has a main body having a thin-film stack provided on a surface thereof. The thin-film stack forms an electronic or electric component such as an electrode, a sensor, a heater, a transistor or a logic device, and has a top isolation layer. A plurality of burls to support a substrate are formed on the thin-film stack or in apertures of the thin-film stack.
摘要:
The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.
摘要:
An exposure apparatus includes a projection system having a final element that projects exposure light to an upper surface of a substrate through liquid between the final element and the substrate. A liquid confinement member has a recovery outlet, via which the liquid is removed along with gas, arranged such that the upper surface of the substrate faces the recovery outlet, and the recovery outlet surrounds a path of the exposure light. The liquid confinement member confines the liquid to an area smaller than an area of the upper surface of the substrate by removing the liquid via the recovery outlet from a gap between the liquid confinement member and the upper surface of the substrate. A first support member supports the projection system, and a second support member supports the liquid confinement member, wherein the projection system is isolated from vibrations of the liquid confinement member.
摘要:
The invention relates to a projection lens assembly for directing a beam toward a target. This assembly includes a lens support body (52) that spans a plane (P), and has a connection region (58) and a lateral edge (56). The lens support body is arranged for insertion into a frame (42) of a processing unit along an insertion direction (X) parallel with the plane (P). The projection lens assembly includes conduits (60-64) emanating from the connection region, and a conduit guiding body (70-81) for accommodating the conduits. The guiding body includes a first guiding portion (72) for guiding the conduits from the connection region, along the plane to a lateral region (B) beyond the lateral edge. The guiding body also includes a second guiding portion (78) for guiding the conduits from the lateral region (B) toward a tilted edge (79) of the conduit guiding body.