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公开(公告)号:US20240347359A1
公开(公告)日:2024-10-17
申请号:US18298503
申请日:2023-04-11
发明人: CHI JIA WANG , CHI-CHUNG JEN , KAI-HUNG HSIAO , HUI AN LI , WEN-CHIH CHIANG
IPC分类号: H01L21/673 , G02F1/1334 , G06T7/00 , H01L21/67
CPC分类号: H01L21/67386 , G02F1/1334 , G06T7/001 , H01L21/67288 , G06T2207/30148 , H01L21/67733
摘要: A method includes: receiving at least one semiconductor wafer to a wafer carrier, wherein the wafer carrier has an inspection window arranged on a side of the wafer carrier; transporting the wafer carrier between a plurality of semiconductor tools; and in response to an emergent event, switching the inspection window to a transparent mode for a predetermined period.