-
公开(公告)号：US12109650B2
公开(公告)日：2024-10-08
申请号：US17403989
申请日：2021-08-17
Applicant: 21TH CENTURY CO., LTD
Inventor： Sung Hwan Kim , Hyoung Shik Kang , Dong Bin You
Abstract: Proposed is a planing-polishing apparatus 1 using a femtosecond pulsed laser and performing polishing of a planar workpiece to reduce surface roughness of the workpiece after performing planing of the workpiece using a femtosecond pulsed laser beam.
Search Results
1
records
(took 0.01 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
