公开(公告)号：US20230080251A1

公开(公告)日：2023-03-16

申请号：US17798312

申请日：2020-03-17

Applicant: Mitsubishi Electric Corporation

Inventor： Kenta FUJII ,  Motoaki NISHIWAKI ,  Kyohei ISHIKAWA

IPC: B23K26/38 ,  B23K26/03 ,  B23K26/70

Abstract: A control device that executes machining to cut a workpiece into a part and a remaining material; a detection unit that determines, as a time-series signal, a result of observing in time series a state of the workpiece; a machining state evaluation unit that determines, as evaluation information, a result of evaluation on a state of the machining for each of sections obtained by dividing the machining path, based on the time-series signal; an evaluation information storage unit that stores contour line evaluation information in which a contour line is associated with the evaluation information; and a sorting operation determination unit that determines a sorting control command for controlling sorting operation in which the part is taken out from a position where the workpiece is machined and moved to a target position, based on the contour line evaluation information; are provided.

公开(公告)号：US20230321750A1

公开(公告)日：2023-10-12

申请号：US18020624

申请日：2020-08-27

Applicant: Mitsubishi Electric Corporation

Inventor： Kyohei ISHIKAWA ,  Masaki SEGUCHI ,  Motoaki NISHIWAKI ,  Kenta FUJII ,  Tomotaka KATSURA

IPC: B23K26/03 ,  B23K26/042 ,  B23K26/06 ,  B23K26/38 ,  B23K26/70

CPC classification number: B23K26/032 ,  B23K26/042 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/38 ,  B23K26/705 ,  B23K31/006

Abstract: A laser machining apparatus includes an actuator that changes relative positions of a machining head and a workpiece; a control unit that controls in machining execution the laser oscillator, the machining head, and the actuator based on a machining parameter; a machining state observation unit that detects, from process light that is light generated from the workpiece by laser beam irradiation, light intensities in a plurality of predetermined wavelength bands as a plurality of optical sensor signals; a feature extraction unit that extracts at least one of features, the features being obtainable from an index of correlation between the plurality of optical sensor signals and from one of the optical sensor signals; and a correction quantity calculation unit that determines the machining parameter to be corrected as a correction parameter and a correction quantity for the correction parameter based on the at least one of the features.

公开(公告)号：US20210162544A1

公开(公告)日：2021-06-03

申请号：US17048100

申请日：2019-04-26

Applicant: Mitsubishi Electric Corporation

Inventor： Kenta FUJII ,  Motoaki NISHIWAKI ,  Nobuaki TANAKA ,  Masaki SEGUCHI ,  Kyohei ISHIKAWA

IPC: B23K26/38 ,  B23K26/064

Abstract: A laser processing apparatus includes a laser oscillator; a processing head; a driver that controls a relative positional relationship between a workpiece and the processing head; control circuitry that controls the laser oscillator and the driver in order for the laser beam to scan a processing path on the workpiece; detection circuitry that observes a state of the workpiece being processed and outputs a result of observation as a time series signal; processed state observation circuitry that obtains evaluation information including a determination result that indicates whether a processed state of the workpiece is satisfactory or defective by evaluating the processed state of the workpiece on the basis of the time series signal for each of a plurality of sections obtained by dividing the processing path; and estimation circuitry that estimates a cause of a defect on the basis of the evaluation information of two or more of the sections.

公开(公告)号：US20190193197A1

公开(公告)日：2019-06-27

申请号：US16323916

申请日：2017-09-05

Applicant: Mitsubishi Electric Corporation

Inventor： Kyohei ISHIKAWA ,  Naoyuki NAKAMURA ,  Tatsuya YAMAMOTO ,  Masaki SEGUCHI

IPC: B23K26/064 ,  B23K26/082

CPC classification number: B23K26/064 ,  B23K26/082 ,  G02B26/08

Abstract: A laser machining apparatus includes: a laser oscillator to emit a laser beam; a focusing lens to irradiate a workpiece with the laser beam; a focus position control mechanism disposed between the laser oscillator and the focusing lens and disposed on the optical path of the laser beam and that controls the divergence angle of the laser beam and the incident diameter of the laser beam incident on the focusing lens; a laser beam deflector to deflect the laser beam before the laser beam is incident on the focusing lens; and an emitting angle control mechanism to control the emitting angle of the laser beam that exits from the focusing lens after being deflected by the laser beam deflector.

公开(公告)号：US20220226935A1

公开(公告)日：2022-07-21

申请号：US17611582

申请日：2019-06-28

Applicant: Mitsubishi Electric Corporation

Inventor： Motoaki NISHIWAKI ,  Kenta FUJII ,  Kyohei ISHIKAWA ,  Masaki SEGUCHI ,  Hideyuki MASUI

IPC: B23K26/70

Abstract: A laser machining system according to the present invention includes a laser machining tool, a detection unit that detects a machining state of the laser machining tool, a test machining condition generation unit that generates a machining condition including at least one control parameter settable to the laser machining tool, a machining determination unit that determines quality of machining based on the machining state detected by the detection unit, a candidate condition generation unit that generates a candidate condition, which is a candidate for a machining condition to be set to the laser machining tool, based on a determination result from the machining determination unit and on a machining condition corresponding to the determination result, and a tolerance check unit that causes check machining to be performed for checking a machining tolerance using the candidate condition, where the machining tolerance indicates robustness of the candidate condition.

公开(公告)号：US20220147036A1

公开(公告)日：2022-05-12

申请号：US17604450

申请日：2020-02-25

Applicant: Mitsubishi Electric Corporation

Inventor： Masaki SEGUCHI ,  Kyohei ISHIKAWA ,  Teruaki FUKUOKA

IPC: G05B23/02 ,  B23H1/00 ,  B23K26/03 ,  B23K26/38

Abstract: A machining failure detection device includes a machining light measurement unit that measures machining light generated at a machining point during machining; a machining sound measurement unit that measures machining sound generated at the machining point; and a computation unit that determines whether a machining failure has occurred in the machining. The computation unit includes a feature extraction unit, a determination value calculation unit, and a determination unit. The feature extraction unit extracts a machining light feature from a machining light signal measured by the machining light measurement unit, and extracts a machining sound feature from a machining sound signal measured by the machining sound measurement unit. The determination value calculation unit calculates a combined failure determination value on the basis of the machining light feature and the machining sound feature. The determination unit compares the combined failure determination value with a determination criterion to determine a failure.

公开(公告)号：US20240316698A1

公开(公告)日：2024-09-26

申请号：US18281565

申请日：2021-04-06

Applicant: Mitsubishi Electric Corporation

Inventor： Kenta FUJII ,  Kyohei ISHIKAWA ,  Nobuaki TANAKA ,  Motoaki NISHIWAKI

IPC: B23K26/70 ,  B23K26/03

CPC classification number: B23K26/705 ,  B23K26/03

Abstract: A laser processing apparatus includes a control device controlling laser processing in accordance with processing condition; a detection unit observing processing state on a time-series basis during laser processing and outputting a signal corresponding to observation result as a time-series signal; a parameter estimation unit estimating and outputting, based on first time-series signal data including the time-series signal and/or a first feature computed from the time-series signal and preset corresponding parameter information indicating relationship between the first time-series signal data and at least one parameter value included in the processing condition, a parameter estimate corresponding to the first time-series signal data; a condition change amount determination unit comparing a target parameter value and the parameter estimate and determining a change amount for the processing condition based on comparison result; and a parameter update unit updating the processing condition based on the change amount and the processing condition.

公开(公告)号：US20230211435A1

公开(公告)日：2023-07-06

申请号：US17927369

申请日：2020-05-29

Applicant: Mitsubishi Electric Corporation

Inventor： Motoaki NISHIWAKI ,  Kenta FUJII ,  Kyohei ISHIKAWA

IPC: B23K26/03 ,  B23K26/042

CPC classification number: B23K26/03 ,  B23K26/042

Abstract: A laser machining system includes a state measurement unit that observes an internal state of a machining head or a varying state of a workpiece and outputs a machining state signal; an inference unit that determines a degree of quality of the laser beam machining as an inference result for each of machining defects concerning at least one type of machining defect on the basis of the machining state signal; a machining monitoring unit that monitors the workpiece for presence or absence of the machining defect and outputs a monitoring signal; a machining decision unit that decides whether there is the machining defect and determines a quality of the machining as a decision result; and a machinery safety unit that outputs, on the basis of the inference result and the decision result, a control signal that gives an instruction on whether to stop or continue the laser beam machining.

公开(公告)号：US20220107629A1

公开(公告)日：2022-04-07

申请号：US17554491

申请日：2021-12-17

Applicant: Mitsubishi Electric Corporation

Inventor： Hideyuki MASUI ,  Motoaki NISHIWAKI ,  Kenta FUJII ,  Kyohei ISHIKAWA ,  Masaki SEGUCHI

IPC: G05B19/4155

Abstract: A machining condition search device according to the disclosure includes a machining condition generation unit, a practical machining command unit, a machining evaluation unit, a prediction unit, an optimum machining condition calculation unit. The machining condition generation unit generates a machining condition defined by one or more control parameters settable on a machining apparatus. The practical machining command unit causes the machining apparatus to perform machining based on a generated machining condition. The machining evaluation unit generates an evaluation value of performed machining, on the basis of information indicating a machining result of the performed machining. The prediction unit predicts an evaluation value corresponding to a machining condition under which machining is not performed, on the basis of the evaluation value and the machining condition corresponding to the evaluation value. The optimum machining condition calculation unit obtains an optimum machining condition on the basis of a prediction value predicted by the prediction unit and an evaluation value generated by the machining evaluation unit. The optimum machining condition is a machining condition under which an evaluation value is equal to or greater than a threshold and a tolerance is maximum.

公开(公告)号：US20240261892A1

公开(公告)日：2024-08-08

申请号：US18691044

申请日：2022-05-27

Applicant: Mitsubishi Electric Corporation

Inventor： Tomohiro KYOTO ,  Masato KAWASAKI ,  Hiroshi KIKUCHI ,  Kyohei ISHIKAWA

IPC: B23K26/06

CPC classification number: B23K26/06

Abstract: A laser beam machine includes: a laser oscillator that outputs laser light; a transmission fiber through which the laser light output from the laser oscillator propagates; a first adjuster that is disposed between the laser oscillator and an incidence end of the transmission fiber and changes an incidence numerical aperture of the laser light incident to the incidence end of the transmission fiber; a second adjuster that converges the laser light and changes a zoom magnification of the laser light between an emission end of the transmission fiber and a workpiece; and a controller that performs adjustment of a beam diameter of the laser light at an image forming position of the laser light and adjustment of an emission numerical aperture of the laser light emitted from the emission end of the transmission fiber independently of each other, by changing the incidence numerical aperture.