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    LASER PROCESSING HEAD APPARATUS WITH CAMERA MONITOR
    1.
    发明申请
    LASER PROCESSING HEAD APPARATUS WITH CAMERA MONITOR 审中-公开
    激光加工头设备与相机监视器

    公开(公告)号：US20170043431A1

    公开(公告)日：2017-02-16

    申请号：US15118574

    申请日：2015-03-02

    Applicant: MITSUBISHI ELECTRIC CORPORATION

    Inventor： Kazuki KUBA ,  Naoyuki NAKAMURA ,  Akihiro UENO

    IPC: B23K26/03

    CPC classification number: B23K26/032 ,  B23K26/0648 ,  B23K26/21 ,  B23K26/32

    Abstract: A laser processing head apparatus with a camera monitor includes a light source for illumination having a near-infrared laser diode that generates a near-infrared laser beam of which upper limit value is a wavelength of a laser beam for processing, and out of processing point-emitted light, a processing point-reflected laser beam and illumination light for imaging, which have passed through a condensed lens and a laser beam reflection mirror and are directed to the camera respectively. An optical filter blocks transmission of the processing point-emitted light and the processing point-reflected laser beam, and transmits the illumination light for imaging.

    Abstract translation: 具有照相机监视器的激光加工头设备包括用于照明的光源，其具有产生近红外激光束的近红外激光二极管，其上限值为用于处理的激光束的波长，并且处理点 分别通过聚光透镜和激光束反射镜的经处理点反射的激光束和用于成像的照明光分别指向相机。 光滤波器阻止处理点发射光和处理点反射激光束的传输，并传输用于成像的照明光。

    LASER MACHINING APPARATUS AND LASER MACHINING METHOD
    2.
    发明申请
    LASER MACHINING APPARATUS AND LASER MACHINING METHOD 审中-公开

    公开(公告)号：US20190193197A1

    公开(公告)日：2019-06-27

    申请号：US16323916

    申请日：2017-09-05

    Applicant: Mitsubishi Electric Corporation

    Inventor： Kyohei ISHIKAWA ,  Naoyuki NAKAMURA ,  Tatsuya YAMAMOTO ,  Masaki SEGUCHI

    IPC: B23K26/064 ,  B23K26/082

    CPC classification number: B23K26/064 ,  B23K26/082 ,  G02B26/08

    Abstract: A laser machining apparatus includes: a laser oscillator to emit a laser beam; a focusing lens to irradiate a workpiece with the laser beam; a focus position control mechanism disposed between the laser oscillator and the focusing lens and disposed on the optical path of the laser beam and that controls the divergence angle of the laser beam and the incident diameter of the laser beam incident on the focusing lens; a laser beam deflector to deflect the laser beam before the laser beam is incident on the focusing lens; and an emitting angle control mechanism to control the emitting angle of the laser beam that exits from the focusing lens after being deflected by the laser beam deflector.

    LASER MACHINING HEAD AND LASER MACHINING APPARATUS
    4.
    发明申请
    LASER MACHINING HEAD AND LASER MACHINING APPARATUS 审中-公开

    公开(公告)号：US20190126395A1

    公开(公告)日：2019-05-02

    申请号：US16307188

    申请日：2017-07-05

    Applicant: Mitsubishi Electric Corporation

    Inventor： Naoyuki NAKAMURA ,  Masaki SEGUCHI ,  Tomotaka KATSURA ,  Daiji MORITA

    IPC: B23K26/06 ,  B23K26/36

    Abstract: A laser machining apparatus includes: a laser oscillator that emits laser light (L) having a plurality of wavelengths; a transmission diffractive optical element (21) that allows the laser light (L) to pass therethrough; a machining lens (3) that concentrates the laser light (L) that has passed through the transmission diffractive optical element (21); a distance adjustment mechanism (31) that changes a distance between the transmission diffractive optical element (21) and the machining lens (3); and an angle adjustment mechanism (32) that changes an angle of the transmission diffractive optical element (21) to switch between a state in which the laser light (L) is dispersed by the transmission diffractive optical element (21) and then enters the machining lens (3) and a state in which the laser light (L) enters the machining lens (3) without being dispersed by the transmission diffractive optical element (21).

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