公开(公告)号：US11634612B2

公开(公告)日：2023-04-25

申请号：US17034002

申请日：2020-09-28

申请人： ASIA ELECTRONIC MATERIAL CO., LTD.

发明人： Chih-Ming Lin ,  Chien-Hui Lee

IPC分类号： C09J7/29 ,  C09J7/38 ,  H01B1/02 ,  C09J7/28 ,  C09J9/02 ,  C09J7/40 ,  C09J7/30 ,  H01B1/22 ,  C08K3/08 ,  C08K7/00 ,  C25D5/12 ,  C25D3/02 ,  C25D5/00

摘要： Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

公开(公告)号：US20230116303A1

公开(公告)日：2023-04-13

申请号：US17909606

申请日：2021-03-03

申请人： AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Ryo KEMMOTSU ,  Kingo FURUKAWA

IPC分类号： H01B1/02 ,  H01R13/03 ,  H01B13/00 ,  C25D5/12 ,  C25D5/50

摘要： Provided is a metal material including a substrate and an Ag—Sn covering layer that covers a surface of the substrate, in which the Ag—Sn covering layer contains Ag and Sn and has an Ag—Sn alloy exposed on a surface thereof, and an average crystal grain size in a cross section in parallel with a surface of the Ag—Sn covering layer is less than 0.28 μm. Provided is also a metal material, produced by forming a metal layer including Ag and Sn, on a surface of a substrate, and heating the resultant at a temperature equal to or more than the melting point of Sn, and including an Ag—Sn covering layer containing Ag and Sn and having an Ag—Sn alloy exposed on a surface thereof, on the surface of the substrate.

公开(公告)号：US20230093655A1

公开(公告)日：2023-03-23

申请号：US17910250

申请日：2021-01-21

申请人： DOWA METALTECH CO., LTD.

发明人： Yutaro Hirai ,  Kentaro Arai ,  Yosuke Sato

IPC分类号： C25D5/10 ,  C25D5/12 ,  C25D3/46 ,  C25D3/22 ,  C25D3/12 ,  B32B15/01

摘要： A silver-plated product which has more excellent minute sliding abrasion resistance property than that of conventional silver-plated products, and a method for producing the same. The silver-plated product is produced by electroplating a base material 10 of copper or a copper alloy to form an underlying plating layer 12 of nickel or a nickel alloy, a first silver-plating layer of silver (lower silver-plating layer) 14, a zinc-plating layer 16 of zinc serving as an intermediate plating layer, and a second silver-plating layer of silver (upper silver-plating layer) 18 serving as a surface layer, in this order from the base material 10.

公开(公告)号：US11542606B2

公开(公告)日：2023-01-03

申请号：US16462209

申请日：2018-05-08

申请人： Poongsan Corporation

发明人： Cheol Min Park ,  Hyo Moon Nam ,  Buem Jae Lee ,  Hyo Young Kim

IPC分类号： C23C22/17 ,  C23C22/07 ,  C25D3/30 ,  C25D3/38 ,  C25D3/56 ,  C25D3/60 ,  C25D5/12 ,  C25D5/34 ,  C25D5/50 ,  C25F1/02 ,  C25D5/48 ,  C25D5/10 ,  C25D7/00 ,  C25D5/00

摘要： The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.

公开(公告)号：US11527504B2

公开(公告)日：2022-12-13

申请号：US16989461

申请日：2020-08-10

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Meng-Fu Shih ,  Chun-Yen Lo ,  Cheng-Lin Huang ,  Wen-Ming Chen ,  Chien-Ming Huang ,  Yuan-Fu Liu ,  Yung-Chiuan Cheng ,  Wei-Chih Huang ,  Chen-Hsun Liu ,  Chien-Pin Chan ,  Yu-Nu Hsu ,  Chi-Hung Lin ,  Te-Hsun Pang ,  Chin-Yu Ku

IPC分类号： H01L23/00 ,  C25D5/12 ,  C25D5/50 ,  C25D7/12 ,  C25D17/12 ,  C25D21/10 ,  C25D17/00 ,  H01L23/31 ,  C25D3/12 ,  C25D3/38 ,  C25D3/60

摘要： External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

公开(公告)号：US11492718B1

公开(公告)日：2022-11-08

申请号：US17583236

申请日：2022-01-25

申请人： CHANG CHUN PETROCHEMICAL CO., LTD.

发明人： Yao-Sheng Lai ,  Jui-Chang Chou

IPC分类号： C25D7/04 ,  C25D1/04 ,  H05K3/14 ,  C25D5/00 ,  C25D5/12 ,  C25D7/06 ,  B32B15/01 ,  B32B15/08

摘要： An electrodeposited copper foil includes a bulk copper foil. When a weight of the electrodeposited copper foil is increased to 105.0 wt % during a thermogravimetric analysis (TGA) performed on the electrodeposited copper foil at a heating rate of 5° C./min and an air flow rate of 95 mL/min, a heating temperature of the TGA is defined as T105.0 wt % and in a range of 550° C. to 750° C.

公开(公告)号：US11466367B2

公开(公告)日：2022-10-11

申请号：US14427754

申请日：2013-09-06

申请人： SANKEI GIKEN KOGYO CO., LTD.

发明人： Toshio Okabe ,  Shuji Yamamoto ,  Daisuke Sato

IPC分类号： C23C18/16 ,  B32B33/00 ,  B32B38/00 ,  B32B3/26 ,  B32B7/12 ,  B32B15/08 ,  C25D5/50 ,  C25D5/12 ,  C25D5/00 ,  C25D7/00 ,  C23C18/30 ,  C23C18/20 ,  C23C18/32 ,  C23C18/48 ,  C25D3/04 ,  C25D3/38 ,  C23C18/28

摘要： A method of manufacturing a bright surface product comprises a step of performing electroless plating to form a first metal film on a base coat layer formed on a substrate, a step of performing electrolytic plating to form a second metal film thereon so that the bonding strength between each film of a multi-layered metal film comprising the first metal film and the second film is higher than the bonding strength between the base coat layer and the first metal layer, a step of integrally and discontinuously segmentalizing the multi-layered metal film with cracks to form an island-like metal film comprising a collection of fine multi-layered metal regions with island-like structures; and a step of forming a translucent top coat layer to cover the fine multi-layered metal regions of the island-like metal film and enter into the cracks to make contact with the base coat layer.

公开(公告)号：US20220314353A1

公开(公告)日：2022-10-06

申请号：US17844203

申请日：2022-06-20

申请人： Vacuumschmelze GmbH & Co. KG

发明人： Lothar Zapf ,  Natalia Ankuda ,  Manfred Reuther

IPC分类号： B23K1/20 ,  C25D3/12 ,  C25D5/12 ,  C25D3/30

摘要： A soldered product comprising a first component soldered to a second component is provided. The first component comprises a stainless steel substrate, an adhesion promoter layer made of nickel deposited on at least one joining surface of the stainless steel substrate; and a tin layer deposited on the adhesion promoter layer. The tin layer has a layer thickness in the range of 10-30 μm. The second component is typically a rare earth magnet.

公开(公告)号：US11414772B2

公开(公告)日：2022-08-16

申请号：US17251870

申请日：2019-06-14

申请人： Alberto Todescan

发明人： Alberto Todescan

IPC分类号： C25D3/38 ,  C25D5/36 ,  C25D5/00 ,  C25D5/10 ,  C25D5/12 ,  C25D5/18 ,  C25D3/12 ,  C25D7/06 ,  C25D17/10 ,  C25D21/12

摘要： Described is a cathodic treatment for the electrodeposition of a metal layer securely adherent to the surface of stainless steel objects in an electrolytic bath comprising one or more metals belonging exclusively to the groups from 3 to 12 of the periodic table, excluding the elements nickel, cobalt, cadmium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold and rhenium, and methanesulfonic acid with a concentration of between 100 and 400 g/l.
An object of the invention is also a process for applying a metal layer securely adherent to the surface of stainless steel objects, comprising a cathodic treatment as described above.
Moreover, the invention further relates to an object comprising stainless steel equipped with a covering obtained by means of a process of the type described.

公开(公告)号：US20220235483A1

公开(公告)日：2022-07-28

申请号：US17596362

申请日：2020-06-10

申请人： TOYO KOHAN CO., LTD.

发明人： Hiroki YANAGA ,  Shinichirou HORIE ,  Etsuro TSUTSUMI ,  Masashi ICHISHIMA ,  Toshifumi KOYANAGI ,  Koh YOSHIOKA

IPC分类号： C25D5/16 ,  B32B15/01 ,  C25D5/12

摘要： Provided is a roughened plated sheet comprising a roughened plated layer having a roughened nickel plated layer and a zinc plated layer famed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness Rzjis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 μm or more.