公开(公告)号：US20200373267A1

公开(公告)日：2020-11-26

申请号：US16989461

申请日：2020-08-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Fu Shih ,  Chun-Yen Lo ,  Cheng-Lin Huang ,  Wen-Ming Chen ,  Chien-Ming Huang ,  Yuan-Fu Liu ,  Yung-Chiuan Cheng ,  Wei-Chih Huang ,  Chen-Hsun Liu ,  Chien-Pin Chan ,  Yu-Nu Hsu ,  Chi-Hung Lin ,  Te-Hsun Pang ,  Chin-Yu Ku

IPC: H01L23/00 ,  C25D5/12 ,  C25D5/50 ,  C25D7/12 ,  C25D17/00 ,  C25D17/12 ,  C25D21/10

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

公开(公告)号：US11527504B2

公开(公告)日：2022-12-13

申请号：US16989461

申请日：2020-08-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Fu Shih ,  Chun-Yen Lo ,  Cheng-Lin Huang ,  Wen-Ming Chen ,  Chien-Ming Huang ,  Yuan-Fu Liu ,  Yung-Chiuan Cheng ,  Wei-Chih Huang ,  Chen-Hsun Liu ,  Chien-Pin Chan ,  Yu-Nu Hsu ,  Chi-Hung Lin ,  Te-Hsun Pang ,  Chin-Yu Ku

IPC: H01L23/00 ,  C25D5/12 ,  C25D5/50 ,  C25D7/12 ,  C25D17/12 ,  C25D21/10 ,  C25D17/00 ,  H01L23/31 ,  C25D3/12 ,  C25D3/38 ,  C25D3/60

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.