公开(公告)号：US12227866B2

公开(公告)日：2025-02-18

申请号：US17657123

申请日：2022-03-29

Applicant: Yuming Zhang ,  Ruihuan Zhang

Inventor： Yuming Zhang ,  Ruihuan Zhang

IPC: C25D17/12 ,  C25D7/00 ,  C25D21/12 ,  H05K3/42

Abstract: The present disclosure is related to systems and methods for electrochemical process. The system may include a first electrode, a second electrode, an electric field distribution simulation optimizer, an electric field distribution controller, and a signal controller. The first electrode and the second electrode may form an electric field to change a substance on the second electrode. A morphology of the second electrode may be uneven. The first electrode may include an electrically conducting plate. A morphology of the electrically conducting plate may be in conformity with the morphology of the second electrode. A protruding portion of the electrically conducting plate may correspond to a recessing portion of the second electrode. A recessing portion of the electrically conducting plate may correspond to a protruding portion of the second electrode. The electric field distribution controller may be electrically connected to the signal controller and the electric field distribution simulation optimizer, respectively. The signal controller may be electrically connected to the electrically conducting plate. The signal controller may be configured to apply a processing signal to the electrically conducting plate.

公开(公告)号：US12139810B2

公开(公告)日：2024-11-12

申请号：US17348423

申请日：2021-06-15

Applicant: Antony Aguilar

Inventor： Antony Aguilar

IPC: C25D17/12 ,  C25D5/02 ,  C25D5/04 ,  C25D5/18 ,  H01L31/0224

Abstract: Localized electrochemical deposition (LECD) is provided. The aim of LECD is to create a patterned electrodeposited metal layer on a cathode without the use of pre-deposition patterning steps. In embodiments described herein, an LECD device includes a cathode (a material to be plated) placed sufficiently close to a formation anode in a metal electrolyte chemical bath. The LECD device is then activated electrically in solution. An electric field created by the formation anode determines the locations of metal deposition, providing a localized deposition without need for photolithography or other masking of the material to be plated.

公开(公告)号：US12134832B2

公开(公告)日：2024-11-05

申请号：US17598070

申请日：2020-03-18

Applicant: Robert Bosch GmbH

Inventor： Christoph Roland Hoelzl ,  Frank Miller ,  Juergen Hackenberg ,  Lutz Baumgaertner ,  Michael Lingner ,  Tim Bergmann ,  Martina Bubrin

IPC: C25D17/06 ,  C25D3/12 ,  C25D5/08 ,  C25D7/04 ,  C25D17/00 ,  C25D17/12

Abstract: A coating device for coating components, in particular for nickel-plating spark plug housings. The coating device includes: a housing having an outer anode that is designed to receive the component, an inner anode that can be introduced into a through-opening of the component, and a voltage-generating device, the voltage-generating device being designed to generate a first voltage between the outer anode and the component, as well as a second voltage between the inner anode and the component. The housing has an inlet and an outlet for introducing and discharging a process medium into or out of the housing.

公开(公告)号：US12134831B2

公开(公告)日：2024-11-05

申请号：US17990157

申请日：2022-11-18

Applicant: Lam Research Corporation

Inventor： Gregory Kearns ,  Bryan L. Buckalew ,  Jacob Kurtis Blickensderfer

IPC: C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  C25D17/06 ,  C25D17/12

Abstract: In one example, an electroplating apparatus is provided for electroplating a wafer. The electroplating apparatus comprises a wafer holder for holding a wafer during an electroplating operation and a plating cell configured to contain an electrolyte during the electroplating operation. An anode chamber is disposed within the plating cell, and a charge plate is disposed within the anode chamber. An anode is positioned above the charge plate within the anode chamber. In some examples, the anode chamber is a membrane-less anode chamber.

公开(公告)号：US20240360583A1

公开(公告)日：2024-10-31

申请号：US18353215

申请日：2023-07-17

Applicant: Wenzhong Chen

Inventor： Wenzhong Chen

IPC: C25D17/12 ,  C25D17/00

CPC classification number: C25D17/12 ,  C25D17/005

Abstract: The invention discloses a novel cathode conductive roller device for sheet-type plating or sheet-type cleaning machine wherein a cathode conductive roller device is arranged between the soaking tanks (the cathode conductive roller doesn't generate circuit will suffice, no matter being soaked or not soaked in plating solution or electrolyte); an anode plate device is arranged in the soaking tank; a matched conductive plate tank device is arranged below the cathode conductive roller; compared with the prior art, the invention has following advantages: the whole structure is simple and exquisite, the selection, connection and whole working modes of parts are reasonable and complete, and the current is concentrated and uniformly distributed on semiconductor product or circuit board when the method is used for plating or electrolytic degreasing, achieving better product plating or electrolytic degreasing effect.

公开(公告)号：US20240301579A1

公开(公告)日：2024-09-12

申请号：US18667227

申请日：2024-05-17

Applicant: ALPHA-EN CORPORATION

Inventor： Lawrence Ralph Swonger

IPC: C25D3/42 ,  C03C3/21 ,  C03C4/18 ,  C03C10/00 ,  C25C1/02 ,  C25D7/06 ,  C25D17/00 ,  C25D17/02 ,  C25D17/10 ,  C25D17/12 ,  C25D21/02 ,  C25D21/18

CPC classification number: C25D3/42 ,  C03C3/21 ,  C03C4/18 ,  C03C10/00 ,  C25C1/02 ,  C25D7/0642 ,  C25D17/002 ,  C25D17/005 ,  C25D17/02 ,  C25D17/10 ,  C25D17/12 ,  C25D21/02 ,  C25D21/18

Abstract: A decoupled plating system is provided for producing lithium. In a general embodiment, the present disclosure provides a feed tank configured to supply a lithium-rich aqueous electrolyte stream, a plating tank that is configured to receive an organic electrolyte and plate out lithium metal from that organic electrolyte, and one or more lithium replenishment cells configured to receive both electrolytes, keep them separated, and selectively move lithium ions from the aqueous electrolyte into the spent organic electrolyte stream. The present system and process can advantageously reduce operating costs and/or improve energy efficiency in production of lithium metal and associated products.

公开(公告)号：US11926920B2

公开(公告)日：2024-03-12

申请号：US17057981

申请日：2019-04-29

Applicant: ACM Research (Shanghai) Inc.

Inventor： Zhaowei Jia ,  Jian Wang ,  Hui Wang ,  Hongchao Yang

IPC: C25D5/18 ,  C25D7/12 ,  C25D17/00 ,  C25D17/06 ,  C25D17/12 ,  C25D21/12 ,  H01L21/288 ,  H01L21/687 ,  H01L23/544

CPC classification number: C25D5/18 ,  C25D7/12 ,  C25D17/001 ,  C25D17/06 ,  C25D17/12 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/68764 ,  H01L23/544 ,  H01L2223/54493

Abstract: Embodiments of the present invention provide an electroplating apparatus for electroplating on a surface of a wafer, which comprising a plurality of electrodes, for forming electric fields on the surface of the wafer, an independent electric field is formed in a designated area, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch is reduced. Embodiments of the present invention also provide an electroplating method for electroplating on a surface of a wafer, the method controlling the plurality of electrodes to form electric fields on the surface of the wafer, an independent electric field is formed in a designated area, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch is reduced. The present invention is more accurate and reliable, the electroplating efficiency is also increased.

公开(公告)号：US20230416936A1

公开(公告)日：2023-12-28

申请号：US17847301

申请日：2022-06-23

Applicant: City University of Hong Kong

Inventor： Chun Ho Lam

IPC: C25D3/52 ,  C25D3/38 ,  C25D3/26 ,  C25D17/12

CPC classification number: C25D3/52 ,  C25D3/38 ,  C25D3/26 ,  C25D17/12

Abstract: A metal recovery device for recovering metal in a waste printed circuit board by way of electrodeposition including: a cathode, an anode, and an electrolyte in electrical communication with the cathode and the anode, wherein the electrolyte includes a glycol-based compound and a metal chloride. A method of preparing an electrolyte for use in the same. A method of metal recovery for recovering metal from waste printed circuit board by making use the same.

公开(公告)号：US11827993B1

公开(公告)日：2023-11-28

申请号：US17478687

申请日：2021-09-17

Applicant: Gru Energy Lab Inc.

Inventor： Xiahui Yao ,  Xiaohua Liu ,  Sa Zhou ,  Song Han

IPC: C25B1/00 ,  C25B1/33 ,  C25B1/50 ,  C25D17/12 ,  C25D3/02

CPC classification number: C25D17/12 ,  C25D3/02

Abstract: Provided are methods of forming active materials for electrochemical cells using low-temperature electrochemical deposition, e.g., less than 200° C. Specifically, these processes allow precise control of the morphology, composition, and size of deposited structures. For example, the deposited structure may be doped, alloyed, or surface treated during their deposition using a combination of different precursors. In particular, silicon structure may be pre-lithiated while these structures are being formed. The selection of working electrodes (surface size and properties), electrolyte composition, and other parameters result in different types of structures, e.g., precipitating from the electrolyte or deposited on the electrode. Low-temperature plating does not require a lot of energy and volatile and invisible precursors. Furthermore, this plating produces a more confined waste stream, suitable for post-reaction recycling. Finally, low-temperature electrochemical deposition can be readily scaled up such that plating bathes and electrode sizes can be chosen to fit the production requirements.

公开(公告)号：US20230330724A1

公开(公告)日：2023-10-19

申请号：US18017114

申请日：2021-07-21

Applicant: Massachusetts Institute of Technology ,  Carnegie Mellon University

Inventor： Yet-Ming Chiang ,  Leah Ellis ,  Sophie C. Coppieters 't Wallant ,  Sonia Zhang ,  Venkatasubramanian Viswanathan ,  Elsa A. Olivetti ,  Michael Joseph Wang

IPC: B09B3/70 ,  C25D17/12 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/48

CPC classification number: B09B3/70 ,  C25D17/12 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/48 ,  B09B2101/30

Abstract: Disclosed herein are systems and methods for processing ash. For example, in certain embodiments, the method comprises dissolving at least a portion of ash in acid. In some embodiments, the acid is produced in a reactor. In some embodiments, dissolving at least a portion of ash in acid produces refined silica (SiO2) (e.g., amorphous silica, substantially pure silica, and/or a substantial amount of silica). According to certain embodiments, the ash can be further processed (e.g., using electro winning, pH-based precipitation, and/or electrorefining) to obtain other components instead of or in addition to refined silica.