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公开(公告)号:US20240352806A1
公开(公告)日:2024-10-24
申请号:US18683558
申请日:2022-08-26
IPC分类号: E21B17/042 , C25D3/22 , C25D5/48 , C25D7/04
CPC分类号: E21B17/042 , C25D3/22 , C25D5/48 , C25D7/04
摘要: An oil-well metal pipe according to the present disclosure includes: a pipe main body that includes a pin which includes a pin contact surface including an external thread part and which is formed at a first end portion, and a box which includes a box contact surface including an internal thread part and which is formed at a second end portion; and a Zn—Ni alloy plating layer which is formed on at least one of the pin contact surface and the box contact surface. The X-ray diffraction intensities of the Zn—Ni alloy plating layer satisfy Formula (1).
I
18
/
(
I
18
+
I
36
+
I
54
)
≥
0.6
(
1
)
Here, in Formula (1), in units of cps, an X-ray diffraction intensity of {411} and {330} is substituted for I18, an X-ray diffraction intensity of {442} and {600} is substituted for I36, and an X-ray diffraction intensity of {552} is substituted for I54.-
公开(公告)号:US20240254650A1
公开(公告)日:2024-08-01
申请号:US18468859
申请日:2023-09-18
发明人: Jung Han KIM , Hyo Jong LEE , Han Kyun SHIN , Young Jun CHO , Seung Hyeon LEE , Young Seo KIM
摘要: The electroplating apparatus for surface modification of pipes includes: a housing comprising an inner space accommodating an electrode, a plating solution, and a pipe therein, and a plating solution inlet disposed on a lower surface of the housing and allowing the plating solution to be injected therethrough; a plating auxiliary part disposed inside the housing, vertically fixing the pipe inserted into the housing, and guiding the plating solution injected into the housing to flow toward an upper portion of the housing; and an auxiliary support part disposed inside the housing, spacing the plating auxiliary part and the plating solution inlet apart from each other by a predetermined distance, and guiding the plating solution introduced through the plating solution inlet to flow in a direction, where the plating auxiliary part is disposed.
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3.
公开(公告)号:US20240084447A1
公开(公告)日:2024-03-14
申请号:US18513448
申请日:2023-11-17
发明人: Peng-Cheng Hong , Jun-Liang Pu , W.L. Hsu , Chung-Hao Kao , Chia-Chun Hung , Cheng-Yi Wu , Chin-Szu Lee
IPC分类号: C23C16/44 , B29D99/00 , C23C14/02 , C23C14/20 , C23C14/34 , C23C18/18 , C25D7/04 , H01J37/32
CPC分类号: C23C16/4409 , B29D99/0053 , C23C14/021 , C23C14/205 , C23C14/34 , C23C18/1875 , C25D7/04 , H01J37/32513 , B29K2019/00
摘要: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
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公开(公告)号:US20240075449A1
公开(公告)日:2024-03-07
申请号:US18193297
申请日:2023-03-30
发明人: Ming-Hung CHENG , Fuh-Yih SHIH , Shih-Ming YEH , Wen-Yi WANG
CPC分类号: B01J19/243 , B01J19/0053 , C25D3/12 , C25D7/04 , B01J2219/00792 , B01J2219/00795 , B01J2219/00822
摘要: The application relates to a polymerization vessel and a method for manufacturing the same. An interior surface of the polymerization vessel has a specific structure, so that the polymerization vessel has better heat transfer efficiency. Closed cooling channels are constructed from the specific structure, and therefore cooling fluid flows in the closed cooling channels. Furthermore, there won't be any by-pass defects in the cooling channels of the polymerization vessel, thereby improving cooling efficiency of the cooling fluid.
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公开(公告)号:US20240018682A1
公开(公告)日:2024-01-18
申请号:US18183541
申请日:2023-03-14
IPC分类号: C25D5/56 , B64F5/10 , C25D7/04 , C25D3/56 , B23K26/386 , B23K26/402
CPC分类号: C25D5/56 , B64F5/10 , C25D7/04 , C25D3/562 , B23K26/386 , B23K26/402 , B64D29/08
摘要: A method for producing a structural material stack includes forming a composite panel that includes a carbon fiber reinforced polymer (CFRP) material, and applying an interface film on an exterior composite surface of the composite panel. The interface film is electrically conductive. The method includes performing an electroplating process to form a metallic coating on the interface film such that the interface film is sandwiched between the composite panel and the metallic coating. The metallic coating has a different material composition than the interface film.
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6.
公开(公告)号:US20230416888A1
公开(公告)日:2023-12-28
申请号:US18463110
申请日:2023-09-07
发明人: Jun MAKI , Soshi FUJITA , Toyomitsu NAKAMURA
IPC分类号: C22C38/54 , B23K11/00 , B23K35/02 , B23K35/30 , C21D9/08 , C22C38/00 , C22C38/02 , C22C38/06 , C22C38/42 , C22C38/44 , C22C38/48 , C22C38/50 , C25D3/44 , C25D7/04
CPC分类号: C22C38/54 , B23K11/002 , B23K35/0261 , B23K35/3053 , C21D9/08 , C22C38/001 , C22C38/002 , C22C38/02 , C22C38/06 , C22C38/42 , C22C38/44 , C22C38/48 , C22C38/50 , C25D3/44 , C25D7/04 , B23K2103/04
摘要: An Al plated electric resistance welded steel pipe for hardening use suppressing the formation of scale to the inside of the plating layer while performing hot forming and an Al plated hollow member using that Al plated electric resistance welded steel pipe, wherein the Al plated electric resistance welded steel pipe for hardening use is comprised of a base material made of a tubular steel plate and having a predetermined chemical composition and an electric resistance welded zone provided at a seam portion of the steel plate and extending in a longitudinal direction of the steel plate, the base material is further provided with an intermetallic compound layer positioned on the surface of the steel plate and including an Al—Fe—Si-based intermetallic compound and an Al plating layer positioned on the surface of the intermetallic compound layer and containing Al and Si, and 70×X/D≤Y/t≤30 is satisfied, wherein X (μm) is a thickness of the intermetallic compound layer, Y (μm) is a thickness of the Al plating layer, t (mm) is a pipe thickness of the steel pipe, and D (mm) is an outside diameter of the steel pipe.
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公开(公告)号:US20230387430A1
公开(公告)日:2023-11-30
申请号:US17604490
申请日:2021-04-19
发明人: WooChul JUNG , Jinwook KIM , Donghwan OH
IPC分类号: H01M8/04082 , C25D3/12 , C25D7/04 , C25D9/06
CPC分类号: H01M8/04201 , C25D3/12 , C25D7/04 , C25D9/06 , H01M8/1246
摘要: A composite coating layer for a solid oxide fuel cell member according to the present disclosure includes a nickel layer that coats at least a portion of the surface of the solid oxide fuel cell member, and a lanthanum oxide layer that coats at least a portion of the surface of the nickel layer, and thereby, has an effect of suppressing the volatilization of chromium from the solid oxide fuel cell member even under high temperature and long-term conditions.
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8.
公开(公告)号:US20220396893A1
公开(公告)日:2022-12-15
申请号:US17678841
申请日:2022-02-23
申请人: MODUMETAL, Inc.
摘要: Provided herein are tubular articles comprising electrodeposited nano- or microlaminate coatings, which have improved heat, wear, and corrosion resistance. The present disclosure further provides apparatuses, systems, and methods for the electrodeposition of such coatings on tubular workpieces using fixed or dynamic electrical contact points.
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公开(公告)号:US11505873B2
公开(公告)日:2022-11-22
申请号:US16631739
申请日:2018-07-25
发明人: Shan Hua Jin , An Na Lee , Seung Min Kim
IPC分类号: C25D7/04 , C25D1/04 , C25D3/38 , C25D5/34 , C25D5/48 , H01M4/13 , H01M4/66 , H01M10/052 , B32B15/01
摘要: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.
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公开(公告)号:US11492718B1
公开(公告)日:2022-11-08
申请号:US17583236
申请日:2022-01-25
发明人: Yao-Sheng Lai , Jui-Chang Chou
摘要: An electrodeposited copper foil includes a bulk copper foil. When a weight of the electrodeposited copper foil is increased to 105.0 wt % during a thermogravimetric analysis (TGA) performed on the electrodeposited copper foil at a heating rate of 5° C./min and an air flow rate of 95 mL/min, a heating temperature of the TGA is defined as T105.0 wt % and in a range of 550° C. to 750° C.
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