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    OIL-WELL METAL PIPE
    1.
    发明公开
    OIL-WELL METAL PIPE 审中-公开

    公开(公告)号：US20240352806A1

    公开(公告)日：2024-10-24

    申请号：US18683558

    申请日：2022-08-26

    申请人： NIPPON STEEL CORPORATION ,  VALLOUREC OIL AND GAS FRANCE

    发明人： Masahiro OSHIMA ,  Masanari KIMOTO ,  Alexandre ANTOINE ,  Daniel MUNOZ

    IPC分类号： E21B17/042 ,  C25D3/22 ,  C25D5/48 ,  C25D7/04

    CPC分类号： E21B17/042 ,  C25D3/22 ,  C25D5/48 ,  C25D7/04

    摘要： An oil-well metal pipe according to the present disclosure includes: a pipe main body that includes a pin which includes a pin contact surface including an external thread part and which is formed at a first end portion, and a box which includes a box contact surface including an internal thread part and which is formed at a second end portion; and a Zn—Ni alloy plating layer which is formed on at least one of the pin contact surface and the box contact surface. The X-ray diffraction intensities of the Zn—Ni alloy plating layer satisfy Formula (1).









    I
    18

    /

    (


    I
    18

    +

    I
    36

    +

    I
    54


    )


    ≥
    0.6




    (
    1
    )







    Here, in Formula (1), in units of cps, an X-ray diffraction intensity of {411} and {330} is substituted for I18, an X-ray diffraction intensity of {442} and {600} is substituted for I36, and an X-ray diffraction intensity of {552} is substituted for I54.

    SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING ELECTROCHEMICAL DEPOSITION
    3.
    发明公开
    SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING ELECTROCHEMICAL DEPOSITION 审中-公开

    公开(公告)号：US20240240347A1

    公开(公告)日：2024-07-18

    申请号：US18620603

    申请日：2024-03-28

    申请人： FABRIC8LABS, INC.

    发明人： David Pain ,  Kareem Shaik ,  Charles Pateros

    IPC分类号： C25D7/12 ,  C25D5/02 ,  C25D5/48 ,  C25D17/08 ,  C25D17/12 ,  C25D21/12 ,  H05K3/18 ,  H05K3/40

    CPC分类号： C25D7/123 ,  C25D5/02 ,  C25D5/48 ,  C25D17/08 ,  C25D17/12 ,  C25D21/12 ,  H05K3/188 ,  H05K3/4038

    摘要： A method of making an electrical component includes transmitting electrical energy from a power source through one or more deposition anodes, through an electrolyte solution, and to an intralayer electrical-connection feature of a build plate, such that material is electrochemically deposited onto the intralayer electrical-connection feature and forms an interlayer electrical-connection feature. The method also includes securing a dielectric material so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature and contacts and at least partially electrically insulates the interlayer electrical-connection feature. The method additionally includes depositing a seed layer onto the dielectric material and the interlayer electrical-connection feature, electrochemically depositing material onto the seed layer, to form at least one second intralayer electrical-connection feature of the electrical component, and removing any one or more portions of the seed layer onto which no portion of the at least one second intralayer electrical-connection feature is formed.

    Surface-treated copper foil and method for manufacturing same
    5.
    发明授权
    Surface-treated copper foil and method for manufacturing same 有权

    公开(公告)号：US11952675B2

    公开(公告)日：2024-04-09

    申请号：US17787847

    申请日：2020-11-10

    申请人： NIPPON DENKAI, LTD.

    发明人： Toshio Kawasaki ,  Yasuhiro Endo

    IPC分类号： C25D5/12 ,  C23C28/00 ,  C25D5/00 ,  C25D5/16 ,  C25D5/48 ,  C25D7/06 ,  H05K1/09 ,  H05K3/38

    CPC分类号： C25D5/12 ,  C23C28/30 ,  C25D5/16 ,  C25D5/48 ,  C25D5/605 ,  C25D7/0614 ,  H05K1/09 ,  H05K3/384 ,  Y10T428/12438

    摘要： Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

    SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERCONNECT
    6.
    发明公开
    SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERCONNECT 审中-公开

    公开(公告)号：US20240107680A1

    公开(公告)日：2024-03-28

    申请号：US17934415

    申请日：2022-09-22

    申请人： HSU-TUNG CHEN

    发明人： HSU-TUNG CHEN

    IPC分类号： H05K3/02 ,  C25D5/48 ,  H05K3/04 ,  H05K3/42

    CPC分类号： H05K3/027 ,  C25D5/48 ,  H05K3/04 ,  H05K3/423 ,  H05K2203/107

    摘要： A subtractive method for manufacturing a circuit board with fine interconnect includes steps of disposing a resist film on a metal layer on a surface of a wiring substrate, and performing a dry etching process to etch and penetrate the resist film and form a wiring pattern groove in the metal layer, the depth of the wiring pattern groove is less than the thickness of the first metal layer; further wet etching process is performed, and the metal layer is etched again from the wiring pattern groove to penetrate the metal layer to form wires in the metal layer, and finally the resist film is removed. By first using dry etching to form wiring pattern grooves in the metal layer, the thickness of the metal layer to be removed by wet etching is reduced, thereby reducing side etching generated by the wet etching process and improving the wiring quality.