公开(公告)号：US20240244757A1

公开(公告)日：2024-07-18

申请号：US18617516

申请日：2024-03-26

申请人： LongKai LI

发明人： LongKai LI

IPC分类号： H05K3/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/38

CPC分类号： H05K3/025 ,  H05K1/095 ,  H05K3/007 ,  H05K3/384 ,  H05K2201/0355

摘要： The present invention discloses a method for preparing a novel material layer structure of a high-frequency circuit board, comprising the steps of: (1) coating a synthetic liquid TFP film on a cured PI film; (2) delivering the same to a tunnel oven for roasting in sections to form a semi-cured TFP film on a front surface of the cured PI film; and (3) hot pressing a copper foil on the semi-cured TFP film to obtain a novel single-sided material layer structure of a high-frequency circuit board. The present invention also discloses a novel material layer structure of a high-frequency circuit board prepared by performing the above-mentioned method. The prepared novel material layer structure of the high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, and can adapt to the current high-frequency and high-speed trend from wireless network to terminal applications, especially for new 5G technology products. It can be used as a circuit board preparation material to manufacture a circuit board structure, such as a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft-hard combined board, which brings great convenience to subsequent preparation for the circuit board and simplifies the process.

公开(公告)号：US20240215172A1

公开(公告)日：2024-06-27

申请号：US18276590

申请日：2022-02-01

申请人： FUKUDA METAL FOIL & POWDER CO., LTD.

发明人： Takeshi OKAMOTO ,  Kenta MIYAMOTO

IPC分类号： H05K3/02 ,  H05K1/09 ,  H05K3/38

CPC分类号： H05K3/022 ,  H05K1/09 ,  H05K3/384 ,  H05K2201/0355

摘要： A surface-treated copper foil includes, on at least one surface of an untreated copper foil, a finely roughened layer formed of copper particles in which primary particles have a particle size of 10 nm to 110 nm or less, and a heat-resistant-treatment layer containing nickel and phosphorus, wherein a treated surface has a surface area ratio of 5.1 or more per 1 m2 of a two-dimensional area, the surface area ratio being calculated from a specific surface area measured by a krypton gas adsorption BET method, and a coating mass of the nickel is 2 mg or more per 1 m2 of a surface area.

公开(公告)号：US20230276579A1

公开(公告)日：2023-08-31

申请号：US18016090

申请日：2021-07-14

申请人： MITSUI MINING & SMELTING CO., LTD.

发明人： Daisuke NAKAJIMA ,  Shota KAWAGUCHI

IPC分类号： H05K3/38

CPC分类号： H05K3/386 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2201/015

摘要： Provided is a method for manufacturing a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin, which is a low dielectric constant thermoplastic resin, is used. This method includes providing a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one surface of the copper foil, and affixing a sheet-shaped fluororesin to the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by XPS, the content of Zn is 10 wt % or less, and the Zn/M weight ratio, the ratio of the content of Zn to the content of the transition element M, is 0.2 to 0.6.

公开(公告)号：US20230230929A1

公开(公告)日：2023-07-20

申请号：US17716184

申请日：2022-04-08

申请人： CHIA-MING LI ,  Guangdong ZECHENG Technology Co., LTD

发明人： CHIA-MING LI

IPC分类号： H01L23/538 ,  H05K3/38 ,  H05K3/46 ,  H05K1/11

CPC分类号： H01L23/5389 ,  H05K3/384 ,  H05K3/4652 ,  H05K1/115 ,  H05K2201/0355 ,  H05K2201/10674

摘要： A packaging process for embedded chips includes: (1) mounting at least one IC chip on a circuit substrate, the IC chip having at least one exposed pin; (2) attaching a self-adhesive copper foil film to the surface of the circuit substrate, wherein the self-adhesive copper foil film has a copper foil layer and a B-stage insulating adhesive layer, the copper foil layer has at least one to-be-opened copper foil area corresponding to the pin, the insulating adhesive layer is applied on the copper foil layer, has no glass fiber, covers the IC chip, and has at least one to-be-opened insulating adhesive area corresponding to the pin, and the pin is in contact with the insulating adhesive layer but not with the copper foil layer; (3) removing the to-be-opened copper foil area; (4) removing the to-be-opened insulating adhesive area with an etching solution; and (5) curing the insulating adhesive layer completely.

公开(公告)号：US20180264783A1

公开(公告)日：2018-09-20

申请号：US15761274

申请日：2016-09-23

申请人： JX Nippon Mining & Metals Corporation

发明人： Terumasa Moriyama ,  Masafumi Ishii

IPC分类号： B32B15/08 ,  B32B15/20 ,  C25D1/04 ,  C25D1/22 ,  C25D7/06 ,  C25D5/16 ,  H05K3/38 ,  H05K3/46

CPC分类号： B32B15/08 ,  B32B15/04 ,  B32B15/20 ,  C23C18/1605 ,  C23C18/38 ,  C25D1/04 ,  C25D1/22 ,  C25D3/38 ,  C25D3/562 ,  C25D5/16 ,  C25D7/0614 ,  C25D9/08 ,  H05K3/108 ,  H05K3/381 ,  H05K3/384 ,  H05K3/426 ,  H05K3/46 ,  H05K3/4661 ,  H05K2201/0355 ,  H05K2203/1152

摘要： Such a metal foil is provided that a release layer is provided on a metal foil to enable physical release of a resin substrate, to which the metal foil is adhered, and thereby in the step of removing the metal foil from the resin substrate, the metal foil can be removed with good cost without damaging the surface profile of the metal foil transferred to the surface of the resin substrate, and also resins having different resin components can be adhered with good adhesion. A metal foil containing, on at least one surface of the metal foil, surface unevenness having a root mean square height Sq of from 0.25 to 1.6 μm.

公开(公告)号：US10076032B2

公开(公告)日：2018-09-11

申请号：US15127165

申请日：2015-03-19

申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

发明人： Takashi Kasuga ,  Yoshio Oka ,  Shigeyoshi Nakayama ,  Jinjoo Park ,  Sumito Uehara ,  Kousuke Miura ,  Hiroshi Ueda

IPC分类号： H05K1/05 ,  H05K1/09 ,  H05K3/02 ,  H05K3/10 ,  H05K3/38

CPC分类号： H05K1/092 ,  H05K1/05 ,  H05K3/022 ,  H05K3/108 ,  H05K3/38 ,  H05K3/384 ,  H05K2201/0154 ,  H05K2201/0257 ,  H05K2203/0709 ,  H05K2203/072

摘要： A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm2 or more and 10 μg/cm2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.

公开(公告)号：US20180160529A1

公开(公告)日：2018-06-07

申请号：US15827056

申请日：2017-11-30

申请人： JX Nippon Mining & Metals Corporation

发明人： Hideta Arai ,  Ryo Fukuchi ,  Atsushi Miki

IPC分类号： H05K1/09 ,  H05K3/06

CPC分类号： H05K1/09 ,  H05K3/0035 ,  H05K3/007 ,  H05K3/06 ,  H05K3/384 ,  H05K3/4007 ,  H05K3/421 ,  H05K2201/0355

摘要： Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180° C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable.Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 μg/dm2 or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 μg/dm2 or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 μg/dm2 or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 μm or less.

公开(公告)号：US20160183380A1

公开(公告)日：2016-06-23

申请号：US14907478

申请日：2014-07-23

申请人： JX NIPPON MINING & METALS CORPORATION

发明人： MASAFUMI ISHII ,  MISATO HONDA ,  NOBUAKI MIYAMOTO

IPC分类号： H05K3/02 ,  H05K3/38 ,  B32B15/08 ,  H05K3/20

CPC分类号： H05K3/025 ,  B32B3/26 ,  B32B15/08 ,  B32B15/20 ,  B32B2457/08 ,  C23C18/1653 ,  C23C18/405 ,  C25D1/04 ,  C25D3/38 ,  C25D3/562 ,  C25D3/58 ,  C25D5/022 ,  C25D5/10 ,  C25D5/18 ,  C25D5/34 ,  C25D5/48 ,  C25D7/0614 ,  C25D7/0671 ,  H05K1/09 ,  H05K3/205 ,  H05K3/384 ,  H05K3/388 ,  H05K3/389 ,  H05K3/427 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K2203/0726 ,  H05K2203/1152

摘要： The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm.

摘要翻译： 本发明提供一种表面处理铜箔，其能够在除去铜箔之后赋予基板表面的轮廓形状，该轮廓形状保持精细的布线成形性并且实现令人满意的无电镀铜镀层的粘合。 本发明还提供一种树脂基板，其具有保持精细布线成形性的表面的轮廓形状，并且实现令人满意的无电镀铜镀层的粘附。 本发明的表面处理铜箔是在铜箔上形成表面处理层的表面处理铜箔，表面处理层的表面的表面粗糙度Sz为2〜6μm。

公开(公告)号：US20160174364A1

公开(公告)日：2016-06-16

申请号：US14970479

申请日：2015-12-15

申请人： Amphenol Corporation

发明人： Arthur E. Harkness, JR. ,  Eva M. Kenny-McDermott ,  Paul W. Farineau ,  Raymond A. Lavallee ,  Michael Fancher

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K3/38 ,  H05K3/46 ,  H05K3/00 ,  H05K3/22 ,  H05K1/03 ,  H05K1/11

CPC分类号： H05K3/4632 ,  H05K1/0242 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0073 ,  H05K3/202 ,  H05K3/22 ,  H05K3/38 ,  H05K3/382 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4658 ,  H05K3/4685 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/1194

摘要： High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

摘要翻译： 描述了用于印刷电路板的高速互连以及用于形成高速互连的方法。 高速互连可以包括具有减小的表面粗糙度的导电膜的区域和已经被处理以改善与相邻绝缘层的接合的一个或多个区域。 粗糙度降低的区域可用于在PCB内携带高数据速率信号。 用于粘合处理的区域可以包括粗糙表面，促进粘附的化学处理和/或沉积以提高表面的润湿性和/或对固化的绝缘体的粘附的材料。

公开(公告)号：US20150237741A1

公开(公告)日：2015-08-20

申请号：US14333734

申请日：2014-07-17

申请人： Samsung Electro-Mechanics Co., Ltd. ,  Korea Advanced Institute of Science and Technology

发明人： Yong Jin PARK ,  Sung Gap Im ,  Young Gwan Ko ,  Jae Bum You ,  Shin Young Kim

IPC分类号： H05K3/38 ,  H05K3/10 ,  H05K1/09

CPC分类号： B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B2307/206 ,  B32B2457/08 ,  C09J133/14 ,  H05K3/384 ,  H05K3/386 ,  H05K3/387 ,  H05K2201/0145 ,  H05K2201/0154

摘要： There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board (PCB) includes an adhesive film disposed between an insulating layer and a circuit pattern, wherein the adhesive film includes poly(glycidyl methacrylate). The printed circuit board may include the adhesive film between the circuit pattern and the insulating layer, and thus, adhesive strength may be increased, while having a low roughness value, a fine circuit pattern may be formed, and reliability thereof may be enhanced.

摘要翻译： 提供了印刷电路板及其制造方法。 印刷电路板（PCB）包括设置在绝缘层和电路图案之间的粘合膜，其中粘合膜包括聚（甲基丙烯酸缩水甘油酯）。 印刷电路板可以包括电路图案和绝缘层之间的粘合膜，因此，可以增加粘合强度，同时具有低粗糙度值，可以形成精细电路图案，并且可以提高其可靠性。