公开(公告)号：US20240206060A1

公开(公告)日：2024-06-20

申请号：US18586832

申请日：2024-02-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke TAKADA ,  Michiharu NISHIMURA

IPC: H05K1/03 ,  B32B3/26 ,  B32B27/08 ,  C08J5/04 ,  C08J5/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0346 ,  B32B3/263 ,  B32B27/08 ,  C08J5/04 ,  C08J5/18 ,  H05K1/0271 ,  H05K1/034 ,  H05K1/0353 ,  H05K1/0373 ,  H05K3/4626 ,  C08J2325/04 ,  C08J2327/12 ,  C08J2365/00 ,  H05K1/118 ,  H05K2201/0141 ,  H05K2201/068 ,  H05K2203/065

Abstract: A resin sheet that contains one or more kinds of resin materials and a liquid crystal polymer, wherein a weight of the liquid crystal polymer is less than a total weight of the one or more kinds of resin materials. The resin sheet has a thermal expansion coefficient in a plane direction smaller than a thermal expansion coefficient in the plane direction of a comparative resin sheet containing the one or more kinds of resin materials and not containing the liquid crystal polymer.

公开(公告)号：USRE49929E1

公开(公告)日：2024-04-16

申请号：US17528405

申请日：2021-11-17

Applicant: Sumitomo Electric Industries, Ltd. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Shingo Kaimori ,  Masaaki Yamauchi ,  Kentaro Okamoto ,  Satoshi Kiya ,  Kazuo Murata

IPC: H05K1/03 ,  B32B15/08 ,  B32B15/082 ,  B32B15/20 ,  B32B27/20 ,  B32B27/30 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/38

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B15/082 ,  B32B15/20 ,  B32B27/20 ,  B32B27/30 ,  H05K1/0271 ,  H05K1/03 ,  H05K1/034 ,  H05K1/09 ,  H05K3/0055 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/1194

Abstract: A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 μm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.

公开(公告)号：US20230242705A1

公开(公告)日：2023-08-03

申请号：US18296080

申请日：2023-04-05

Applicant: AJINOMOTO CO., INC.

Inventor： Ichiro OGURA

IPC: C08G59/42 ,  C08G59/62 ,  C08G59/18 ,  C08J5/18 ,  C09D163/00 ,  C07C69/78 ,  H01L23/29 ,  H05K1/03 ,  H01L23/00

CPC classification number: C08G59/4223 ,  C08G59/621 ,  C08G59/182 ,  C08J5/18 ,  C09D163/00 ,  C07C69/78 ,  H01L23/295 ,  H01L23/293 ,  H05K1/0373 ,  H05K1/034 ,  H01L24/29 ,  C08J2363/00 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/29388 ,  H01L2924/05442 ,  H01L2224/29387 ,  H01L2224/2919 ,  H05K2201/0209 ,  H01L2924/062 ,  H01L2924/095

Abstract: Compounds including two or more aromatic rings to which a fluorine-substituted arylcarbonyloxy group is directly bonded are useful as epoxy resin curing agents.

公开(公告)号：US11665823B2

公开(公告)日：2023-05-30

申请号：US16875599

申请日：2020-05-15

Applicant: Ian J. Forster

Inventor： Ian J. Forster

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K1/16 ,  H05K1/09 ,  H05K1/02 ,  H05K1/05 ,  H05K1/03 ,  G11C11/14 ,  H03H9/02 ,  H03H9/05

CPC classification number: H05K1/16 ,  G11C11/14 ,  H05K1/0233 ,  H05K1/034 ,  H05K1/0306 ,  H05K1/05 ,  H05K1/09 ,  H03H9/02551 ,  H03H9/02559 ,  H03H9/0542 ,  H05K2201/015 ,  H05K2201/083 ,  H05K2201/086 ,  H05K2201/10083 ,  H05K2201/10265

Abstract: A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.

公开(公告)号：US20170238991A1

公开(公告)日：2017-08-24

申请号：US15050102

申请日：2016-02-22

Applicant: Ethicon Endo-Surgery, LLC

Inventor： Barry C. Worrell ,  David C. Yates ,  Joseph D. Dennis ,  Mark A. Davison ,  Geoffrey S. Strobl

IPC: A61B18/14 ,  H05K3/06 ,  H05K1/03 ,  H05K1/09 ,  H05K1/02 ,  H05K3/00 ,  H05K3/10

CPC classification number: A61B18/1445 ,  A61B5/1459 ,  A61B18/085 ,  A61B18/1233 ,  A61B2017/00017 ,  A61B2017/00022 ,  A61B2017/00026 ,  A61B2017/00084 ,  A61B2017/00398 ,  A61B2017/00526 ,  A61B2018/00005 ,  A61B2018/00077 ,  A61B2018/00083 ,  A61B2018/00101 ,  A61B2018/0013 ,  A61B2018/00136 ,  A61B2018/00178 ,  A61B2018/00345 ,  A61B2018/00529 ,  A61B2018/00601 ,  A61B2018/00607 ,  A61B2018/00613 ,  A61B2018/0063 ,  A61B2018/00654 ,  A61B2018/00666 ,  A61B2018/00702 ,  A61B2018/00767 ,  A61B2018/00779 ,  A61B2018/00815 ,  A61B2018/00821 ,  A61B2018/00875 ,  A61B2018/00892 ,  A61B2018/00898 ,  A61B2018/00922 ,  A61B2018/00946 ,  A61B2018/00958 ,  A61B2018/0097 ,  A61B2018/1455 ,  A61B2018/1465 ,  A61B2018/147 ,  A61B2018/1495 ,  A61B2090/034 ,  A61B2090/061 ,  A61B2090/065 ,  A61B2090/067 ,  A61B2505/05 ,  A61B2562/12 ,  A61B2562/164 ,  H05K1/028 ,  H05K1/0313 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/061 ,  H05K3/10 ,  H05K2201/0154 ,  H05K2201/05

Abstract: The disclosure provides a method of manufacturing a flexible circuit electrode assembly and an apparatus manufactured by said method. According to the method, an electrically conductive sheet is laminated to an electrically insulative sheet. An electrode is formed on the electrically conductive sheet. An electrically insulative layer is formed on a tissue contacting surface of the electrode. The individual electrodes are separated from the laminated electrically insulative sheet and the electrically conductive sheet. In another method, a flexible circuit is vacuum formed to create a desired profile. The vacuum formed flexible circuit is trimmed. The trimmed vacuum formed flexible circuit is attached to a jaw member of a clamp jaw assembly.

公开(公告)号：US20170118837A1

公开(公告)日：2017-04-27

申请号：US15311601

申请日：2015-05-12

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Kousuke MIURA ,  Satoshi KIYA ,  Sumito UEHARA

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/09 ,  H05K3/40 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/0313 ,  H05K1/034 ,  H05K1/09 ,  H05K3/381 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4661 ,  H05K2201/09509 ,  H05K2203/072

Abstract: An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.

公开(公告)号：US20160250830A1

公开(公告)日：2016-09-01

申请号：US15027323

申请日：2014-10-08

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Satoshi KIYA ,  Sumito UEHARA ,  Kousuke MIURA ,  Makoto NAKABAYASHI

IPC: B32B27/32 ,  H05K3/38 ,  H05K1/02 ,  H05K3/20 ,  B32B7/12 ,  H05K1/03

CPC classification number: B32B27/322 ,  B32B7/12 ,  B32B27/30 ,  B32B2457/08 ,  H05K1/024 ,  H05K1/0274 ,  H05K1/034 ,  H05K1/0366 ,  H05K3/007 ,  H05K3/067 ,  H05K3/20 ,  H05K3/281 ,  H05K3/285 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0326 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0264 ,  H05K2203/0278 ,  H05K2203/0376 ,  H05K2203/0769 ,  H05K2203/1173

Abstract: A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.

Abstract translation: 含氟树脂作为主要成分的氟树脂基材在其表面的至少部分区域上具有改性层，所述改性层含有硅氧烷键和亲水性有机官能团，所述改性层的表面具有接触角 90°以下。

公开(公告)号：US20160145371A1

公开(公告)日：2016-05-26

申请号：US14549729

申请日：2014-11-21

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Timothy C. Mauldin

IPC: C08F299/00 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02

CPC classification number: C08F299/00 ,  C08F232/02 ,  C08J3/24 ,  C08J2343/04 ,  H05K1/034 ,  H05K1/0366 ,  H05K3/0011 ,  H05K3/46 ,  H05K3/4602

Abstract: An AB-type block copolymer for use in printed circuit board (PCB) fabrication is provided having a structure represented by the following formula: wherein R1 is a silane pendant group that includes a silicon-containing moiety capable of bonding to a glass surface, and wherein R2 is a matrix-reactive pendant group that includes at least one moiety (e.g., a vinyl-, allyl-, amine-, amide- or epoxy-containing moiety) capable of reacting with a base polymer.

Abstract translation: 提供了一种用于印刷电路板（PCB）制造的AB型嵌段共聚物，其具有由下式表示的结构：其中R1是包含能够结合到玻璃表面的含硅部分的硅烷侧基，以及 其中R2是包含能够与基础聚合物反应的至少一个部分（例如，含乙烯基，烯丙基，胺，酰胺或环氧基的部分）的基质反应性侧基。

公开(公告)号：US20160141773A1

公开(公告)日：2016-05-19

申请号：US14542442

申请日：2014-11-14

Applicant: THE BOEING COMPANY

Inventor： Jonathan Emrys

IPC: H01R11/01 ,  H01B13/004 ,  H01B13/06 ,  H01R43/20 ,  H01R43/26 ,  H05K1/02 ,  H01B7/16 ,  H01R12/75 ,  H05K5/02 ,  H01B7/18 ,  H01B3/30 ,  H01B1/02 ,  H05K1/03 ,  H05K1/09 ,  H02G1/06 ,  H05K3/10

CPC classification number: H01R11/01 ,  B29C70/865 ,  B64D2221/00 ,  H01B1/026 ,  H01B3/307 ,  H01B7/0045 ,  H01B7/16 ,  H01B7/18 ,  H01B13/004 ,  H01B13/06 ,  H01R12/75 ,  H01R43/205 ,  H01R43/26 ,  H02G1/06 ,  H02G3/04 ,  H05K1/0296 ,  H05K1/034 ,  H05K1/09 ,  H05K3/101 ,  H05K5/0247 ,  Y02T50/43

Abstract: An electrical wiring system comprises a plurality of electrical conduits, each of which comprises a plurality of electrically conductive wires, a carrier encapsulating and electrically insulating the wires from each other, the carrier being composed of a rigid material, and at least connector carried by the carrier in electrical communication with the wires. The electrical wiring system further comprises a junction box comprising a plurality of interconnecting wires and a plurality of connectors electrically coupled together by the interconnecting wires. The plurality of connectors of the junction box are coupled to the plurality connectors of the electrical conduits.

Abstract translation: 一种电气布线系统包括多个电导管，每个电导管包括多个导电导线，一个将电线彼此封装并电绝缘的载体，载体由刚性材料组成，至少连接器由 与电线电气通信的载体。 电气接线系统还包括一个接线盒，该接线盒包括多个互连线，以及通过互连线电连接在一起的多个连接器。 接线盒的多个连接器耦合到电气导管的多个连接器。

公开(公告)号：US20160007473A1

公开(公告)日：2016-01-07

申请号：US14333837

申请日：2014-07-17

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： Sameh Dardona ,  Wayde R. Schmidt ,  Slade R. Culp

IPC: H05K3/00 ,  H05K3/12 ,  H05K1/16

CPC classification number: H05K1/167 ,  B29C61/003 ,  B29C61/02 ,  B29K2025/06 ,  H01L21/4867 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/032 ,  H05K1/034 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0125 ,  H05K2201/0162 ,  H05K2201/083 ,  H05K2203/0271 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1194 ,  H01L2924/00

Abstract: A method for fabricating printed electronics and optical components includes printing a trace of electrically conductive, semiconductive or insulating material on a substrate and shrinking the substrate to a target size. The material can include an ink, solution, dispersion, powder, slurry, paste or the like. The step of shrinking can include heating the substrate at a predetermined temperature based on properties of the substrate. The step of shrinking can also include heating the substrate for a predetermined duration based on properties of the substrate. The step of shrinking can also include releasing an external electrical potential used to stretch the substrate during printing. For example, the substrate may decrease in area by at least fifty percent during heating.

Abstract translation: 制造印刷电子学和光学部件的方法包括在衬底上印刷导电，半导体或绝缘材料迹线，并将衬底收缩到目标尺寸。 该材料可以包括油墨，溶液，分散体，粉末，浆料，糊剂等。 收缩的步骤可以包括基于基底的性质在预定温度下加热基底。 收缩步骤还可以包括基于基底的性质将衬底加热预定的持续时间。 收缩的步骤还可以包括在印刷期间释放用于拉伸基板的外部电位。 例如，在加热过程中，衬底的面积减少至少百分之五十。