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1.发明申请公开(公告)号：US20170127516A1
公开(公告)日：2017-05-04
申请号：US15127165
申请日：2015-03-19
发明人： Takashi KASUGA , Yoshio OKA , Shigeyoshi NAKAYAMA , Jinjoo PARK , Sumito UEHARA , Kousuke MIURA , Hiroshi UEDA
CPC分类号： H05K1/092 , H05K1/05 , H05K3/022 , H05K3/108 , H05K3/38 , H05K3/384 , H05K2201/0154 , H05K2201/0257 , H05K2203/0709 , H05K2203/072
摘要： A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm2 or more and 10 μg/cm2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.
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2.发明申请公开(公告)号：US20170099732A1
公开(公告)日：2017-04-06
申请号：US15127203
申请日：2015-03-26
发明人： Takashi KASUGA , Yoshio OKA , Jinjoo PARK , Sumito UEHARA , Kousuke MIURA , Hiroshi UEDA
CPC分类号： H05K1/097 , H05K1/092 , H05K3/12 , H05K3/246 , H05K3/4069 , H05K2201/032
摘要： A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. The metal particles preferably have a mean particle size of 1 nm or more and 500 nm or less.
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3.发明申请公开(公告)号：US20170327630A1
公开(公告)日：2017-11-16
申请号：US15520135
申请日：2015-10-13
发明人： Satoshi KIYA , Sumito UEHARA , Kousuke MIURA
CPC分类号： C08G59/30 , B32B27/30 , B32B27/38 , C08J7/12 , C08J7/123 , C08J7/16 , C08J2327/12 , C09J163/00 , H05K3/1208 , H05K3/26 , H05K3/281 , H05K3/285 , H05K3/38 , H05K3/381 , H05K3/386 , H05K2201/0129 , H05K2201/015
摘要： A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated on the pre-treated surface. A printed wiring board includes an insulating base layer, a conductive pattern laminated on at least one surface of the base layer, and the coverlay for a printed wiring board, the coverlay being laminated on the conductive pattern.
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4.发明申请公开(公告)号：US20170290150A1
公开(公告)日：2017-10-05
申请号：US15505619
申请日：2015-09-08
发明人： Takashi KASUGA , Yoshio OKA , Shigeaki UEMURA , Shigeyoshi NAKAYAMA , Jinjoo PARK , Sumito UEHARA , Hiroshi UEDA , Kousuke MIURA
CPC分类号： H05K1/092 , B22F1/0018 , B22F1/0059 , B22F3/16 , B22F7/064 , B22F2998/10 , B22F2999/00 , C09D11/037 , C09D11/10 , C09D11/52 , C23C18/1653 , C23C18/1692 , C23C18/1879 , C23C18/2033 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/31 , C23C18/32 , C23C18/405 , C23C18/42 , H05K1/097 , H05K3/02 , H05K3/022 , H05K3/108 , H05K3/18 , H05K3/381 , H05K3/4661 , H05K2201/032 , H05K2203/0703 , H05K2203/1105 , C22C1/0425 , B22F7/08 , B22F1/0074 , C23C18/00 , B22F2003/248 , C25D7/00
摘要： The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.
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公开(公告)号：US20170118837A1
公开(公告)日：2017-04-27
申请号：US15311601
申请日：2015-05-12
发明人： Kousuke MIURA , Satoshi KIYA , Sumito UEHARA
CPC分类号： H05K1/115 , H05K1/0313 , H05K1/034 , H05K1/09 , H05K3/381 , H05K3/4084 , H05K3/423 , H05K3/429 , H05K3/4611 , H05K3/4661 , H05K2201/09509 , H05K2203/072
摘要： An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.
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公开(公告)号：US20160250830A1
公开(公告)日：2016-09-01
申请号：US15027323
申请日：2014-10-08
发明人： Satoshi KIYA , Sumito UEHARA , Kousuke MIURA , Makoto NAKABAYASHI
CPC分类号： B32B27/322 , B32B7/12 , B32B27/30 , B32B2457/08 , H05K1/024 , H05K1/0274 , H05K1/034 , H05K1/0366 , H05K3/007 , H05K3/067 , H05K3/20 , H05K3/281 , H05K3/285 , H05K3/386 , H05K3/389 , H05K2201/0108 , H05K2201/015 , H05K2201/0158 , H05K2201/0191 , H05K2201/0195 , H05K2201/0326 , H05K2201/09781 , H05K2201/2009 , H05K2203/0264 , H05K2203/0278 , H05K2203/0376 , H05K2203/0769 , H05K2203/1173
摘要： A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.
摘要翻译： 含氟树脂作为主要成分的氟树脂基材在其表面的至少部分区域上具有改性层，所述改性层含有硅氧烷键和亲水性有机官能团，所述改性层的表面具有接触角 90°以下。
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